Abstract: A faucet including a faucet body defining a ball socket between a water intake port and a water output port, a ball valve mounted in the ball socket and retained between two rigid gasket members, a packing nut fastened to the ball socket to hold down the rigid gasket members and the ball valve, and a handle coupled to the ball valve and moved vertically to turn the ball valve between a first position where the water passage between the water intake port and the water output port is stopped by the ball valve, and a second position where the ball valve imparts a water passage in communication between the water intake port and the water output port.

Abstract: The present invention relates to an improved connecting socket of the golf club head. The connecting socket 10 of the head 1 is a projected tube 11 having a through hole 110 thereof. A reinforced rib 12 is disposed between the head 1 and the projected tube 11. By this arrangement, the connecting portion 100 of the connecting socket 10 and the reinforced rib 12 can be forcibly pressed with or without heating. Accordingly, a little angular adjustment can be made to the connecting socket 10 by means of the projected tube 11. A shaft 2 can be readily mounted thereof and the striking area can be also increased.

Abstract: A method for polishing a semiconductor wafer is provided. A semiconductor wafer is detached from a polishing pad on a side of an upper polishing plate and is kept to be supported by a lower polishing plate. A contact area between the a wafer and the upper polishing plate is set to be less than a contact area between the wafer and the lower polishing plate. As a result, the wafer is definitely detached from the polishing pad on the side of the upper polishing plate and is to be kept supported by the lower polishing plate when the upper polishing plate is lifted.

Abstract: A CD storage box formed by a box with a slidable drawer contained therein. The drawer is formed by combining a base plate having a receiving space and a drawer panel. The base plate can be used to hold bare CDs and other media. The sliding slot on the two sides of the base plate and a sliding bar secured within the box are arranged so that the drawer may slide forwards and backwards but will not fall out of the box.

Abstract: A thermoplastic resin composition comprising a blend obtainable by blending 0.1 to 99% by weight of (a) a fluorine-containing polymer having a number-average molecular weight of 2000 to 1000000 and having hydroxy group or epoxy group at least at one of end portions of a main chain and side chain of the polymer, and 1 to 99.9% by weight of (b) a heat resisting thermoplastic resin having a crystalline melting point or glass transition temperature of not less than 150.degree. C. The present invention can provide a composition comprising various heat resisting thermoplastic resins and a fluorine-containing polymer having a functional group which is capable of developing an affinity with said resins and forming a uniform dispersion.

Abstract: A semiconductor single crystal lift device which comprises a crucible for melting materials for forming semiconductor single crystals and a radiation screen disposed at an upper portion of the crucible and formed of a reversed-cone-shaped adiabatic tube surrounding a lift zone, the apparatus being adopted for lifting up the semiconductor single crystal from a melt in the crucible, in which the radiation screen is divided into more than three adiabatic members, at least part of the adiabatic members being configured in a detachable fashion so that an adiabatic nature of the radiation screen can be partly altered.

Abstract: A box end wrench having a split binding ring mounted in an annular groove at internal angles of a box of a first box end thereof for stopping the wrench from escaping out of the bolt or nut to be turned with the first box end, and a plurality of smoothly curved raised Portions at internal angles of a box of a second box end thereof for stopping the wrench from escaping out of the bolt or nut to be turned with the second box end.

Abstract: A structure of modem shell with round sound suppression comprises: a box formed by opposite upper and lower half shell bodies, wherein a concave spacing the opening of which is directed outwards is installed thereon, while within the spacing is installed with a line output hole; a covering plate the size of which is enough to cover the opening of the spacing, and a plurality of through holes is installed on the covering surface thereof; and a buckling mechanism is formed by at least two pairs of buckling holes and a pillar; thereby, the spacing is used to locate a trumpet and then is covered by a covering plate so to effectively suppress the round sound generated by the modem.

Abstract: A safety electrical outlet including a plurality of raised socket bodies with a respective pair of blade insertion slots for receiving metal contact blades of an electrical plug, a plurality of rotary safety socket covers respectively covered on the socket bodies and revolvably supported thereon, each rotary safety socket cover having two blade insertion slots for receiving metal contact blades of an electrical plug, and a plurality of spiral springs connected between the socket bodies and the rotary safety socket covers to hold the respective socket covers in a sealing position in which the blade insertion slots of the rotary safety socket covers are retained out of alignment with the blade insertion slots of the respective socket bodies.

Abstract: The present invention is intended to provide a polishing method for a chamfered portion of a semiconductor silicon substrate, wherein edge relief of an oxidized silicon layer and/or an extrinsic gettering layer, and mirror polishing of chamfered portion can be performed at the same time for the semiconductor silicon substrate having the oxidized silicon layer and/or extrinsic gettering layer on the bottom thereof. The semiconductor silicon substrate is tilted at a designated chamfered angle .theta. with respect to an axis of a buff being mounted in a polishing apparatus to mirror polish the chamfered portion on one side. Then, the semiconductor silicon substrate is reversed, and the mirror polish is performed for the chamfered portion on the other side. A mean diameter of the colloidal silica constituting the polish liquid is 50.about.150 nm, the pH value of the polish liquid is 10.about.11, a specific gravity at 20.degree. C. is 1.about.1.5, and a concentration is 30.about.50 wt %.

