Abstract: A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.

Abstract: A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source contacts. A bridged source plate interconnection has a bridge portion, valley portions disposed on either side of the bridge portion, plane portions disposed on either side of the valley portions and the bridge portion, and a connection portion depending from one of the plane portions, the bridged source plate interconnection connecting the source lead with the plurality of metalized source contacts. The bridge portion is disposed in a plane above the plane of the valley portions while the plane portions are disposed in a plane intermediate the plane of the bridge portion and the plane of the valley portions.

Abstract: A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.

Abstract: A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.

Abstract: A method for handing off a connection of a mobile device from a first access point to a second access point in an Internet Protocol-based multimedia mobile network includes the steps of scanning the network for available access points, comparing a connection strength of each available access point to a pre-determined margin, authenticating access points determined to be above the pre-determined margin, adding the authenticated access points to an association table; checking a connection strength to the first access point to the pre-determined margin, selecting an authenticated access point as the second access point if the connection strength to the first access point is below the pre-determined margin, and removing the first access point from the association table.

Abstract: A computer controlled user display interface with a tree that has a plurality of nodes to represent table records in relational databases, and the parent-child arrangements between those nodes to represent relationships between the table records. The nodes can either represent one record or a list of records from a table. A user can select the expand icon in front of a node representing one record to display all its related records as sub-nodes of this node. The related records are defined either by foreign key constraints or user-defined table relationships. The system also includes an implementation to generate search queries dynamically based on the table relationships. A preferred display layout will also include a grid next to the tree to display the table records with complete data for all columns when a user selects a tree node.

Abstract: A DFN semiconductor package is disclosed. The package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.

Abstract: A stacked dual MOSFET package is disclosed.

Abstract: A flip chip mounted semiconductor device package having a dimpled leadframe is disclosed. The semiconductor device package includes a leadframe having a plurality of source dimples and a gate dimple, and a semiconductor die having a plurality of source contact areas and a gate contact area corresponding to the leadframe source dimples and gate dimple respectively, the semiconductor die being flipped onto the leadframe such that cured conductive epoxy provides electrical and mechanical contact between the plurality of source contact areas and the plurality of source dimples, and the gate contact area and the gate dimple.

Abstract: A solid-state lithium battery including a lithium-containing anode and a phosphorus-containing cathode is disclosed. The cathode may include any of a number of electronically conductive allotropes of phosphorus, referred to as a group as black phosphorus. A solid discharge product of the cell acts as an electrolyte for the cell. The cathode may include an auxiliary electronic conductor phase to improve the conductivity of the cathode, improve the cathode utilization during discharge and reduce the overall cell impedance.

Abstract: A method for handing off a connection of a mobile device from a primary VPN to which the mobile device is connected to an angel VPN to which the mobile device may be connected in an Internet Protocol-based multimedia mobile network includes the steps of searching for alternative available routes to a peer, creating the angel VPN for storage in the mobile device and replacing the primary VPN with the angel VPN in a case where the primary VPN is disrupted.

Abstract: A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.

Abstract: A memory flash card reader includes a processor for receiving at least one request from a host system, an index comprising information regarding sectors of the memory flash card wherein the processor may utilize the index to determine sectors of the memory flash card that are available for programming, reprogramming, or reading, and at least one card controller coupled to the processor.

Abstract: A printed circuit board trace coupling system for providing high voltage isolation includes a driving circuit, a coupling transformer including a printed circuit board trace, and a receiving circuit.

Abstract: An apparatus for illuminating footwear includes a circuit combining a switch having a resilient spring and a light sensitive switch.