Abstract: An interconnection structure, along with methods of forming such, are described. The interconnection structure includes a first portion of a conductive layer, and the conductive layer includes one or more graphene layers. The first portion of the conductive layer includes a first interface portion and a second interface portion opposite the first interface portion, and each of the first and second interface portion includes a metal disposed between adjacent graphene layers. The structure further includes a second portion of the conductive layer disposed adjacent the first portion of the conductive layer, and the second portion of the conductive layer includes a third interface portion and a fourth interface portion opposite the third interface portion. Each of the third and fourth interface portion includes the metal disposed between adjacent graphene layers. The structure further includes a dielectric material disposed between the first and second portions of the conductive layer.

Abstract: A device comprises a first chip comprising a first connection pad embedded in a first dielectric layer and a first bonding pad embedded in the first dielectric layer, wherein the first bonding pad comprises a first portion and a second portion, the second portion being in contact with the first connection pad and a second chip comprising a second bonding pad embedded in a second dielectric layer of the second chip, wherein the first chip and the second chip are face-to-face bonded together through the first bonding pad the second bonding pad.

Abstract: A drug delivery device includes a housing, a cartridge received within the housing, with the cartridge configured to receive a medicament, a drive assembly received within the housing and configured to engage the cartridge and dispense medicament from the cartridge, and a needle actuator assembly received within the housing, with the needle actuator assembly including a patient needle configured to pierce a patient's skin. A bottom surface of the housing defines a port interface configured to receive an implanted injection port.

Abstract: A charger device for charging one or more batteries of a vehicle operates in two different user selectable modes. One of the modes operates within a user selected time interval. The two different user selectable modes are a power mode and an economy mode. Both modes are operative until a battery threshold voltage is reached. Subsequently, the charger device performs constant voltage charging until a charging current attained is less than a set threshold current value.

Abstract: A method is provided for selecting a virtual object on a user terminal of a terminal. The method is performed by the terminal and includes: displaying the user interface; obtaining a predefined execution area of a first operation of a first virtual object within a virtual environment; obtaining a visible boundary scope of the virtual environment; determining, based on the predefined execution area and the visible boundary scope, an effective execution area of the first operation within the virtual environment; and determining, based on the effective execution area, a target virtual object.

Abstract: A lithium secondary battery comprising a cathode, an anode, an elastic and flame retardant composite separator disposed between the cathode and the anode, and a working electrolyte. The elastic flame retardant composite separator comprises a high-elasticity polymer and from 1% to 99% by weight of a flame retardant additive dissolved in, dispersed in, or bonded to the high-elasticity polymer. The composite separator has a thickness from 50 nm to 100 ?m and a lithium ion conductivity from 10?8 S/cm to 5×10?2 S/cm at room temperature and the high elasticity polymer has a fully recoverable tensile strain from 2% to 1,000% when measured without any additive dispersed therein. The polymer composite may further comprise particles of an optional inorganic solid electrolyte dispersed therein.

Abstract: A first semiconductor device and a second semiconductor device may be directly bonded using heterogeneous bonding layers. A first bonding layer may be formed on the first semiconductor device and the second bonding layer may be formed on the second semiconductor device. The first bonding layer may include a higher concentration of hydroxy-containing silicon relative to the second bonding layer. The second bonding layer may include silicon with a higher concentration of nitrogen relative to the first bonding layer. An anneal may be performed to cause a dehydration reaction that results in decomposition of the hydroxy components of the first bonding layer, which forms silicon oxide bonds between the first bonding layer and the second bonding layer. The nitrogen in the second bonding layer increases the effectiveness of the dehydration reaction and the effectiveness and strength of the bond between the first bonding layer and the second bonding layer.

Abstract: In some embodiments, the present disclosure relates to a method of forming an integrated chip. The method includes forming a bottom electrode layer over a substrate and forming a seed layer over the bottom electrode layer. A ferroelectric switching layer is formed over the bottom electrode layer and to contact the seed layer. The ferroelectric switching layer is formed to have a first region with a first crystal phase and a second region with a different crystal phase. A top electrode layer is formed over the ferroelectric switching layer. One or more patterning processes are performed on the bottom electrode layer, the seed layer, the ferroelectric switching layer, and the top electrode layer to form a ferroelectric random access memory (FeRAM) device.

Abstract: A semiconductor device includes a plurality of intermediate waveguides. The plurality of intermediate waveguides are vertically disposed on top of one another, and vertically adjacent ones of the plurality of intermediate waveguides are laterally offset from each other. When viewed from the top, each of the plurality of intermediate waveguides essentially consists of a first portion and a second portion, the first portion has a first varying width that increases from a first end of the corresponding intermediate waveguide to a middle of the corresponding intermediate waveguide, and the second portion has a second varying width that decreases from the middle of the corresponding intermediate waveguide to a second end of the corresponding intermediate waveguide.

