Patents Assigned to A & A Company
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Patent number: 12065742Abstract: A multilayered article is disclosed, the multilayered article including a thermosetting polymer material having at least one surface, a thermoplastic polymer layer deposited on the at least one surface of the thermosetting polymer material, a cold sprayed metal layer present on at least a portion of a surface of the thermoplastic polymer layer, at least one additional layer, the at least one additional layer sandwiching at least a portion of the cold sprayed metal layer between the additional layer and the thermoplastic polymer layer, where the thermoplastic polymer layer has a crystallinity of about 5% to about 60%. A method of providing a composite laminate structure is also disclosed.Type: GrantFiled: March 3, 2022Date of Patent: August 20, 2024Assignee: THE BOEING COMPANYInventors: Eric Alan Bruton, Christopher H. Childers, Kenneth W. Young
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Patent number: 12065505Abstract: The present invention provides novel antigen binding peptides, such as an antibody or antibody fragment, that specifically bind to selective FXIa inhibitors and/or dual inhibitors of FXIa, and plasma kallikrein. The present invention further relates to methods of reducing the antithrombotic effect of FXIa inhibitors by administering to a subject a pharmaceutically effective dose of the antigen binding peptides provided herein. In addition, the present invention provides detection reagents and methods for detecting the level of the inhibitors of FXIa in a biological sample.Type: GrantFiled: January 7, 2022Date of Patent: August 20, 2024Assignee: Bristol-Myers Squibb CompanyInventors: Joseph M. Luettgen, Lumelle Schneeweis, Ginger Chao Rakestraw, Christina Terragni, Andrew Karl Dilger, Jason Robert Pinckney, Steven Sheriff, Kevin Kish, Yongmi An, William R. Ewing, Stanley Richard Krystek, Jr., Aaron Paul Yamniuk
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Patent number: 12067690Abstract: An image processing method is provided. The method includes: encoding an input image based on an attention mechanism to obtain an encoding tensor set and an attention map set of the input image; obtaining an encoding result of the input image according to the encoding tensor set and the attention map set, the encoding result of the input image recording an identity feature of a human face in the input image; encoding an expression image to obtain an encoding result of the expression image, the encoding result of the expression image recording an expression feature of a human face in the expression image; and generating an output image according to the encoding result of the input image and the encoding result of the expression image, the output image having the identity feature of the input image and the expression feature of the expression image.Type: GrantFiled: October 8, 2021Date of Patent: August 20, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Tianyu Sun, Haozhi Huang, Wei Liu
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Patent number: 12067962Abstract: Systems and methods for dewatering slurries having relatively high solids content such as earthen slurries are disclosed. In some embodiments, one or more transducer devices configured for acoustic spectroscopy and/or electroacoustic spectroscopy are used to determine a parameter related to the particle size distribution (e.g., specific surfaced area) and/or zeta potential of the slurry.Type: GrantFiled: July 18, 2018Date of Patent: August 20, 2024Assignee: Vermeer Manufacturing CompanyInventors: Gregory Anderson, Brandon Storm, Andrew Strobel, Corey Lanoue, Tayte Askelsen, Samuel Edmund Whittome, Ross Peter Jones
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Patent number: 12068306Abstract: An integrated circuit (IC) device includes a substrate having opposite first and second sides, an active region over the first side of the substrate, a first transistor and a second transistor over the first side of the substrate, a first conductive pattern over the first side of the substrate, and a second conductive pattern under the second side of the substrate. The first conductive pattern electrically couples a first terminal of the first transistor to a second terminal of the second transistor. The second conductive pattern electrically couples the first terminal of the first transistor to the second terminal of the second transistor.Type: GrantFiled: May 4, 2023Date of Patent: August 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chung-Hui Chen, Tzu-Ching Chang, Cheng-Hsiang Hsieh
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Patent number: 12065147Abstract: A method of simultaneously estimating a movement and shape of a target vehicle using a preliminary distribution model of a tracklet may have high reliability in estimation performance even with a change in heading of the target vehicle while being implemented in real time by setting the preliminary distribution model defined by a small number of representative tracklet appearance points using a tracklet defined in an orthogonal coordinate system and a linear correspondence relationship between a preliminary distribution model of the tracklet and a central position of the target vehicle and performing many-to-one data association between tracklet outputs. The method of simultaneously estimating the movement and shape of the target vehicle using the preliminary distribution model of the tracklet is performed by a signal processing device configured to process signals emitted from a plurality of radars mounted at a host vehicle and reflected from the target vehicle.Type: GrantFiled: October 6, 2021Date of Patent: August 20, 2024Assignees: Hyundai Motor Company, Kia Corporation, Handong Global University Industry-Academic Cooperation FoundationInventors: Seul Ki Han, Dahye Ham, Boyoung Jung, Won-Sang Ra, Ui-Suk Suh
