Abstract: A method is proposed for forming solder areas over a lead frame through deposition of an oxidation layer rather than selective removal of a polyimide-made solder mask, which allows the fabrication of the lead frame to be carried out in a more cost-effective and advantageous manner. The method allows the fabrication of the lead frame to be carried out through stamping without etching. Moreover, it can make the overall integrated circuit package less easily subjected to cracking and more securely assembled. Still moreover, it can make the overall integrated circuit package less likely to be weakened in structural strength by moisture. This method is therefore more advantageous to use than the prior art.

Abstract: An advanced flip-chip packaging technology is proposed, which is characterized in the forming of a metal dam over the substrate to serve three different utilization purposes. First, the metal dam can help provide a specific fillet width to the underfilled material under the flip chip so as to allow the joint between the flip chip and the substrate to have increased robustness against thermal stress. Second, the metal dam can serve as a mechanical reinforcement to the substrate to prevent package warpage. Third, the metal dam can additionally serve as a heat-dissipation structure to help the beat dissipation from the flip chip. These benefits allow the finished package product to be highly assured in quality and reliability.

Abstract: A hologram laser unit to be used for performing recording and reproducing operations of information for an optical disk, includes a light source, a photodetector, and a hologram element which are formed integrally with each other. The hologram element includes: a first hologram for detecting information signals from the optical disk, the first hologram being provided in an area having an effective diameter corresponding to a numerical aperture suitable for the optical disk; and a second hologram for compensating for only a transmitted light amount of light traveling toward the optical disk from the light source, the second hologram being provided contiguously outside the first hologram.

Abstract: A multi-chip module is proposed, which is designed to pack two or more semiconductor chips in a stacked manner over a chip carrier in a single package. The proposed multi-chip module is characterized by the use of a reverse wire-bonding technique to allow the topmost bent portions of a first set of bonding wires connected to the bottommost chip to be positioned above the substrate rather than above the bottommost chip. Then, an adhesive layer is formed to a thickness that allows it to entirely wrap the part of the bonding wires that is positioned above the active surface of the bottommost chip to prevent the bonding wires connected to the bottommost chip to come in contact with at least one overlaid chip. This allows the prevention of voids between the two stacked chips in the encapsulation body. Moreover, the proposed multi-chip module allows the stacked chips to be variably-sized according actual needs without the problem of the bonding wires being damaged during the mounting of the overlaid chip.

Abstract: A method for distinguishing a specific region in a sample to be observed by a microscope is disclosed. The method includes the steps of (a) forming a first concavity on a first side of the specific region by a focus ion beam (FIB) technique, (b) forming a second concavity on a second side of the specific region opposite to the first side by the focus ion beam technique, and (c) filling the first concavity and the second concavity with a first metallic packing and a second metallic packing respectively for defining the specific region to be observed.

Abstract: An optical disk including concentric or spiral grooves, a first series of pits formed in the interrupted portions, and a second series of pits formed in portions of lands. Both of the first and second series of pits represent address information. The portions of the lands and the interrupted portions of the grooves are located in different radial directions. With this arrangement, even when the optical disk has a reduced track pitch, accurate address information is obtained, achieving a high-density recording optical disk.

Abstract: An integrated circuit (Integrated Circuit) packaging method is proposed, which can be used to pack an Integrated Circuit chip of an optically-sensitive type, such as an image-sensor Integrated Circuit chip, and which can help prevent resin flash on lead frame and help increase wire bondability. The proposed Integrated Circuit packaging method can help prevent resin flash on the die-pad portion and the inner end of the finger portion of the lead frame. This benefit allows the die attachment on the die-pad portion of the lead frame to be more reliable than the prior art. Moreover, the proposed Integrated Circuit packaging method allows lead frame to come into direct thermal contact with heat block during wire-bonding process, so that it allows an increased level of bondability to the bonding wires, making the Integrated Circuit package more assured in quality and more reliable to use than the prior art.

Abstract: A method and system for gaming is provided in which a plurality of players each connect to a host which enables players to participate jointly in the same games of chance. According to one embodiment, a computerized method of gaming is provided that includes connecting a plurality of players to a host remotely located from the plurality of players. Each player jointly participates in a turn-based game of chance.

Abstract: An externally-embedded heat-dissipating device is designed for use with a BGA (Ball Grid Array) IC package for dissipating the IC-produced heat during operation to the atmosphere. that can help further increase the efficiency of heat dissipation from the BGA IC package. The heat-dissipating device is characterized in that it can be externally embedded in the top surface of the encapsulant without having to be supported on the substrate, and also in that it can help reduce the heat path from the IC chip to the heat-dissipating device so that heat-dissipation efficiency can be further increased as compared to the prior art. Further, the heat-dissipating device can help reduce manufacture cycle time and cost and also help prevent delamination, flash, and popcorn effect that would otherwise occur in the case of the prior art. It also can help save layout space over the substrate for compact design of the package.

