Patents Assigned to A & A Company
  • Patent number: 12066028
    Abstract: A fluid transfer pump assembly that includes a motor enclosure assembly that forms a motor cavity sized to receive a motor. The motor enclosure includes a flame path that extends from an interior joint to an exterior joint. The interior joint faces the motor cavity and the exterior joint faces exterior of the motor enclosure assembly. A heat sink is located in the motor cavity of the motor enclosure assembly. A portion of the heat sink abuts the interior joint.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: August 20, 2024
    Assignee: The Gorman-Rupp Company
    Inventors: Matthew Wenger, Nicholas G. Till, Wayne A. Hughes, Jacob J. Berry, Lester B. Ashe
  • Patent number: 12065951
    Abstract: An apparatus for assembling an engine includes an engine jig configured to load the engine on which a pump sprocket, a cam sprocket, an auto tensioner, and an engine belt are preliminarily mounted. The apparatus includes: a pump sprocket fastening unit disposed on a first die disposed on a first side of the engine jig and configured to clamp and fully fasten the pump sprocket in order to fixedly mount the pump sprocket preliminarily mounted to the engine; a cam sprocket fastening unit disposed on the first die and configured to clamp, rotate, and fully fasten the cam sprocket in order to fixedly mount the cam sprocket preliminarily mounted to the engine; and an auto tensioner fastening unit disposed on the first die, and configured to clamp, rotate, and fully fasten the auto tensioner in order to fixedly mount the auto tensioner preliminarily mounted to the engine.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: August 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Seung Yeop Lee, Chul Hyun Jang, Woojong Kim, Young Seok Lee
  • Patent number: 12069374
    Abstract: A method and an apparatus for determining a connection relation of subspaces, and a non-transitory computer-readable recording medium are provided. In the method, a plurality of sets of panoramic images respectively corresponding to two respective adjacent subspaces are obtained. Each set of the panoramic images includes two first panoramic images, and a second panoramic image photographed at a connection opening. Orientations of the connection openings are determined based on positions of the connection openings, and orientations of a camera. Relative positions of the two adjacent subspaces are determined based on correspondence relations between the two first panoramic images and parts of the respective second panoramic images. The connection relation of the subspaces is determined based on the connection relation determined based on the same subspace, the orientations of the connection openings, and the relative positions of the two adjacent subspaces.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: August 20, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Haijing Jia, Hong Yi, Liyan Liu, Wei Wang
  • Patent number: 12068398
    Abstract: A method, for making a semiconductor device, includes forming a first fin over a substrate. The method includes forming a dummy gate stack on the first fin. The method includes forming a first gate spacer along a side of the dummy gate stack. The first gate spacer includes a first dielectric material. The method includes forming a second gate spacer along a side of the first gate spacer. The second gate spacer includes a semiconductor material. The method includes forming a source/drain region in the first fin adjacent the second gate spacer. The method includes removing at least a portion of the second gate spacer to form a void extending between the first gate spacer and the source/drain region.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsu Ming Hsiao, Ming-Jhe Sie, Hsiu-Hao Tsao, Hong Pin Lin, Che-fu Chen, An Chyi Wei, Yi-Jen Chen
  • Patent number: 12068241
    Abstract: One or more embodiments of techniques or systems for forming a semiconductor structure are provided herein. A first metal region is formed within a first dielectric region. A cap region is formed on the first metal region. A second dielectric region is formed above the cap region and the first dielectric region. A trench opening is formed within the second dielectric region. A via opening is formed through the second dielectric region, the cap region, and within some of the first metal region by over etching. A barrier region is formed within the trench opening and the via opening. A via plug is formed within the via opening and a second metal region is formed within the trench opening. The via plug electrically connects the first metal region to the second metal region and has a tapered profile.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Ying-Ju Chen, Hsien-Wei Chen
  • Patent number: 12063909
    Abstract: An animal enclosure includes a door, a door frame, and a plurality of members each formed by a plurality of interconnecting horizontal and vertical wires. The door is movably coupled to the door frame between an open position and a closed position, where in any position except for the closed position an opening formed in the door frame is at least partially exposed to provide access to the interior of the enclosure. A clip is removably coupled to any one of the plurality of members. The clip includes a body formed by a first member, a top member, a base member, a second member, and a finger portion. The finger portion extends downward from the top member to define a first opening between the finger portion, the top member, and the first member.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: August 20, 2024
    Assignee: MID-WEST METAL PRODUCTS COMPANY, INC.
