Abstract: A semiconductor element mounting board includes: aboard having surfaces; a semiconductor element mounted on one of the surfaces of the board; a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In such a semiconductor element mounting board, each of the surface layers has rigidity higher than that of each of the first and second layers. It is preferred that in the case where a Young's modulus of each surface layer at 25° C. is defined as X GPa and a Young's modulus of the first layer at 25° C.

Abstract: An image forming apparatus according to the present invention includes a storage part which, to save read image data, saves image data not subjected to image processing together with processing data for image processing to be performed by an image processing part at later image formation. Then, the image forming apparatus, at the time of printing out the image data, subjects the image data to image processing only once by using the processing data in accordance with setting.

Abstract: A substrate processing method which can reduce the number of particles to be left on each substrate is provided. In the substrate processing method, substrates W to be processed are dried, by using a fluid heated by a heating apparatus having one or more heating mechanisms. The substrate processing method comprises a first step of supplying a mixed fluid containing a gas and a processing liquid and heated by the heating apparatus, into a processing chamber in which the substrates to be processed are placed, and a second step of supplying the heated gas into the processing chamber. The output of at least one of the heating mechanisms is kept at a preset constant value for a period of time during which a predetermined time passes after the start of the first step. In the second step, the output of the heating mechanism is determined under a feed back control.

Abstract: Disclosed is a semiconductor device fabricating method. A substrate is provided thereon with: an inorganic insulating film; a first inorganic sacrifice film stacked on the inorganic insulating film and having components different from those of the inorganic insulating film; a second sacrifice film formed of an inorganic insulative film stacked on the first sacrifice film, wherein a pattern for forming grooves for wiring embedment is formed in the second sacrifice film; and an organic layer including a photoresist film, wherein a pattern for forming holes for wiring embedment is formed in the organic film. According to the present invention, the thickness of the organic layer is set to be greater than the sum of the thicknesses of etch target films, i.e., the insulating film, the first sacrifice film and the second sacrifice film; the etch target films are etched in a selectivity-less manner by using plasma generated from a mixed gas of CF4 gas and CHF3 gas.

Abstract: The invention is directed to iridium oxide based catalysts for use as anode catalysts in PEM water electrolysis. The claimed composite catalyst materials comprise iridium oxide (IrO2) and optionally ruthenium oxide (RuO2) in combination with a high surface area inorganic oxide (for example TiO2, Al2O3, ZrO2 and mixtures thereof). The inorganic oxide has a BET surface area in the range of 50 to 400 m2/g, a water solubility of lower than 0.15 g/l and is present in a quantity of less than 20 wt. % based on the total weight of the catalyst. The claimed catalyst materials are characterized by a low oxygen overvoltage and long lifetime in water electrolysis. The catalysts are used in electrodes, catalyst-coated membranes and membrane-electrode-assemblies for PEM electrolyzers as well as in regenerative fuel cells (RFC), sensors, and other electrochemical devices.

Abstract: An automatic takeoff and landing apparatus for an aircraft for realizing a takeoff run and performing an ascending flight of the aircraft up to a target altitude at takeoff; and for realizing an approaching flight and performing a landing run of the aircraft at landing.

Abstract: The present invention is a method for producing a ceramic porous body with high porosity and continuous macropores, which comprises mixing a ceramic powder with an aqueous solution of a gelable water-soluble polymer to form a slurry, gelling for a while to fix the tissue structure, freezing it to produce ice crystals in the gel tissue and creating structures that become continuous pores, thawing the ice by controlled atmospheric substitution-type drying method with the resulting water being replaced without damaging the gel, and then sintering it to produce a ceramic porous body having various porosities, pore diameters and pore shapes, while conventionally cracks and contraction were likely to occur during drying when the solids concentration of the slurry is less than 20 vol %, with the method of the present invention it is possible to control these problems even at a solids concentration of 10 vol % or less, manufacture and provide a ceramic porous body with a porosity of 72% to 99% and a compression stren

Abstract: The present invention relates to a method for manufacturing nitric acid wherein a gaseous mixture, including air and ammonia, is transported on a catalyst including platinum to carry out catalytic oxidation of the ammonia, and is characterized in that a sulfurated component is added to the gaseous mixture.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction and an indexing-feed means for moving the chuck table and the laser beam application means in an indexing-feed direction perpendicular to the processing-feed direction, wherein the laser beam application means comprises a first laser beam application means for applying a first pulse laser beam having an energy density per one pulse of 20 to 60 J/cm2 and a second laser beam application means for applying a second pulse laser beam having an energy density per one pulse of 3 to 20 J/cm2.

