Patents Represented by Attorney, Agent or Law Firm Timothy M. Honeycutt
  • Patent number: 5981365
    Abstract: A method of fabricating an integrated circuit transistor in a substrate is provided. A gate electrode stack is formed on the substrate. The stack has a first insulating layer, a first conductor layer on the first insulating layer, a second insulating layer on the first conductor layer, and a second conductor layer on the second insulating layer. First and second source/drain regions are formed in the substrate in spaced apart relation to define a channel region underlying the first insulating layer. First and second sidewall spacers are formed adjacent to the gate electrode stack. The second conductor layer and the second insulating layer are sacrificed and a silicide layer is formed on the first conductor layer. The void remaining after removal of the second conductor and insulating layers establishes a large separation between the silicide forming titanium layer and the first conductor layer. The result is a gate electrode stack that is resistant to lateral silicide formation due to silicon diffusion.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: November 9, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Jon D. Cheek, Derick J. Wristers, Mark I. Gardner
  • Patent number: 5976924
    Abstract: A method of fabricating an integrated circuit transistor in a substrate is provided wherein a self-aligned gate electrode is formed after the high temperature steps associated with sidewall spacer formation and source/drain anneal. A first dielectric layer is formed on a substrate. First and second source/drain regions are formed in the substrate and spaced laterally to define a channel region underlying the first dielectric layer. A second dielectric layer is formed on the substrate except where the first dielectric layer is positioned. The first dielectric layer is removed and a third dielectric layer is formed that overlies the channel region. A gate electrode is formed on the third dielectric layer. The first dielectric layer functions as a disposable gate electrode to facilitate self-aligned source/drain implant and sidewall spacer formation.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: November 2, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Mark I. Gardner, Derick J. Wristers, H. Jim Fulford
  • Patent number: 5904534
    Abstract: An integrated circuit transistor and a method for making the same are provided. The transistor is resistant to junction shorts due to the overetch of local interconnect trenches. The transistor includes a source/drain region with a first junction and a second junction that is located deeper than the first junction in the portion of the active area susceptible to the overetch junction short phenomena. The second junction is established by ion implantation through a mask that is patterned to create an opening corresponding to the intersection of the layouts of the active area and the local interconnect trench. Using this method, the second junction is only established where needed to prevent shorting and does not impede transistor performance.
    Type: Grant
    Filed: August 14, 1998
    Date of Patent: May 18, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Jon D. Cheek, Derick J. Wristers, H. Jim Fulford
  • Patent number: 5876431
    Abstract: A lead assembly adapted for endocardial fixation to a human heart is provided. The lead assembly includes a lead body that has a proximal end provided with a connector for electrical connection to a cardiac stimulator. The cardiac stimulator may be a pacemaker, a cardioverter/defibrillator, or a sensing instrument. The distal end of the lead body is connected to a tubular electrode housing. The lead body consists of a noncoiled conductor cable surrounded by a coextensive insulating sleeve. In contrast to conventional leads, the lead body of the present invention does not require coiled conductor wires or an internal lumen. Manipulation of the lead body is via an external guide tube. Lead body diameters of 0.25 mm or smaller are possible.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: March 2, 1999
    Assignee: Sulzer Intermedics Inc.
    Inventors: Paul R. Spehr, James E. Machek
  • Patent number: 5871532
    Abstract: A lead assembly for fixation to a human heart via thoracoscopy is provided. The lead assembly includes a lead that has a connector for connection to a cardiac stimulator, such as a pacemaker, a cardioverter/defibrillator, or a sensing instrument. A fixation mechanism is coupled to the lead that includes a tubular housing and a proximally projecting hook that is adapted to engage heart tissue. The hook is pivotable between a retracted position and an extended position. The lead and the hook are manipulated by a stylet. The lead assembly also includes a tubular introducer that is passed through the chest wall of a patient and used to place the lead proximate the epicardium.
    Type: Grant
    Filed: May 22, 1997
    Date of Patent: February 16, 1999
    Assignee: Sulzer Intermedics Inc.
    Inventor: Edward A. Schroeppel
  • Patent number: 5851227
    Abstract: A lead assembly adapted for endocardial fixation to a human heart is provided. The lead assembly includes a lead body that has a proximal end provided with a connector for electrical connection to a cardiac stimulator. The cardiac stimulator may be a pacemaker, a cardioverter/defibrillator, or a sensing instrument. The distal end of the lead body is connected to a tubular electrode housing. The lead body consists of a noncoiled conductor cable surrounded by a coextensive insulating sleeve. In contrast to conventional leads, the lead body of the present invention does not require coiled conductor wires or an internal lumen. Manipulation of the lead body is via an external guide tube. Lead body diameters of 0.25 mm or smaller are possible.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: December 22, 1998
    Assignee: Sulzer Intermedics Inc.
    Inventor: Paul R. Spehr
  • Patent number: 5769881
    Abstract: A lead assembly includes a proximal end that has a connector for electrical connection to a cardiac stimulator, such as a pacemaker, a cardioverter/defibrillator, or a sensing instrument. The lead assembly includes an elongated proximal tubular portion that extends distally from the connector. The distal end of the proximal tubular portion is provided with a branch assembly that is joined distally to two elongated distal lead branches. The distal branches are provided, respectively, with lead tips that each function as electrodes for transferring electrical signals from and/or to the myocardium. The branch assembly includes structure for enabling a surgeon to selectively manipulate the distal branches using a single stylet passed through a single lumen in the proximal tubular portion.
    Type: Grant
    Filed: May 22, 1997
    Date of Patent: June 23, 1998
    Assignee: Sulzer Intermedics Inc.
    Inventors: Edward A. Schroeppel, Paul R. Spehr
  • Patent number: 5761877
    Abstract: An automated system for individual dosage medication distribution 10 is provided. The system 10 includes a medium rate dispenser 20, a fast rate dispenser 30, a low rate dispenser 40, a conveyor 50, a diverter 60, a bagger 70, and collection bins 80 and 85. The dispensers 20, 30, and 40 are arranged to be able to deliver individual dosage packages of drugs to the conveyor 50. The conveyor 50, in turn, is configured to transport individual dosage packages to the bagger 70 or the collection bin 85. A programmable controller 12 receives patient prescription order information from health care providers and directs the dispensers 20, 30, and 40, conveyor 50, diverter 60, and bagger 70 to automatically pick the prescribed medication dosage unit, place it in a transportable package, and label the package for the health care personnel.
    Type: Grant
    Filed: February 20, 1997
    Date of Patent: June 9, 1998
    Inventor: W. Gerald Quandt