    Inventors: Brad Cantwell, Mark E. Watson, Michael Eric Greene
  • Patent number: 12066937
    Abstract: Techniques for flushing metadata involve: receiving a flushing request, the flushing request instructing to flush metadata in at least one cache region to a persistent storage device; acquiring a plurality of target indicators, the target indicator at least indicating a type of a cache region and a block in the cache region, where the plurality of target indicators are classified based on types of cache regions indicated by the target indicators among the plurality of target indicators; determining, from the plurality of target indicators, at least one target indicator of the same type as the at least one cache region; and flushing metadata in a block indicated by the at least one target indicator. Such techniques avoid flushing a cache region that does not need to be flushed, shortens the response time to the flushing request, and reduces the occupancy of system resources.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: August 20, 2024
    Assignee: EMC IP Holding Company LLC
    Inventors: Ming Zhang, Chen Gong, Qiaosheng Zhou
  • Patent number: 12064929
    Abstract: Disclosed herein are a repair apparatus, system, and method for a composite sandwich structure. The repair is suited for reinforcing a sandwich panel having a first sheet and a second sheet opposite the first sheet. A core is interposed between and coupled to the first sheet and the second sheet. The repair uses a potting compound packed into an abnormality of the core and located on the outer surface of the first sheet. A patch is coupled to the outer surface of the first sheet over the abnormality of the core and cured. The cured potting compound is interposed between and bonded to the patch and the abnormality of the core and bonded to the patch and the outer surface of the first sheet to form a structural reinforcement.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: August 20, 2024
    Assignee: The Boeing Company
    Inventors: Remmelt Andrew Staal, Justin H. Register, Ernie Fidgeon, Glory C. Edwards, Gregory J. Smith
  • Patent number: 12065614
    Abstract: Hydraulic fracturing fluids include an aqueous fluid, an acrylamide-based polymer, and a crosslinker that crosslinks the acrylamide-based polymer to form a crosslinked gel. The crosslinker includes a cellulose backbone functionalized with branch structures. The branch structures comprise oxiranylalkanol branches or polyoxiranylalkanol branches. Methods for preparing the hydraulic fracturing fluids and methods for treating subterranean formations with the hydraulic fracturing fluids are disclosed.
    Type: Grant
    Filed: April 3, 2023
    Date of Patent: August 20, 2024
    Assignees: Saudi Arabian Oil Company, King Fahd University of Petroleum and Minerals
    Inventors: Wengang Li, Bader Ghazi Al-Harbi, Majad Khan, Muhammad Nawaz Tahir
  • Patent number: 12066012
    Abstract: The present disclosure generally relates to harvesting geothermal energy from mature and near end-of-life oil and gas reservoirs that have been subjected to secondary oil recovery steam processes like steam-assisted gravity drainage (SAGD), steamflood, etc. The geothermal potential of these mature SAGD reservoirs can be used to generate green electricity thus reducing the greenhouse gas (GHG) footprint of the oil production. Lateral spacing of injectors and producers, with closing of unused members of a well-pair for energy recovery is described.
    Type: Grant
    Filed: August 21, 2023
    Date of Patent: August 20, 2024
    Assignee: CONOCOPHILLIPS COMPANY
    Inventors: Mohammad H. Kalaei, Benjamin Lascaud, Thomas J. Wheeler, Gustavo A. Gomez, Julian Ortiz Arango, Harish T. Kumar
  • Patent number: 12066276
    Abstract: A sabot including a first casing petal having at least one coupling feature and at least one disengagement feature; a second casing petal having at least one coupling feature and at least one disengagement feature; and a cap insertable within a forward receiver formed by coupling the first casing petal with the second casing petal, wherein the first casing petal and the second casing petal and the cap are configured to cooperatively attach to a forward assembly of a missile and cooperatively detach from the forward assembly of the missile responsive to a missile launch.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: August 20, 2024
    Assignee: Raytheon Company
    Inventors: John F. Bugge, Byron Terence Edgar
  • Patent number: 12068216
    Abstract: A multichannel transistor is provided. In the transistor, a plurality of gate fingers overlie a substrate and extend laterally across the substrate from a gate manifold. The gate manifold has a curved edge, and each of the gate fingers projects radially from the curved manifold edge.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: August 20, 2024
    Assignees: National Technology & Engineering Solutions of Sandia, LLC, Raytheon Company
    Inventor: Shahed Reza
  • Patent number: 12068023
    Abstract: A memory structure includes a first memory array having bit lines; a second memory array having bit lines; a first sense amplifier connected to a first bit line of the first memory array and a first bit line of the second memory array; and a second sense amplifier connected to a second bit line of the first memory array and a second bit line of the second memory array. The second bit line of the first memory array is adjacent to the first bit line of the first memory array, and the second bit line of the second memory array is adjacent to the first bit line of the second memory array.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chieh Lee, Yi-Ching Liu, Chia-En Huang, Wen-Chang Cheng, Jonathan Tsung-Yung Chang
  • Patent number: 12068721
