Patents Assigned to A & A Company
  • Patent number: 12066173
    Abstract: Systems, methods, and apparatuses provide a light emitting device including one or more arrays of light emitting diodes attached to a first outward facing surface of a first substrate. The light emitting device further includes driver circuitry attached to a second outward facing surface of a second substrate. The light emitting device further includes a wire connection electrically coupling the first substrate and the second substrate such that the driver circuitry drives the one or more arrays of light emitting diodes. The light emitting device further includes an enclosure for housing the first substrate, the second substrate, and the wire connection.
    Type: Grant
    Filed: September 20, 2023
    Date of Patent: August 20, 2024
    Assignee: FEIT ELECTRIC COMPANY, INC.
    Inventors: Alan Feit, Gerardo Cisneros
  • Patent number: 12063878
    Abstract: A closure assembly includes a tank opening flange that surrounds a tank opening of a supply tank and a tank lid that covers the tank opening. The tank lid is operable between open and closed positions. A compression seal is attached to an underside of the tank lid and is disposed between the tank opening flange and the tank lid when the tank lid is in the closed position. A pair of guides are attached to opposite sides of the tank opening flange wherein each of the pair of guides defines a track opening to receive a plurality of sliding mechanisms attached to the tank lid. The track opening guides the sliding mechanisms and the tank lid around the tank opening flange such that the compression seal does not engage the tank opening flange when the tank lid is operated between the closed and open positions.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: August 20, 2024
    Assignee: DEERE & COMPANY
    Inventors: Kirk P. Hillard, Derryn Pikesh
  • Patent number: 12068246
    Abstract: Exemplary embodiments for redistribution layers of integrated circuit components are disclosed. The redistribution layers of integrated circuit components of the present disclosure include one or more arrays of conductive contacts that are configured and arranged to allow a bonding wave to displace air between the redistribution layers during bonding. This configuration and arrangement of the one or more arrays minimize discontinuities, such as pockets of air to provide an example, between the redistribution layers during the bonding.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yuan Li, Kuo-Cheng Lee, Yun-Wei Cheng, Yen-Liang Lin
  • Patent number: 12069493
    Abstract: A first vehicle communication terminal establishes a unicast link with a second vehicle communication terminal. The first terminal monitors communication quality of the unicast link. The first terminal determines, according to the communication quality of the unicast link, whether the unicast link fails. In accordance with a determination that the unicast link fails and does not recover in a preset time, the first terminal releases the unicast link.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: August 20, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventor: Tao Wang
  • Patent number: 12065261
    Abstract: Aspects of the disclosure provide solutions for automated air-to-air refueling (A3R) and assisted air-to-air refueling. Examples include: receiving a video frame; identifying an aircraft to be refueled from within the video frame; segmenting the video frame to generate a segmentation mask matching the aircraft within the video frame; based on at least the segmentation mask, determining a position of a fuel receptacle on the aircraft; determining a position of a boom tip of the aerial refueling boom; and controlling the aerial refueling boom to engage the fuel receptacle based on at least the position of the fuel receptacle and the position of the boom tip.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 20, 2024
    Assignee: The Boeing Company
    Inventors: Trent M. Kyono, Jacob Arthur Lucas, Jason Rock, Justin Cleve Hatcher
  • Patent number: 12063886
    Abstract: One or more information maps are obtained by an agricultural work machine. The one or more information maps map one or more agricultural characteristic values at different geographic locations of a field. An in-situ sensor on the agricultural work machine senses an agricultural characteristic as the agricultural work machine moves through the field. A predictive map generator generates a predictive map that predicts a predictive agricultural characteristic at different locations in the field based on a relationship between the values in the one or more information maps and the agricultural characteristic sensed by the in-situ sensor. The predictive map can be output and used in automated machine control.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: August 20, 2024
    Assignee: Deere & Company
    Inventors: Nathan R. Vandike, Bhanu Kiran Reddy Palla, Nathan E. Krehbiel, Duane M. Bomleny
  • Patent number: 12064873
    Abstract: A storage, retrieval and processing system for processing objects is disclosed. The storage, retrieval and processing system includes a plurality of storage bins, a plurality of destination bins, and a processing programmable motion device. The plurality of storage bins provides storage of a plurality of objects, where the plurality of storage bins are in communication with a gantry retrieval conveyance system for moving selected bins to a bin processing location. The plurality of destination bins are in communication with the gantry retrieval conveyance system for moving a selected destination bin to the processing location. The processing programmable motion device is at the processing location and is in communication with the gantry retrieval conveyance system. The processing programmable motion device includes an end effector for grasping and moving a selected object out of a selected storage bin and depositing the selected object in the selected destination bin.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: August 20, 2024
    Assignee: Berkshire Grey Operating Company, Inc.
