Patents Assigned to A & A Company
  • Patent number: 12066780
    Abstract: A fixing device includes an endless fixing rotator, a slide aid, a pressure rotator, a nip formation plate, a support, a heat source, and a reflector. The endless fixing rotator has flexibility. An inner circumferential surface of the fixing rotator slides over the slide aid. The pressure rotator contacts an outer circumferential surface of the fixing rotator. The nip formation plate is disposed inside the fixing rotator to contact the pressure rotator via the fixing rotator and the slide aid to form a nip between the fixing rotator and the pressure rotator. The nip formation plate has a thermal conductivity equal to or greater than 10 W/mK. The support supports the nip formation plate. The heat source is disposed inside the fixing rotator to heat the fixing rotator. The reflector reflects radiant heat from the heat source.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: August 20, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventors: Shogo Nakamoto, Arinobu Yoshiura, Daisuke Inoue
  • Patent number: 12064789
    Abstract: A representative sample of a primer and topcoat formulation (as shown in Table 5, for example) were each examined to compare their rheological behavior, with a blend of the topcoat and primer formulation (85% topcoat, 15% primer) used for comparison. The time and temperature dependence of the viscosity was measured on a strain-controlled rheometer using parallel plate geometry in dynamic mode, with an applied strain of 1% and 1 Hz frequency of oscillation. The data is represented as complex viscosity (Pa-s). For the primer and topcoat formulations, sample discs were prepared by compressing 0.3 g of the powder composition in a 13-mm plug mold at 1000 ram force for 15 seconds. Pressing was done at room temperature to avoid premature curing of the powder. The rheometer was set at 70° C. for sample loading. The gap was then set to 0.05 mm below the thickness of the pressed pellet to ensure contact with parallel plates.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: August 20, 2024
    Assignee: The Sherwin-Williams Company
    Inventors: Owen H. Decker, Thomas E. Reno, Robert D. Breitzman, Carlos A. Concha, Jeffrey D. Rogozinski
  • Patent number: 12065877
    Abstract: A manually-operated window treatment system includes a roller tube, a covering material, and a chain (e.g., a semi-rigid chain). The roller tube is supported at opposed ends thereof. The covering material is attached to the roller tube. The covering material is operable between a raised position and a lowered position via rotation of the roller tube. The chain is configured to be operated by a user to rotate the roller tube. The chain has a first minimum bend radius when bent in a first direction and a second minimum bend radius when bent in a second direction. The first minimum bend radius is less than the second minimum bend radius.
    Type: Grant
    Filed: January 30, 2021
    Date of Patent: August 20, 2024
    Assignee: Lutron Technology Company LLC
    Inventor: David A. Kirby
  • Patent number: 12066371
    Abstract: An apparatus for detecting a processing tool defect is provided. The apparatus includes a processing tool having a processing chamber configured to process a semiconductor wafer. The processing chamber includes a gas inlet and a gas outlet. An exhaust pipe is connected to the gas outlet of the processing chamber. A particle counter is configured to real-time measure a parameter of particles in the exhaust pipe. A method for detecting a processing tool defect is also provided in the present disclosure.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Wei-Da Kang
  • Patent number: 12068184
    Abstract: A calibration pod for calibrating a robotic wafer pod handling apparatus includes a pod body configured for handling by the robotic pod handling apparatus, at least one laser disposed on a bottom of the pod body, and a power module disposed on or in the pod body and operatively connected to power the at least one laser. In a manufacturing method, the pod body comprises a wafer carrier for carrying a cassette of semiconductor wafers, which has a bottom with a plurality of holes for aligning placement of the wafer carrier in a load port of a semiconductor device fabrication facility. The at least one laser here includes a plurality of lasers corresponding to the plurality of holes in the bottom of the wafer carrier, and each laser is mounted in a respective hole of the bottom of the wafer carrier.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company., Ltd.