Abstract: A substantially vertically extending concave portion is provided at a middle part of an impact absorbing face of an airbag body that deploys under a windshield so as to face a front seat occupant. With this configuration, an occupant who is seated in a regular seating position and wearing a seatbelt can be properly protected by preventing the neck area or the like of the occupant from being damaged. In addition, a bulging portion configured to bulge under the windshield and at an upper part of the concave portion is provided to the airbag body. With this configuration, it is possible to properly prevent the head area of an occupant who is not wearing a seatbelt from being damaged directly by the windshield.

Abstract: A heat treatment apparatus with a process chamber, a tubular heater, a heat exhaust system and a cooling section. The heater surrounds an outer circumference of the process chamber. The heat exhaust system exhausts an atmosphere in a space between the heater and the process chamber. The cooling section blows a cooling fluid into the space to cool the atmosphere. The heater includes a tubular heat insulator, a heat generating resistor on an inner circumference of the heat insulator, and an outer shell provided on an outer circumference of the heat insulator. The cooling section includes at least one annular flow path between the heat insulator and the outer shell, and an outlet in the heat insulator. The outlet blows cooling fluid toward a vertical central axis of the heat insulator, or in a direction oblique to the direction toward vertical central axis of the heat insulator.

Abstract: The present invention is intended to achieve more accurate and facilitated positioning of a carrier onto a table, in a substrate processing apparatus configured for placing the carrier storing multiple sheets of wafers therein, on the table, by using a carrier arm. Before the carrier is actually carried by the carrier arm, a carrier jig having the same shape as the carrier is held by a holding part provided to the carrier arm. The carrier jig is provided with a camera, such that a central position of a region of an image taken by the camera will be coincident with a central position of an opening formed in the table, if the carrier jig is accurately located in an ideal position above the table. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, the image of the region including the opening is taken by the camera.

Abstract: Disclosed herein is a method for recovering a low sodium content lignin from spent kraft cooking liquor without the use a of strong mineral acid for acidulation.

Abstract: The present invention relates to nucleotide sequences encoding enzymatically active cobalamin-methionine synthase and functional fragments thereof that are modified in comparison to the respective wild-type enzyme such that said enzymes show reduced product inhibition by methionine. The present invention also relates to polypeptides being encoded by such nucleotide sequences and host cells comprising such nucleotide sequences. Furthermore, the present invention relates to methods for producing methionine in host organisms by making use of such nucleotide sequences.

Abstract: Rubber mixtures, including at least one rubber, a filler, an organosilicon compound of the formula I one rubber accelerator and one co-accelerator. The rubber mixtures are prepared by mixing at least one rubber, a filler, an organosilicon compound of the formula I, one rubber accelerator and one co-accelerator. The rubber mixtures can be used for production of moldings. Also disclosed is a process for preparation of the organosilicon compound of the formula I via transesterification.

Abstract: Rubber mixtures are prepared by using, alongside the other constituents, pyrogenically prepared silicon dioxide in the form of crusts whose tamped bulk density (to DIN EN ISO 787-11) is from 185 to 700 g/l.

Abstract: There is described Pd enriched diesel oxidation catalysts and their application as catalysts for the oxidation of CO and HC emissions from a compression ignition/diesel engine. The catalysts are characterized by increased performance and hydrothermal durability these goals being achieved by employing a layered design to eliminate low temperature catalyst quenching by toxic HC species in the exhaust stream.

Abstract: A cushioning device with double layer cover with the layers connected to define first and second pockets. The first and second pocket having access openings for insertion and removal of shell sections to be placed in a stacked state. A closure device as in a zipper for adjustable placement of the cover in a cover interior cavity closure state and a cover interior cavity access state. A first core insert received within the cover interior cavity. The arrangement of the present invention makes it well suited for use as an adjustable head pillow kit featuring a variety of different comfort level core inserts that can be switched out to achieve a personal overall comfort level. A method of assembling the cushion and adjusting the comfort level with different inserts is also presented.

Abstract: When a barrier film is formed on an exposed surface of an interlayer insulation film on a substrate, the interlayer insulation film having a recess formed therein, and a metal wiring to be electrically connected to a metal wiring in a lower layer is formed in the recess, a barrier film having an excellent step coverage can be formed and increase of a wiring resistance can be restrained. An oxide film on a surface of the lower copper wiring exposed to a bottom surface of the interlayer insulation film is reduced or edged so as to remove oxygen on the surface of the copper wiring. Then, by supplying an organic metal compound containing manganese and containing no oxygen, generation of manganese oxide as a self-forming barrier film is selectively allowed on an area containing oxygen, such as a sidewall of the recess and a surface of the interlayer insulation film, while generation of the manganese oxide is not allowed on the surface of the copper wiring. Thereafter, copper is embedded in the recess.