Patents Represented by Attorney S. Matthew Cairns
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Patent number: 6926922Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.Type: GrantFiled: April 7, 2003Date of Patent: August 9, 2005Assignee: Shipley Company, L.L.C.Inventors: Mei Kiu Leung, Willetta Lai, Pit Kai Peter Cheng, Cecilia Po Sze Wong
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Patent number: 6903175Abstract: Disclosed are methods of preparing solution polymers and compositions derived therefrom.Type: GrantFiled: September 22, 2001Date of Patent: June 7, 2005Assignee: Shipley Company, L.L.C.Inventors: Robert H. Gore, Michael K. Gallagher, Yujian You
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Patent number: 6881319Abstract: Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the copper layer on the resulting composite material from forming aggregation and, when the plating is intended to fill vias, make it possible to achieve the via-filling without voids. The present invention also relates to a method for controlling the electrolytic copper plating solution by using an amount of a specific decomposition product of the sulfur-containing compound as an index.Type: GrantFiled: December 20, 2001Date of Patent: April 19, 2005Assignee: Shipley Company, L.L.C.Inventors: Masaru Seita, Hideki Tsuchida, Shinjiro Hayashi
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Patent number: 6878500Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.Type: GrantFiled: April 5, 2003Date of Patent: April 12, 2005Assignee: Marlborough,Inventors: Edward W. Rutter, Jr., Cuong Manh Tran, Edward C. Orr
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Patent number: 6869484Abstract: A continuous feed coater for coating a length of substrate with vaporized or sprayed material, is disclosed. A specific example is a roll-to-roll coater which includes two lower supply rollers for supporting two webs of uncoated material, and two upper take-up rollers for supporting the webs after they are coated. A central web-support forms a plenum that acts as a deposition chimney or chamber by bringing the two webs into close proximity to each other to form two large walls of the plenum. The ends of the webs are sealed using side dams to form the chimney with a rectangular cross section such that the vapor cannot exit from the edges of the material. The vaporized coating constituents to be deposited on the rolled material are directed into the deposition plenum from a coating material supply source located at the bottom of the plenum, and are exhausted through the top of the plenum.Type: GrantFiled: September 15, 2001Date of Patent: March 22, 2005Assignee: Shipley Company, L.L.C.Inventors: Andrew T. Hunt, Wayne Neilson, Miodrag Oljaca, Edward J. Reardon, Tzyy-Jiuan Jan Hwang, William D. Danielson, Jr., James D. Huggins, David E. Bane, Ian H. Campbell, Yibin Xue
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Patent number: 6857543Abstract: A method for dispensing a chemical solution in the small-scale manufacture of semiconductors is provided. The method includes associating a dispensing unit with a semiconductor coat/develop track machine and a pneumatic syringe of a chemical solution with the dispensing unit. A dispensing pressure is applied to the pneumatic syringe. The flow control diaphragm is opened to allow the dispensing pressure to drive the chemical solution from the dispensing nozzle, while the drip prevention diaphragm is moved from a first position to a second position. The flow control diaphragm is closed to prevent the dispensing pressure from driving the chemical solution from the dispensing nozzle, while the drip prevention diaphragm is returned to the first position to generate a suck-back force in the flow path at the dispensing nozzle.Type: GrantFiled: November 27, 2002Date of Patent: February 22, 2005Assignee: Shipley Company, L.L.C.Inventors: Karen Kvam, James B. Wickman
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Patent number: 6858122Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.Type: GrantFiled: December 27, 2002Date of Patent: February 22, 2005Assignee: Shipley Company, L.L.C.Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu
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Patent number: 6852211Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.Type: GrantFiled: December 27, 2002Date of Patent: February 8, 2005Assignee: Shipley Company, L.L.C.Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu
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Patent number: 6852367Abstract: Disclosed are stable organo polysilica resin composition containing a B-staged organo polysilica resin and an organic acid, methods of stabilizing such B-staged organo polysilica resin compositions and methods of manufacturing electronic devices using such stable compositions.Type: GrantFiled: July 12, 2002Date of Patent: February 8, 2005Assignee: Shipley Company, L.L.C.Inventors: Yujian You, Robert H. Gore, Michael K. Gallagher
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Patent number: 6846370Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent or iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.Type: GrantFiled: July 3, 2002Date of Patent: January 25, 2005Assignee: Shipley Company, L.L.C.Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
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Patent number: 6835294Abstract: Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.Type: GrantFiled: June 7, 2002Date of Patent: December 28, 2004Assignee: Shipley Company, L.L.C.Inventors: Hideki Tsuchida, Masaru Kusaka, Shinjiro Hayashi
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Patent number: 6827839Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.Type: GrantFiled: November 2, 2001Date of Patent: December 7, 2004Assignee: Shipley Company, L.L.C.Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
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Patent number: 6824665Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.Type: GrantFiled: October 17, 2001Date of Patent: November 30, 2004Assignee: Shipley Company, L.L.C.Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
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Patent number: 6819540Abstract: Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.Type: GrantFiled: October 10, 2002Date of Patent: November 16, 2004Assignee: Shipley Company, L.L.C.Inventors: Craig S. Allen, Maria Anna Rzeznik, David L. Jacques
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Patent number: 6797146Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.Type: GrantFiled: November 2, 2001Date of Patent: September 28, 2004Assignee: Shipley Company, L.L.C.Inventors: Denis Morrissey, Jeffrey M. Calvert, Robert D. Mikkola
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Patent number: 6787601Abstract: Disclosed is a method of preparing emulsion polymers and a method of preparing porous dielectric materials using the emulsion polymers.Type: GrantFiled: September 22, 2001Date of Patent: September 7, 2004Assignee: Shipley Company, L.L.C.Inventors: Angelo A. Lamola, Robert M. Blankenship
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Patent number: 6781506Abstract: Disclosed is a resistor structure for embedding in a dielectric material including a thin film resistive material disposed on a surface of a conductive layer wherein the surface has an isotropic surface roughness having a Rz (din) value of 3 to 10 &mgr;m and a peak-to-peak wavelength of 2 to 20 &mgr;m.Type: GrantFiled: January 13, 2003Date of Patent: August 24, 2004Assignee: Shipley Company, L.L.C.Inventors: John Schemenaur, Rajan Hariharan, Marc Langlois, Craig S. Allen
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Patent number: 6776828Abstract: Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.Type: GrantFiled: October 24, 2002Date of Patent: August 17, 2004Assignee: Shipley Company, L.L.C.Inventors: Miriana Kanzler, Michael P. Toben
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Patent number: 6770769Abstract: Trialkylindium compounds are prepared by reacting indium trihalide with a trialkylaluminum compound in the presence of a fluoride salt, wherein the molar ratio of the indium trihalide to the fluoride salt is at least 1:4.5. Such trialkylindium compounds are particularly suitable for use in metalorganic vapor phase epitaxy.Type: GrantFiled: April 5, 2003Date of Patent: August 3, 2004Assignee: Shipley Company, L.L.C.Inventors: Deodatta Vinayak Shenai-Khatkhate, Michael Brendan Power, Ronald L. DiCarlo, Jr.
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Patent number: 6761814Abstract: A via filling method that provides superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse electrolysis, is in the range of 1/1 to 1/10 in a PPR electric current method applied with a cycle wherein the forward electrolysis interval is from 1 to 50 msec and the reverse electrolysis interval is from 0.2 to 5 msec.Type: GrantFiled: December 20, 2002Date of Patent: July 13, 2004Assignee: Shipley Company, L.L.C.Inventors: Masaru Kusaka, Hideki Tsuchida