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Patent number: 12068383Abstract: A method includes forming a gate stack on a middle portion of s semiconductor fin, and forming a first gate spacer on a sidewall of the gate stack. After the first gate spacer is formed, a template dielectric region is formed to cover the semiconductor fin. The method further includes recessing the template dielectric region. After the recessing, a second gate spacer is formed on the sidewall of the gate stack. The end portion of the semiconductor fin is etched to form a recess in the template dielectric region. A source/drain region is epitaxially grown in the recess.Type: GrantFiled: July 18, 2022Date of Patent: August 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kuo-Cheng Chiang, Chi-Wen Liu, Ying-Keung Leung
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Patent number: 12068692Abstract: A multi slope output impedance controller is configured to vary the effective impedance Zeff_n of a power converter to reduce a current imbalance between power supplies in a masterless configuration of N parallel-connected power supplies while maintaining load regulation during start-up and steady-state operation. Generally speaking, the controller commands a high value of Zeff_n when Iout_n is low to facilitate current sharing and reduce current imbalance Ib between the power supplies and commands a low value of Zeff_n when Iout_n is high to improve load regulation.Type: GrantFiled: March 14, 2022Date of Patent: August 20, 2024Assignee: Raytheon CompanyInventors: Marty Perry, Robert J. Schaller
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Patent number: 12064927Abstract: A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the method includes causing a flow of the resin between the lay-up surface and the fibers. Yet further, the method includes curing the resin to form a cured resin, where the electronic component and the fibers are located in the cured resin. The composite material includes a resin having a shape based on a surface of a lay-up system. Additionally, the composite material includes fibers contained within the resin. Further, the composite materials includes at least one electronic component. The electronic component of the composite material is located in the resin based on a flow of the resin around the electronic component on the surface of the lay-up.Type: GrantFiled: November 8, 2018Date of Patent: August 20, 2024Assignee: The Boeing CompanyInventors: Matthew K. Fay, Keith D. Humfeld
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Patent number: 12064999Abstract: This invention relates to tire tread wear monitoring. A sacrificial magnet portion is arranged in a tread of the tire so that it undergoes wear along with the tread and generates a useful magnetic field signal indicative of remaining tread thickness. With a magnetic field sensor arranged on or in the tire, an overall magnetic field signal is measured, which includes the useful magnetic field signal, and a superimposed interfering magnetic field signal generated by magnetizable material contained in the tire. A non-sacrificial magnet portion is used to saturate the magnetizable material at least locally so as to make the interfering magnetic field signal sensed by the magnetic field sensor substantially independent of the useful magnetic field signal sensed by the magnetic field sensor. Further aspects of the invention relate to tires, e.g., vehicle tires, featuring a tire tread wear monitoring system.Type: GrantFiled: April 14, 2022Date of Patent: August 20, 2024Assignee: The Goodyear Tire & Rubber CompanyInventors: Yves Francois Claude Decoster, Pierre Felix Orlewski
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Patent number: 12063883Abstract: A grounds maintenance vehicle having a vehicle frame is disclosed. An implement is coupled to the vehicle frame and has a first implement end and a second implement end. A height selection tool is configured to select one vertical position of a plurality of selectable vertical positions, where each vertical position limits a distance between the implement and the vehicle frame. An implement angle selection tool has a manually engageable mechanism configured to change the elevation of one of the first implement end or the second implement end relative to the other of the first implement end or the second implement end. The implement angle selection tool is configured to fix the elevation of the first implement end relative the second implement end.Type: GrantFiled: April 14, 2021Date of Patent: August 20, 2024Assignee: EXMARK MANUFACTURING COMPANY INCORPORATEDInventors: Michael Shane Fredenburg, Justin Leigh Pryor, Frederick Aubrey Fugett, Kenneth Lloyd McConnell
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Patent number: 12065072Abstract: Disclosed is an auto aiming and auto leveling control system which simplifies initial aiming of a headlamp, and links an aiming process to a leveling process of the headlamp, so as to reduce manufacturing costs and to enable process automation.Type: GrantFiled: December 5, 2023Date of Patent: August 20, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Joon Bo Shim, Seung Woo Seo, Jae Joon Park, Seung Gyu Nam
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Patent number: 12065209Abstract: A vehicle headlight includes a housing and a central area within the housing configured to emit high beam illumination from a high beam light source and configured to emit low beam illumination from a low beam light source. A pair of flow-through vents open to a front side of the housing and open to a rear side of the housing. A pair of outboard areas within the housing include supplementary light sources. The pair of outboard areas are positioned outboard of the pair of flow-through vents of the vehicle headlight.Type: GrantFiled: July 11, 2023Date of Patent: August 20, 2024Assignee: Harley-Davidson Motor Company, Inc.Inventors: Kevin G. Darczuk, Michael C. Heit, Robert J. Brummond, Anthony N. Avallone