Abstract: A system and method for determining whether wager data for players' wagers placed on a drawing game have been altered after winning game elements are drawn includes a host computer and a verification device. The host computer stores the wager data and generates a first hash value for the wager data at a time prior to drawing the winning game elements. The host computer is capable of generating a second hash value for the wager data at a time subsequent to drawing the winning game elements for comparison to the first hash value. The verification device receives the first hash value for the wager data prior to drawing the winning game elements and receives the winning game elements.

Abstract: With DC constant current applied to an end of one of transparent electrodes by a constant current application terminal, a voltage is measured at an end of a transparent electrode adjacent to the foregoing electrode by a voltage detection terminal, while a common electrode is earthed by applying a brush earth terminal thereto in the vicinity of the foregoing transparent electrode. If the transparent electrode is broken, the DC constant current application circuit detects a voltage saturation state, whereas if the transparent electrode is short-circuited, the DC voltage detection circuit detects variation in the foregoing voltage. A short-circuiting/wire breakage memory circuit stores the detected irregularity of the voltage as defect information, and either wire breakage or short-circuiting is detected on the basis of the defect information.

Abstract: An variable shaft, for example for a golf club. A hollow shaft has a cable or wire in the center, and means for varying the tension of the cable or wire. Increasing tension on the cable or wire places the shaft in compression and thereby reduces its bending stiffness. Preferably, the variation means are designed so that the wire tension may be quickly and easily varied by the user.

Abstract: A BGA (Ball Grid Array) integrated circuit package is proposed, which is characterized in the use of a ground metallic layer adhered to a substrate. Moreover, the ground metallic layer can provide the semiconductor chip with a heat-dissipation path, allowing heat from the semiconductor chip during operation to be dissipated to the atmosphere via the ground metallic layer, so that the overall heat-dissipation efficiency can be increased. The ground metallic layer is formed with a chip-receiving cavity for accommodating a semiconductor chip mounted on the substrate. As the semiconductor chip is surrounded and in close proximity to the ground metallic layer, it can help reduce undesired simultaneous switching noise, crosstalk, and electromagnetic interference in the integrated circuit package.

Abstract: A solder-pump fabrication method is proposed, which is used for the fabrication of solder bumps with high coplanarity over a semiconductor chip for flip-chip application. The proposed solder-bump fabrication method is characterized in the use of a two-step solder-bump fabrication process, including a first step of electroplating solder over UBM (Under Bump Metallization) pads to a controlled height still below the topmost surface of the mask, and a second step of screen-printing solder paste over the electroplated solder layer. The combined structure of the electroplated solder layer and the printed solder layer is then reflowed to form the desired solder bump. Since the proposed solder-bump fabrication method allows the solder material electroplated and printed over the UBM pads to be confined within the mask openings and never exceed the topmost surface of the mask, the resulted solder bumps would not be bridged to neighboring ones.

Abstract: A system and method for distributing electronic instant lottery games is provided in which at least two ticket batches are distributed together to each game play terminal. In one embodiment, a method of distributing and playing electronic instant lottery tickets is provided. The method includes the steps of creating a first pack of tickets, creating a second pack of tickets, distributing the first and second packs together to a location at which the tickets are to be played, and permitting play from the first pack of tickets for a first period of time while play from the second pack is not permitted.

Abstract: A method for producing a liquid crystal display panel of the present invention includes the steps of: forming a plurality of injection seals on at least one of a pair of substrates, the injection seals defining a liquid crystal injection area; forming a dummy seal of dispersed sealant particles outside the liquid crystal injection area; attaching the substrates to each other thereby sandwiching the injection seal and the dummy seal therebetween; and injecting a liquid crystal material into the liquid crystal injection area formed between the pair of substrates.

Abstract: There is provided an image discriminating apparatus for discriminating the type of an image accurately. The apparatus compares a maximum value R among absolute values of mutual differential values of three color components of each pixel composing an image, with two predefined threshold values &bgr; and &ggr;, respectively, and counts numbers C1-C3 of the monochrome pixels, medium pixels and color pixels, respectively, on the basis of the comparison result for each line within the image. The apparatus judges each line within the image as a color line when C3+C2×&ohgr;>&thgr;, as a monochrome line when Cl>&ngr;, and judges the image as a color image when a number of color lines in the whole image exceeds a threshold value.

Abstract: A liquid crystal display (LCD) device is composed of (1) an LCD element having (i) a glass substrate on which a flat portion including pixel electrodes and a flat portion including switching elements, wires, and the like are laminated with interlayer insulating films therebetween, each interlayer insulating film being an organic film with an optical transmittance of not less than 95 percent with respect to light with a peak wavelength and (ii) a liquid crystal layer made of liquid crystal whose refractive index anisotropy &Dgr;n(450) with respect to light with a wavelength of 450 nm and whose refractive index anisotropy &Dgr;n(650) with respect to light with a wavelength of 650 nm satisfy a condition that a difference &Dgr;n(450)−&Dgr;n(650) between them is set so as to be in a range of 0 to 0.01, and (2) a phase difference plate whose refractive index anisotropy is negative (na=nc>nb) and whose index ellipsoids are inclined substantially throughout the phase difference plate.