Abstract: Semiconductor structures and methods of forming the same are provided. A semiconductor structure includes gate electrodes and first insulation patterns laterally disposed and alternately arranged on a substrate, a gate dielectric layer disposed on the gate electrodes and the first insulation patterns, at least one channel pattern disposed on the gate dielectric layer, source electrodes and drain electrodes laterally disposed and alternately arranged on the channel pattern, and second insulation patterns disposed on the channel pattern between the source and drain electrodes. Besides, from a top view, each of the drain electrodes is overlapped with one of the first insulation patterns.

Abstract: The invention relates to a nasally administrable composition comprising at least one active substance in magnesium-containing vesicular carrier, said carrier comprising glycol, phospholipids, water and at least one magnesium source. Methods for nasal administration of the composition, for example, for pain relief, are also provided.

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer.

Abstract: A magnetic field measuring apparatus includes an A/D conversion unit, an integration unit, and a post-processing unit. The A/D conversion unit is configured to sample a signal at a predetermined sampling frequency and perform conversion into digital data, the signal being based on an output voltage from a superconducting quantum interference device configure to detect a magnetic field emanating from a living organism. The integration unit is configured to obtain a biological magnetic field signal based on a value obtained by integrating the digital data, the biological magnetic field signal indicating a magnetic field emanating from the living organism. The post-processing unit is configured to perform decimation processing on the biological magnetic field signal output from the integration unit.

Abstract: A thermoplastic polymer composition comprises a polyethylene polymer composition and a salt of bicyclo[2.2.1]heptane-2,3-dicarboxylic acid. The polyethylene polymer composition can have a Melt Relaxation Index of 2 or greater. A method for molding a thermoplastic polymer composition comprises the steps of (a) providing an apparatus comprising a die with an annular orifice, a means for blowing pressurized fluid into a tube exiting the die orifice, and a means for drawing and collecting the tube; (b) providing the thermoplastic polymer composition described above; (c) heating the thermoplastic polymer composition to melt the thermoplastic polymer composition; (d) extruding the molten thermoplastic polymer composition through the die to form a tube; (e) blowing a pressurized fluid into the tube to inflate the tube while simultaneously drawing it; (f) allowing the film to cool; and (g) collecting the film.

Abstract: An interconnect structure includes a dielectric layer, a conductive feature, a conductive layer, a capping layer, a support layer and an etch stop layer. The conductive feature is disposed in the dielectric layer. A first portion of the conductive layer is disposed over the first conductive feature, and a second portion of the conductive layer is disposed over the dielectric layer. A first portion of the capping layer is in contact with the first portion of the conductive layer, a second portion of the capping layer is in contact with the second portion of the conductive layer, and a third portion of the capping layer is in contact with the dielectric layer. An air gap is defined by the support layer and the capping layer. The etch stop layer is disposed over the second portion of the conductive layer, the second portion of the capping layer and the support layer.

Abstract: A liquid discharge head includes a first head tank configured to store a liquid, a first intermediate chamber storing the liquid flowing from the first head tank, a second intermediate chamber storing the liquid flowing from the first intermediate chamber in a flow direction of the liquid, a second head tank storing a liquid flowing from the second intermediate chamber, a first communicating part communicating with the first head tank and the first intermediate chamber, a second communicating part communicating with the second head tank and the second intermediate chamber, and a discharge part configured to discharge a liquid supplied from the first intermediate chamber and the second intermediate chamber.

Abstract: Power grid of an integrated circuit (IC) is provided. A plurality of first power lines are formed in a first metal layer. A plurality of second power lines are formed in the first metal layer and parallel to the first power lines, and the first and second power lines are interlaced in the first metal layer. A plurality of third power lines formed in a second metal layer, and the third power lines are perpendicular to the first power lines. A plurality of fourth power lines are formed in the second metal layer and parallel to the third power lines, and the third and fourth power lines are interlaced in the second metal layer. Distances from each of the third power lines to two adjacent fourth power lines are different, and distances from each of the fourth power lines to two adjacent third power lines are the same.

Abstract: A determination is made that a backup of a database in an availability group provided by a relational database management system (RDBMS) should be performed. The availability group includes a node functioning as a primary node and hosting a primary replica of the database and one or more other nodes functioning as secondary nodes and hosting secondary replicas of the database. The availability group is a clusterless availability group in which the one or more other nodes functioning as secondary nodes are not available as automatic failover targets should the primary node become unavailable. A command is issued to a node in the availability group to obtain a globally unique identifier (GUID) of the availability group. The node is instructed to index a backup of the database against the GUID of the availability group.

Abstract: An embodiment device includes: a first dielectric layer; a first photonic die and a second photonic die disposed adjacent a first side of the first dielectric layer; a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the first dielectric layer and the second photonic die; a first integrated circuit die and a second integrated circuit die disposed adjacent the first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a second side of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; and a second dielectric layer disposed adjacent the second side of the first dielectric layer.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.