    Inventors: Thomas Wagner, Kevin Ahearn, John Richard Amend, Jr., Benjamin Cohen, Michael Dawson-Haggerty, William Hartman Fort, Christopher Geyer, Jennifer Eileen King, Thomas Koletschka, Michael Cap Koval, Kyle Maroney, Matthew T. Mason, William Chu-Hyon McMahan, Gene Temple Price, Joseph Romano, Daniel Smith, Siddhartha Srinivasa, Prasanna Velagapudi, Thomas Allen
  • Patent number: 12064583
    Abstract: A connector assembly may include an inner housing and an outer housing surrounding the inner housing. The inner housing may include a fluid flow path extending between a proximal port and a distal port. An exterior surface of the inner housing may include a first electrically conductive exterior surface and a second electrically conductive exterior surface. An interior surface of the outer housing may include a first electrically conductive interior surface and a second electrically conductive interior surface. The outer housing may be configured to move radially and rotationally relative to the inner housing. A processer may determine, based on whether the electrically conductive exterior surfaces contact the exterior electrically conductive interior surfaces, radial data associated with a radial position of the outer housing relative to the inner housing and rotational data associated with a rotational position of the outer housing relative to the inner housing.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: August 20, 2024
    Assignee: Becton, Dickinson and Company
    Inventor: Zachary Jarrod Traina
  • Patent number: 12066658
    Abstract: An integrated optical device includes a substrate, a waveguide structure and a grating structure. The substrate has a waveguide region and a grating region adjacent to each other. The waveguide structure is disposed on the substrate in the waveguide region. The grating structure is disposed on the substrate in the grating region. In some embodiments, the grating structure includes grating bars and grating intervals arranged alternately, and widths of the grating bars of the grating structure are varied.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Feng-Wei Kuo, Wen-Shiang Liao
  • Patent number: 12064673
    Abstract: A set of golf clubs having a degree of loft and lie adjustability to provide improved distance gapping.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: August 20, 2024
    Assignee: Taylor Made Golf Company, Inc.
