Abstract: A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Abstract: A nonvolatile memory device includes multiple first bit lines extending in a first direction, multiple word lines formed on the first bit lines and extending in a second direction different from the first direction, and multiple second bit lines, formed on the word lines and extending in the first direction. The nonvoliative memory device also includes multiple twin memory cells, each of which includes a first memory cell coupled between a first bit line and a word line and a second memory cell coupled between the word line and a second bit line. The first and second memory cells store different data.

Abstract: A chip stack structure having a shielding capability may comprise a wiring substrate, the wiring substrate including a ground layer. The structure may also comprise a first chip attached on an upper surface of the wiring substrate and electrically connected to the ground layer. The structure may also comprise a plurality of first bonding wires which electrically connect the first chip to the wiring substrate. The structure may also comprise a shield plate attached to the first chip and detached from at least one of the plurality of first bonding wires, the shield plate being configured to cover the first chip and at least one of the plurality of first bonding wires. The structure may also comprise a grounding wire which connects the shield plate to the ground layer of the wiring substrate. The structure may also comprise a second chip attached to and supported by the shield plate.

Abstract: A method for manufacturing a dual damascene structure includes forming a wiring layer over a substrate, forming an inorganic insulating film over the wiring layer, forming a via hole in the inorganic insulating film using a first resist pattern with an opening as an etching mask, removing the first resist pattern, forming an organic insulating film on the inorganic insulating film and in the via hole, forming a hard mask on the organic insulating film, forming a hard mask pattern using a second resist pattern with an opening on the hard mask as an etching mask, forming a wiring groove by etching the organic insulating film using the second resist pattern and the hard mask pattern as etching masks until the organic insulating film inside the via hole is eliminated and simultaneously eliminating the second resist pattern, and implanting a conductive substance into the via hole and wiring groove.

Abstract: A semiconductor storage device includes: a MOSFET formed on an SOI layer of the transistor forming region; and a MOS capacitor formed on the SOI layer of the capacitor forming region. The MOSFET includes: a gate insulating film formed; a floating gate electrode; a source layer and a drain layer formed; a channel region; a high-concentration diffusion layer, and impurities of a same type as impurities which are diffused in the channel region are diffused at a high concentration in the high-concentration diffusion layer; and a silicide layer covering the high-concentration diffusion layer and the source layer. The MOS capacitor includes a capacitor electrode at the SOI layer. The capacitor electrode of the MOS capacitor is disposed so as to oppose an end portion of the floating gate electrode of the MOSFET, with the gate insulating film therebetween.

Abstract: In a synchronous acquisition method of a spread spectrum code, a digital code sequence is generated based on a received radio communication signal. The digital code sequence defines a spread spectrum code which includes a preamble symbol. A plurality of correlation signals are generated based on the spread spectrum code of the digital code sequence. A detection signal is generated in accordance with the correlation signal which corresponds to the preamble symbol. A timing control signal is generated in accordance with the detection signal. A demodulation signal is generated based on the correlation signals and in accordance with the timing control signal. A correction signal is generated based on the demodulation signal. A corrected timing control signal is generated based on the timing control signal and the correction signal, such that the demodulation signal corresponds to the preamble symbol.

Abstract: A flash memory device includes a flash fuse cell array, a trim code processing unit, a flash memory array, and a regulator. The fuse cell array, which includes multiple nonvolatile fuse cells, is configured to store a first trim code. The trim code processor is configured to generate a second trim code based on the first trim code provided by the fuse cell array and a voltage control code. The flash memory array includes multiple flash memory cells. The regulator is configured to generate a high voltage in response to the second trim code and to provide the high voltage to the flash memory array. The high voltage varies according to erase, program and read operations of the flash memory cells.

Abstract: A cell array of a flash memory device includes a memory cell transistor connected to a word line, a first selection transistor for controlling a first connection between the memory cell transistor and a bit line in response to a selection signal, and a second selection transistor for controlling a second connection between the memory cell transistor and a common source line in response to the selection signal.

Abstract: A unit cell for an integrated circuit includes a first conductive type active region and a second conductive type active region which extend in a first direction. Each of the active regions has first and second ends. The first end of the second conductive type active region opposes the second end of the first conductive type active region. A poly-silicon pattern extends in the first direction across the first conductive type active region and second conductive type active region. A first contact region is adjacent the first end of the first conductive type active region in the first direction. A second contact region is adjacent the second end of the second conductive type active region in the first direction.

Abstract: A field effect transistor having a double recess structure, which minimizes an influence exerted on a channel region depending upon the surface state of an outer recess section. In the field effect transistor having such a double recess structure, an ohmic contact layer at the surface of the outer recess section is made to have a thickness so as to be in a to completely depleted state.

