Abstract: A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being aluminum, and a resin body encapsulating the die, bonding wires and at least a portion of the lead frame.

Abstract: A single lens for concentrating and refracting electromagnetic energy having a broad energy spectrum onto bands of a target device includes a lens having a flat top side and a plurality of regions, each region refracting the electromagnetic energy and concentrating specific wavelengths onto specific bands of the target device. A focusing detector is also provided.

Abstract: A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact and a plurality of source contacts, patterning a lead frame with target dimple areas, creating dimples in the lead frame corresponding to the gate contact and source contacts, printing a conductive epoxy on the lead frame in the dimples, curing the lead frame and semiconductor die wafer together, and dicing the wafer to form the semiconductor device packages.

Abstract: A vehicle video collision event recorder includes a vehicle video collision event recorder includes a control module for accepting at least one decoded engine performance data and at least one processed video signal, a video mixer for processing at least one video signal, at least one video camera for providing the at least one video signal, a decoder for decoding at least one engine performance data from an on-board diagnostic system, a collision sensor coupled to the control module, and a storage device for storing an output signal representative of the decoded engine performance data and the processed video signal.

Abstract: A semiconductor integrated circuit package having a common source current sensing circuit includes a main die having an integrated circuit, the main die including a source bonding pad and a gate bonding pad disposed on an upper surface, a leadframe having a leadframe pad disposed under the main die, and a monitoring die including a source bonding pad and a gate bonding pad disposed on an upper surface, the monitoring die being coupled to the main die in such manner that the main die source bonding pad is coupled to the monitoring die source bonding pad and the main die gate bonding pad is coupled to the monitoring die gate bonding pad and such that the main die and monitoring die upper surfaces are adjacent to one another.

Abstract: A method of preventing acoustic arc resonance (AAR) in a high frequency electronic ballast for a High-Intensity-Discharge (HID) lamp, includes the step of providing a phase modulated signal to the HID lamp, the phase modulated signal being provided by a pulse source working at a Pulse-Phase-Modulation (PPM) mode with a fixed frequency.

Abstract: An On-Off control circuit between the IEEE1394a and IEEE1394b compliant physical layer (PHY) output driver circuitry and the glass fiber optical physical medium dependent (PMD) sub-layer within the architecture of the IEEE 1394b standard addresses the stability issue incurred by electronic circuit's inherent noise that interferes with the connection detecting procedure defined by the connection management protocol (CMP) of the IEEE 1394b standard. The circuit includes of a voltage divider to provide a reference voltage of about 50% of the output common mode voltage, a voltage comparator, and a feedback coupled to the positive input of the comparator to eliminate possible oscillation. The negative input of the comparator may be connected to the mid point of TPB termination network and the positive input of the comparator may be connected to the output of the voltage dividing circuit. The output of the comparator may be connected to the transmission enable bar input of the optical transceiver.

Abstract: A furnace for energy saving and space reduction used in electronic industry assembly, medical sterilization, or food process application is provided. In the furnace there is a number of trays hinged on a pair of continuous chains which movement is in a circle or oval trajectory, or on the rotating beam mechanism constituting as spider web form. A pair of rings is added to restrain the swing movement of each tray via the mechanical linkage during rotation. A dome formed at the top portion inside the furnace is used as an enclosure where the heated inert gas is almost kept. The electric power for heater and blower can be reduced by the natural convection. An opening is located at the lower portion of the furnace; so the operator can do loading and unloading performance.

Abstract: A tool for compressing a coil spring includes a forcing screw having a threaded portion and a non-threaded portion, a first clamping member rotatable about the non-threaded portion, and a second clamping member rotatable about the threaded portion.

Abstract: A toilet cleaning apparatus comprising a toilet brush head; a toilet brush handle (2) separated from the brush head by a brush shaft (1); a portion of the brush handle being adapted to contain a cleaning fluid and being in fluid communication with the brush head by a conduit; the handle being adapted to be reciprocally displaced along the conduit between a first position remote from the brush head and a second position proximate to the brush head so urging cleaning fluid from the handle to the brush head; and, a non return valve within the conduit adapted to allow the flow of fluid from handle to brush but to prevent the flow of fluid from brush to handle.