    Inventors: Justin M. Girard, Michael Scott Burnett, Jason Sulak
  • Patent number: 12065393
    Abstract: The present invention relates to improvements in known gold containing catalysts. In particular, the present invention relates to improving the stability and/or inhibition of deactivation of gold containing catalysts via the addition of an inorganic oxide, hydroxide, oxo-salt or oxo-acid. There is also disclosed a method for preparing said catalyst most suitably via an impregnation method. Such catalysts are useful in the production of vinyl chloride monomer.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: August 20, 2024
    Assignee: JOHNSON MATTHEY PUBLIC LIMITED COMPANY
    Inventors: Nicholas Carthey, Peter Johnston
  • Patent number: 12065006
    Abstract: A suspension for a vehicle is configured such that, even in a situation of departing from a range (spring freedom height) in which a coil spring may be tensioned as a rebound state is added in a full rebound state, a lower end of the coil spring is coupled to a spring pad coupled to a leaf spring and continuously supported, so that the separation of the coil spring connecting a suspension arm to a body member may be prevented. The suspension includes the leaf spring provided at the suspension arm connecting a body frame to a knuckle; a spring pad coupled to the leaf spring; and the coil spring supported, at opposite ends of the coil spring, by the body member and the spring pad, the body member being located above the suspension arm.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: August 20, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Jae Hyun Cho, Sang Hoon Yoo
  • Patent number: 12068376
    Abstract: Integrated semiconductor devices and method of making the integrated semiconductor are disclosed. The integrated semiconductor device may include a first transistor comprising a first gate and at least one first active region, a second transistor comprising a second gate and at least one second active region, wherein the second transistor is spaced a first distance from the first transistor, a dielectric sidewall spacer formed on a gate sidewall of the first transistor and a gate sidewall of the second transistor, a first dielectric layer formed over the first transistor and the second transistor, wherein a thickness of the first dielectric layer is greater than half the first distance, and a patterned metal layer formed on the first dielectric layer and partially covering the second gate.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chien-Hung Lin, Tsai-Hao Hung
  • Patent number: 12064921
    Abstract: Disclosed is a sealing member for a build unit of a 3D printing system, the build unit comprising a surface which is exposed to residual build material in use. The sealing member is adapted to engage with the build unit and form therewith a sealed fluid flow path comprising an inner surface including said surface, a fluid inlet and a fluid outlet.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: August 20, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: David Chanclon Fernandez, Pablo Antonio Murciego Rodriguez, Jorge Diosdado Borrego
  • Patent number: 12067438
    Abstract: A tip cap assembly for coupling with a syringe body includes a luer lock adaptor, a rigid cap coupled to the luer lock adaptor; a rigid tip cap having distal end and proximal ends, the rigid tip cap being disposed at least partially within the rigid cap, a RFID tag positioned over the distal end of the tip cap, and an adhesive layer formed over the RFID tag. Also provided is RFID inlay for use with medical devices including a meshed substrate, and a RFID antenna and integrated circuit assembly adhered to the meshed substrate. A syringe and label assembly is disclosed, including a body having distal and proximal ends, a tip cap assembly having distal end and proximal ends, and a label at least partially surrounding the distal end of the syringe body and the proximal end of the tip cap, the label comprises an integrated RFID tag.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: August 20, 2024
    Assignees: Becton, Dickinson and Company, Becton Dickinson France
    Inventors: Alfred Leibbrand, Nicolas Euvrard, Cédric Rivier, Gwenn Le Dimet, Damien Maréchal, Thierry Vasquez
  • Patent number: 12064970
    Abstract: A liquid discharge device includes a liquid discharge head and a head tank. The head tank stores liquid to be supplied to the liquid discharge head. The head tank includes a body, a film, and a cover. The body includes a hole. The film covers the hole and includes a fixed portion fixed to the body. The cover contacts the film from an outer surface of the film. The cover includes a fixing-side cover part to contact a portion adjacent to the fixing portion of the film. The fixing-side cover part includes a curved contact surface to contact the film.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: August 20, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventor: Takaya Kubodera
  • Patent number: 12068393
    Abstract: A method includes forming a dummy gate stack, forming a dielectric layer, with the dummy gate stack located in the dielectric layer, removing the dummy gate stack to form a opening in the dielectric layer, forming a metal layer extending into the opening, and etching back the metal layer. The remaining portions of the metal layer in the opening have edges lower than a top surface of the dielectric layer. A conductive layer is selectively deposited in the opening. The conductive layer is over the metal layer, and the metal layer and the conductive layer in combination form a replacement gate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Peng-Soon Lim, Cheng-Lung Hung, Mao-Lin Huang, Weng Chang
  • Patent number: D1039279
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: August 20, 2024
    Assignee: Colgate-Palmolive Company
    Inventor: Geoffrey Baldwin
  • Patent number: D1039622
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: August 20, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Min Jae Park, Jong Bok Lee, Seung Hyun Woo, Il Sun Song
  • Patent number: D1039674
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: August 20, 2024
    Assignee: Hunter Fan Company
    Inventor: Brian Earl Lintner