Abstract: A non-volatile memory device, in which data values are determined by polarities at cell terminals, includes a memory cell array. The memory cell array is divided into multiple sub cell arrays, each sub cell array including at least one input/output line and an X-decoder/driver. First input/output lines included in different sub cell arrays may be simultaneously activated and bias voltages may be applied to the activated first input/output lines in accordance with the data values. The non-volatile memory device may be a bi-directional resistive random access memory (RRAM).

Abstract: A pulse height analyzer for determination of the pulse height distribution of electronic pulses includes a set of comparators with a common input for analogue to digital conversion of the electronic pulses, a set of latches wherein the inputs of the latches are connected to the outputs of respective comparators for recording passage of the corresponding threshold voltages by the rising edge of a pulse, a priority encoder connected to the latch outputs for determination of a pulse height category consisting of pulses with a pulse height within a pulse height interval defined by respective threshold voltages, and a micro controller that is adapted to count the number of pulses within each pulse height category.

Abstract: The present invention relates to a method and a system for synthesizing a prescribed three-dimensional electromagnetic field based on generalized phase contrast imaging. Such a method and apparatus may be utilized in advanced optical micro and nano-manipulation, such as by provision of a multiple-beam optical tweezer.

Abstract: A method of driving a non-volatile memory device includes supplying power to the memory device, in which setting information related to setting an operating environment is copied and stored in multiple of regions of a memory cell array. An initial read operation of the memory cell array is performed and initial setting data is determined based on the initial read operation. The operating environment of the memory device is set based on the initial setting data. Corresponding portions of the stored copies of the setting information are read at the same time.

Abstract: A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and scribe lines which are arranged between the device areas. After the heat spreading material is formed on rear surface of the semiconductor wafer, the semiconductor wafer is separated at the scribe lines.

Abstract: Provided are a flash memory device and a method of driving the same for reading set information and stably storing the read set information in a latch. The method of driving the flash memory device includes applying power to the flash memory device, which includes a memory cell array for storing set information used to set an operating environment of the flash memory device. An initial read operation of the memory cell array is performed to read the set information. The set information read in the initial read operation is stored in a latch. It is determined whether the set information is normally stored in the latch based on set data input to the latch and set data output from the latch.

Abstract: A stacked semiconductor package, includes a carrier, a first semiconductor device, a second semiconductor device, a plurality of first wires and a plurality of second wires. The carrier has a plurality of electrically connecting portions. The first semiconductor device has a plurality of first pads. The second semiconductor device has a plurality of second pads. The second semiconductor device is disposed on the first semiconductor device. The first wires electrically connect the first pads of the first semiconductor device and the electrically connecting portions of the carrier, and the second wires electrically connect the second pads of the second semiconductor device and the electrically connecting portions of the carrier. The diameters of the second wires are larger than those of the first wires. Thus, the material of the wires is reduced, and the manufacturing cost is reduced.

Abstract: A semiconductor device includes a lower substrate having at least one wiring pattern formed of a plurality of wirings, a semiconductor chip positioned above the lower substrate and electrically connected to the wirings, an intermediate member which seals the semiconductor chip in columnar form and substantially, and an upper plate which substantially covers a whole upper surface of the intermediate member. A thermal expansion coefficient of the upper plate and a thermal expansion coefficient of the lower substrate are set substantially identical.

Abstract: A semiconductor device with a damascene wiring structure which can prevent short-circuits between a seal ring and a wiring line or electrode pad. An upper layer barrier layer made from a conductive barrier material film is formed on an interlayer insulating film groove sidewall of the semiconductor device. Embedded in the groove is an upper layer seal ring wiring line with thickness of approximately 10 micrometers for instance, in which a plurality of isolated pockets of insulators are disbursed. These isolated pockets of insulators are formed using the interlayer insulating film which forms the damascene wiring line. Additionally, a first upper layer groove wiring line and a second upper layer groove wiring line are formed in an element forming region, and an upper layer barrier layer is formed on the outside perimeter. The upper layer seal ring wiring line and both upper layer wiring lines all have damascene wiring structures.

Abstract: A semiconductor device with an ESD protection function has an SOI substrate, first to fourth diffusion layers, and a gate. The SOI substrate has a semiconductor layer on an insulation layer. The first diffusion layer is of a first conductivity type and is formed on the semiconductor layer. The second diffusion layer is of the first conductivity type and is formed on the semiconductor layer. The third diffusion layer is of a second conductivity type and is formed on the semiconductor layer so as to be adjacent to the first and second diffusion layers. The fourth diffusion layer is of the second conductivity type and is formed on the semiconductor layer so as to be adjacent to the first diffusion layer and electrically connected to the second diffusion layer. The gate is formed over the third diffusion layer.