Patents Represented by Attorney S. Matthew Cairns

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  • Aperture fill
    Patent number: 6749765
    Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: June 15, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
  • Method and system for facilitating viewer navigation through online information relating to chemical products
    Patent number: 6745179
    Abstract: A system for facilitating viewer navigation through online information relating to chemical products is provided. The system includes a server in communication with at least one database; a link to an order fulfillment system; a link to a payment processing system; and a rink to a client system. The system is executing web server and application server software; a commerce tool for ordering one or more chemical products; database management and security tools; and a navigation tool. The navigation tool includes a user interface displaying objects relating to the chemical products in a form of a periodic table. Each objects is linked to information or services concerning the chemical products and each object is represented as an abbreviation of a function provided by the navigation tool.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: June 1, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Joshua N. Laronge, Rajan Narayanan, David P. Planchet
  • Method for manufacturing copper-resin composite material
    Patent number: 6740425
    Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: May 25, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Yoshihiro Sugita
  • Electroless gold plating bath and method
    Patent number: 6736886
    Abstract: Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Kazuyuki Suda, Yasuo Ohta, Yasushi Takizawa
  • Photodefinable composition, method of manufacturing an optical waveguide with the photodefinable composition, and optical waveguide formed therefrom
    Patent number: 6731857
    Abstract: Provided are photodefinable compositions. The compositions include a silsesquioxane oligomer that has polymerized units of the formula (RSiO1.5), wherein R is selected from hydroxyphenyl or hydroxybenzy, and a photoactive component. The solubility of the silsesquioxane oligomer is altered upon exposure to actinic radiation. Also provided are methods of manufacturing optical waveguides, optical waveguides and electronic devices.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: May 4, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, Matthew L. Moynihan
  • Formation of thin film capacitors
    Patent number: 6728092
    Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: April 27, 2004
    Assignee: Shipley-Company, L.L.C.
    Inventors: Andrew T. Hunt, Tzyy Jiuan Hwang, Helmut G. Hornis, Wen-Yi Lin
  • Particles and a process for preparing the same
    Patent number: 6719932
    Abstract: Disclosed are a plurality of particles having a narrow particle size distribution, a processes for forming the same, and films containing the same. The plurality of particles, includes one or more discrete polymer shells, wherein at least one of the polymer shells is crosslinked with at least one monomer containing two or more double bonds polymerizable by free radical means; and a core material encased in the polymer shells, wherein the plurality of particles have a polydispersity of from 1.3 to 1.0.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: April 13, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Richard Roy Clikeman, Morris Christopher Wills, Katerina Elizabeth Dukes
  • Seed repair and electroplating bath
    Patent number: 6682642
    Abstract: Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: January 27, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert A. Mikkola, Jeffrey M. Calvert
  • Virtual training
    Patent number: 6679703
    Abstract: A system and method for providing training in a technical field to a student is provided and includes at least one educational institution that provides an educational program. Also included is at least one industry education provider that provides a training program in a technical field. An online education provider is also included wherein the online education provider is in communications with the at least one educational institution and the at least one industry education provider. The online education provider provides to the student a composite educational program including the educational program and the training program in said technical field.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: January 20, 2004
    Assignee: Shipley Company, L.L.C.
    Inventor: Eric R. Alling
  • Organoindium compounds
    Patent number: 6680397
    Abstract: Disclosed are trialkylindium compounds containing two bulky alkyl groups that are liquids or easily liquefiable solids and have sufficient vapor pressure for use in vapor deposition processes, as well as methods of depositing indium containing films using such compounds.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: January 20, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Deodatta Vinayak Shenai-Khatkhate, Ronald L. DiCarlo, Jr.
  • Method of electrodepositing copper
    Patent number: 6679983
    Abstract: Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: January 20, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, Robert D. Mikkola, Jeffrey M. Calvert
  • Plating catalysts and electronic packaging substrates plated therewith
    Patent number: 6680273
    Abstract: Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: January 20, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin T. Goosey, Narinder Singh Bains
  • Method of reducing defects
    Patent number: 6670107
    Abstract: Disclosed are methods for the reduction of defects during the manufacture of electronic devices. Also disclosed are electronic devices having reduced numbers of defects.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: December 30, 2003
    Assignee: Shipley Company, L.L.C.
    Inventor: Joseph F. Lachowski
  • Electronic device manufacture
    Patent number: 6667147
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: December 23, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Seed layer
    Patent number: 6660154
    Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Trialkyl Group VA metal compounds
    Patent number: 6660874
    Abstract: Disclosed are methods of preparing trialkyl Group VA metal compounds in high yield and high purity. Such trialkyl Group VA metal compounds are substantially free of oxygenated impurities, ethereal solvents and metallic impurities.
    Type: Grant
    Filed: April 6, 2002
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Deodatta V. Shenai-Khatkhate, Michael B. Power, Artashes Amamchyan
  • Seed layer repair bath
    Patent number: 6660153
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Dielectric structure
    Patent number: 6661642
    Abstract: Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Craig S. Allen, Maria Anna Rzeznik, S. Matthew Cairns
  • Stripper
    Patent number: 6660460
    Abstract: Compositions suitable for removing photoresist, probing ink and wafer bonding adhesive from a substrate containing one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds are provided. Such compositions show reduced metal corrosion, low toxicity and rapid removal rates of both photoresists and probing inks.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventor: Javad J. Sahbari
  • Electroplating method
    Patent number: 6649038
    Abstract: Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.
    Type: Grant
    Filed: October 13, 2001
    Date of Patent: November 18, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert D. Mikkola, Jeffrey M. Calvert, Denis Morrissey