Abstract: The present invention provides a process for fabricating an SOI substrate with no peripheral scratches and with enhanced fabrication efficiency. The present process includes bonding a semiconductor wafer of an active substrate 1 and a semiconductor base wafer 2 to form a bonded wafer 4; surface-grinding the active substrate 1; spin etching the surface-ground active substrate 1; and PACE processing the etched active substrate 1 to form the active substrate into a thin film and simultaneously, to remove the non-bonded peripheral portion of the bonded wafer 4.

Abstract: A top stop integral with a zipper tape for a zipper, the top stop including an upper stop block having a front stop face and a rear stop projection, the rear stop projection and the front stop face being respectively stopped at a top edge of the slide of the zipper and one side of a partition wall inside the slide to prohibit the slide from escaping out of engagement with the row of teeth on the zipper tape, and a lower stop block having a connecting portion downwardly extended from the bottom edge thereof and connected to a top edge of a first tooth of the row of teeth on the zipper tape.

Abstract: A folding collapsible step exercising machine including a base frame having a transverse front bar and transverse rear bar, a front upright pivoted to the transverse front bar of the base frame and locked in a vertical position by lock means, a driving wheel having a fixed wheel shaft revolvably supported on the base frame, a damping wheel turned with the driving wheel, two pedals, two rear pedal links respectively coupled between rear ends of the pedals and two opposite ends of the fixed wheel shaft of the driving wheel, two front pedal links having a respective bottom end pivoted to a front end of one pedal and a respective top end coupled to the front upright by a slip joint and a respective middle part fixedly mounted with a pivot, and two handlebars respectively turned about the pivots of the front pedal links and having a respective bottom end pivoted to the base frame, wherein two hexagonal end caps are respectively eccentrically coupled to two opposite ends of the transverse front bar of the base fram

Abstract: The objects of the present invention are to remove the dust in a closed container, to keep the pressure in the closed container within a predetermined range, and to shorten the maintenance time of a vacuum pump system.The present invention provides a centrifugal dust collector 2 on main pipes which connects a furnace body 1, a mechanical press 9 and a dry pump 10, and a metal mesh dust collector 15 on a bifurcated pipe in a single-crystal semiconductor pulling apparatus. When the vacuum pump process begins, the metal mesh dust collector 15 collects amorphous silicon generated in the furnace 1. As the pressure in the furnace is reduced, the centrifugal dust collector 2 collects the dust particles instead. Since the gas flow rate increases as the vacuum state become higher, the critical diameter of collectable particles decreases, thereby improving the dust collection efficiency.

Abstract: A valve pin (4) for controlling an injection amount of molten resin is inserted into a cavity (13), and then the molten resin is injected by way of a gate (10) along the surface of the valve pin (4) into the cavity (13) to be dropped therein, and tip ends of this dropping molten resin merges at a bottom (13a) of the cavity (13) to form a hollow portion (S) between the valve pin (4) and the dropped molten resin. Then, air is blown into the hollow portion (S) from the tip end of the valve pin (4), inflates the hollow portion (S), brings it into contact with the inner surface of the cavity (13), and cools and solidifies this molten resin, so as to attain a hollow molded product (40).

Abstract: A method for fabricating a semiconductor wafer to reduce the number of processing steps and produce low-cost wafers in a short time is disclosed. The method involves surface grinding both the front surface and back surface of a single-crystal silicon wafer which has been sliced from a rod and chamfered. In the surface grinding step, the size numbers of abrasive grains are larger than #2000 for front surface grinding, and smaller than #600 for back surface grinding. The front surface is then chemical polished as a mirror surface which satisfies the requirement of a later photolithography step. Moreover, a deformation layer formed on the back surface of the semiconductor wafer is partially etched and left to provide an extrinsic gettering function. An epitaxial layer can be formed on the front surface to make the wafer an epitaxial wafer. The method of the present invention requires fewer process steps as compared with conventional methods, thereby reducing manufacturing time and cost.

Abstract: A surface processing method for evaluating semiconductor substrate is intended to clean a semiconductor substrate, which has the surface of a silicon layer exposed by removing the epitaxial layer by an acid mixture, by buffered HF and then to perform SC-1 cleaning. Placing the substrate for about 2 hours after the processing, then the varying rate of the SPV value is quite stable at about 5%, so that the minor carrier diffusion length can be measured with high precision. Furthermore, the lead time of evaluating a semiconductor substrate can be significantly reduced over the prior-art method.

Abstract: A method processes a semiconductor wafer by etching the wafer, which has been smoothed by rough lapping, with alkaline solution. A rod is sliced into a plurality of wafers. The peripheral edges of the wafers are chamfered. The processed strain layers over the wafers due to chamfering are smoothed and planarized. The processed strain layers are then removed by etching with alkaline solution. The etched wafers are mirror polished. Lastly, the mirror-polished wafers are cleaned.

Abstract: A ratchet wrench includes a hollow guide a shaft supported on a spring inside a hollow ratchet unit of the wrench to hold a lamp assembly, a battery set, an electrically conductive plate and a knob, the knob having an outer thread threaded into an inner thread at one end of the hollow shaft, the knob being a rotated clockwise/counter-clockwise to close/open the circuit so as to turn on/off the lamp assembly.