    Abstract: Monolithic microwave integrated circuits (MMICs) tolerant to electrical overstress are provided. In certain embodiments, a MMIC includes a signal pad that receives a radio frequency (RF) signal, and an RF circuit coupled to the RF signal pad. The RF circuit includes a transistor layout, an input field-effect transistor (FET) implemented using a first portion of a plurality of gate fingers of the transistor layout, and an embedded protection device electrically connected between a gate and a source of the input FET and implemented using a second portion of the plurality of gate fingers. The MMIC is tolerant to electrical overstress events, such as field-induced charged-device model (FICDM) events.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: August 20, 2024
    Assignee: Analog Devices International Unlimited Company
    Inventors: Srivatsan Parthasarathy, Javier A. Salcedo, Miguel Chanca
  • Patent number: 12067702
    Abstract: A system for inspecting a tube can comprise a first image acquisition device that is configured to capture at least one image of the first end of the tube. A second image acquisition device can be configured to capture at least one image of at least a portion of the outer surface of the circumferential wall of the tube. A first conveyor can be configured to position the tube so that the first image acquisition device can capture the at least one image of the first end of the tube and the second image acquisition device can capture the at least one image of at least a portion of the circumferential wall of the tube. A computing device can be configured to determine, based on the at least one image from the first image acquisition device or the at least one image from the second image acquisition device, if the tube has a flaw.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: August 20, 2024
    Assignee: Columbia Insurance Company
    Inventor: Joel Corn
  • Patent number: 12063950
    Abstract: Food products and the processes for forming/manufacturing the food products are disclosed. An exemplary food product comprises one or more extruded components (e.g., vegetable, fruit, dairy, meat, flavoring, spice, coloring, particulate, or combinations thereof); and one or more extruded collagen layers substantially encasing the extruded component(s). Another exemplary food product is disclosed as comprising an extruded component; and a carrier co-extruded with the first extruded component, the carrier comprising a matrix adhered to the first extruded component and an additive suspended in the matrix.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: August 20, 2024
    Assignee: The Hillshire Brands Company
    Inventors: Joshua S. Carlson, Yelena Y. Pinkevich, Barbara K Schmitt, Dejing Fu, Glenn Wille
  • Patent number: 12066329
    Abstract: An optical device is disclosed and includes an optical sensor, a plurality of photosensitive pixels disposed on the optical sensor, a wavelength-selective optical filter in optical communication with the photosensitive pixels, and a plurality of spatially-variant written regions disposed in the optical filter, the written regions having a transmission spectrum and each of the written regions being larger than each of the pixels.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 20, 2024
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: John A. Wheatley, Mark A. Roehrig, Audrey A. Sherman, Del R. Lawson, Gilles J. Benoit, Daniel J. Schmidt, Jonah Shaver, Raymond J. Kenney, Zhaohui Yang
  • Patent number: 12065201
    Abstract: A method of manufacturing a movable object is provided. The method includes a preparation step of preparing a wheel, a steering part including a wheel rod connected to the wheel and a steering motor rotating the wheel rod to steer the wheel, and a cover part including a receiving member in which a portion of the steering part is received. The method further includes an engagement step of joining the steering part and the cover part by engaging the steering part with the receiving member. The method additionally includes a disengagement step of disengaging the steering part from the cover part by separating the steering part from the receiving member. In the engagement step, the steering part and the cover part are joined by driving the steering motor to rotate the wheel rod in one direction.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: August 20, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Seok Ryung Kwon, Hyeon Sik Shin, Pan Keun Baek, Jun Hwan Park, Hun Keon Ko
  • Patent number: 12065681
    Abstract: Ribulose-1,5-bisphosphate oxygenase (RuBisCO) protein fibers and a method of producing them are disclosed herein. The method of producing one or more RuBisCO protein fibers including obtaining RuBisCO, tbr example from tobacco, combining the RuBisCO with one or more plasticizers, heating the combination of the RuBisCO and the one or more plasticizers up to about 140 degrees C., filtering the heated combination through an about 20 ?m filter, and passing the filtered combination through an orifice to produce one or more RuBisCO protein fibers.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: August 20, 2024
    Assignee: R.J. Reynolds Tobacco Company
    Inventors: Andries Don Sebastian, John Paul Mua, David Neil McClanahan, Sammy Eni Eni, Thaddeus J. Jackson
  • Patent number: 12068032
    Abstract: Various embodiments of the present application are directed towards an integrated memory chip with an enhanced device-region layout for reduced leakage current and an enlarged word-line etch process window (e.g., enhanced word-line etch resiliency). In some embodiments, the integrated memory chip comprises a substrate, a control gate, a word line, and an isolation structure. The substrate comprises a first source/drain region. The control gate and the word line are on the substrate. The word line is between and borders the first source/drain region and the control gate and is elongated along a length of the word line. The isolation structure extends into the substrate and has a first isolation-structure sidewall. The first isolation-structure sidewall extends laterally along the length of the word line and underlies the word line.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih Kuang Yang, Ping-Cheng Li, Hung-Ling Shih, Po-Wei Liu, Wen-Tuo Huang, Yu-Ling Hsu, Yong-Shiuan Tsair, Chia-Sheng Lin