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Patent number: 12065417Abstract: Selective hydrogenation processes are disclosed that can upgrade impure feeds, such as those obtained from biomass and containing a number of small (e.g., 2-6 carbon atom) molecules having aldehyde and/or ketone carbon atoms. For example, whereas glycolaldehyde and its methylated derivative, hydroxyacetone (acetol) are both high value intermediates for certain downstream processing reactions, they are normally recovered in a condensate from pyrolysis of carbohydrates (e.g., aldose-containing sugars) together with glyoxal and its methylated derivative, pyruvaldehyde. The selective hydrogenation of these compounds bearing two carbonyl carbon atoms, without over-hydrogenation to ethylene glycol and propylene glycol, can increase the concentration of the desired intermediates. These beneficial effects of selective hydrogenation may be achieved through the use of a hydrogenation catalyst comprising noble metals such as Ru and Pt.Type: GrantFiled: January 9, 2020Date of Patent: August 20, 2024Assignee: ARCHER-DANIELS-MIDLAND COMPANYInventors: James Brazdil, Chi-Cheng Ma
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Patent number: 12064295Abstract: A surgical lighting system includes a light head housing, a handle, a camera, and an optical fiber cable. The light head housing includes a plurality of light emitting elements therein that are arranged to emit light downward to a region of interest. The handle is mounted to the light head housing and protrudes downward from the light head housing, the handle including a handle housing having a sufficient size to be gripped by the human hand. A camera is mounted within the handle housing, the camera having a field of view that encompasses at least a portion of the region of interest. An optical fiber cable extends from a location within the handle housing and to the light head housing, the optical fiber cable being configured to transmit optical video signals associated with video data captured by the camera to the light head housing.Type: GrantFiled: March 25, 2021Date of Patent: August 20, 2024Assignee: American Sterilizer CompanyInventors: Breese J. Watson, Gregory Turcovsky, Steven H. Rus
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Patent number: 12068962Abstract: Aspects of the disclosure provide methods and apparatuses for service offloading. In some examples, a processing circuitry of an electronic device detects that received information associated with a service flow satisfies a preset rule, and generates an offloading strategy that uses a first network address in the received information associated with the service flow as an offloading address. Then, the processing circuitry offloads a first uplink data packet associated with the service flow from a terminal device to an edge network according to the offloading strategy in response to a destination address of the first uplink data packet matching the offloading address. Non-transitory computer-readable storage medium counterpart embodiments are also contemplated.Type: GrantFiled: October 21, 2021Date of Patent: August 20, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventor: Zhuoyun Zhang
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Patent number: 12065895Abstract: A method for logging in a well is disclosed. The method includes securing a passive logging while levitating (PLWL) assembly to a bottomhole assembly (BHA) to form a logging assembly and running the logging assembly into a wellbore of the well. The method further includes detecting a deviation in the wellbore, detecting a fluid flow direction around the logging assembly in the wellbore, activating the PLWL assembly based, at least in part, on the deviation in the wellbore and the fluid flow direction, and levitating the logging assembly in a center of the wellbore. The method also includes determining whether the logging assembly has reached a target depth and performing logging in the well while the logging assembly is levitating in the center of the wellbore.Type: GrantFiled: October 20, 2022Date of Patent: August 20, 2024Assignee: SAUDI ARABIAN OIL COMPANYInventor: Mohamed Larbi Zeghlache
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Patent number: 12066757Abstract: A mask includes a reflective layer, an absorption layer and an absorption part. The absorption layer is disposed over the reflective multilayer. The absorption part is disposed in the reflective layer and the absorption layer, wherein an entire top surface of the absorption part is substantially flush with a top surface of the absorption layer.Type: GrantFiled: April 27, 2023Date of Patent: August 20, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chiang Tu, Chun-Lang Chen, Shih-Hao Yang, Jheng-Yuan Chen
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Patent number: 12068300Abstract: A chip-on-wafer-on-substrate (CoWoS) semiconductor assembly is formed which includes a chip-on-wafer (CoW) sub-assembly of integrated circuit (IC) dies mounted on an interposer, which is in turn mounted on a package substrate with a top metallization stack and a bottom metallization stack using bonding bumps connecting the backside of the interposer and the front side of the package substrate. The bonding bumps provide electrical connections between the ends of through-vias exposed at the backside of the interposer and the top metallization stack of the package substrate. The likelihood of certain failure mechanisms that can adversely affect CoWoS yield are reduced or eliminated by ensuring a total metal thickness of the top metallization stack is greater than a total metal thickness of the bottom metallization stack, but not so much greater as to induce cracking of the underfill material during curing thereof.Type: GrantFiled: February 25, 2022Date of Patent: August 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Wei Chang, Ju-Min Chen, Jyun-Lin Wu, Yao-Chun Chuang
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Patent number: D1039750Type: GrantFiled: October 25, 2022Date of Patent: August 20, 2024Assignee: Hunter Fan CompanyInventors: Brian Earl Lintner, Rochelle Wellhausen Grimm, Stephen David Michael Jones