    Inventor: Tzu-Chin Huang
  • Patent number: 12066439
    Abstract: The present disclosure provides methods and kits for detecting Group A Streptococcus in biological samples. More particularly, the present disclosure provides methods for enhancing the specificity and sensitivity of Group A Streptococcus immunoassays by including N-propionyl-D-glucosamine, 2-N-butanoyl-D-glucosamide, Bis-(2-(D-2-deoxy-glucosaminyl))-PEG3-amide, m-PEG4-glucosamine, m-PEG6-glucosamine, or m-PEG10-glucosamine. The methods and kits disclosed herein are thus useful for reliable and early diagnosis of streptococcal infections in a subject.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: August 20, 2024
    Assignee: Becton, Dickinson and Company
    Inventors: Michael D. Fiechtner, Huimiao Ren
  • Patent number: 12069039
    Abstract: Methods, apparatus, and processor-readable storage media for dynamically unifying disparate UI applications in a cloud native environment are provided herein.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: August 20, 2024
    Assignee: EMC IP Holding Company LLC
    Inventors: Anurag Sharma, Jo Ann Varble
  • Patent number: 12067347
    Abstract: A sentence generation method is provided for an electronic device. The method includes obtaining an input sequence, encoding the input sequence to obtain a sentence eigenvector, decoding the sentence eigenvector to obtain a first predetermined quantity of candidate sentence sequences, clustering the first predetermined quantity of candidate sentence sequences to obtain sentence sequence sets of at least two types, screening out a second predetermined quantity of candidate sentence sequences from the sentence sequence sets of at least two types, the second predetermined quantity of candidate sentence sequences including at least two sentence feature types, and determining an output sequence corresponding to the input sequence according to the second predetermined quantity of candidate sentence sequences.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: August 20, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yizhang Tan, Jiachen Ding, Changyu Miao
  • Patent number: 12068263
    Abstract: A method for fabricating memory devices includes forming a first portion of a memory device that includes a first device portion and one or more first interface portions. The first device portion includes a plurality of first memory strings, each of which includes a plurality of first memory cells vertically separated from one another. Each of the one or more first interface portions, laterally abutted to one side of the first device portion, includes a plurality of first word lines (WLs). The method further includes forming a plurality of first source lines (SLs) and a plurality of first bit lines (BLs) in the first device portion. The method further includes forming a first seal ring structure that laterally encloses both the first device portion and the first interface portion concurrently with forming the pluralities of SLs and BLs.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Han Lin, Chia-En Huang
  • Patent number: 12066217
    Abstract: A fuel-fired heating appliance comprises a fuel source, an air source, a chamber in which fuel and air mix, a burner downstream from the mixing chamber, an igniter proximate the burner, a heat exchanger, a blower and a flue pipe. An ambient air inlet may be defined by at least one of the outlet end of the blower and the flue pipe extending between the interior of the flue pipe and an area ambient to the flue pipe. A flow rate of combustion gas may be controlled to a level below a steady-state flow rate during appliance warm-up.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: August 20, 2024
    Assignee: Rheem Manufacturing Company
    Inventors: Shawn A. Reed, Mickey E. Batson, Michael D. Williams, Christopher R. Taylor, Tyson J. Cogburn
  • Patent number: 12068018
    Abstract: A memory device includes an array of memory cells and a plurality of peripheral circuits operably coupled to the memory array. A power control circuit may be configured to individually control an application of power to each of the plurality of peripheral circuits and the array of memory cells. Inserting a switch device across the different power domains to achieve the same sequential wake-up path for the peripheral circuits connected to different power domains reduces peak current.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Ju Yeh, Hau-Tai Shieh, Yi-Tzu Chen
  • Patent number: 12065585
    Abstract: Described herein are static dissipating coatings and thermally-stable static-controlled (TSSC) electronic circuits, comprising such coatings. Also described herein are methods of forming such coatings and circuits. In some examples, a static dissipating coating comprises a conductive polymer and a thermally-stable base polymer. The conductive polymer comprises polyaniline and, in some examples, a conductive agent, such as dinonylnaphthalene sulfonic acid (DNNSA), dodecyl benzene sulfonic acid (DBSA), and/or camphor sulfonic acid (CSA). The thermally-stable base polymer comprises one or more copolymers of butyl-methacrylate, such as poly-butylmethacrylate-co-methyl methacrylate (PBM). The amount of the conductive polymer is specifically controlled to ensure the coating's overall conductivity and thermal stability. In some examples, the conductive polymer concentration is at or less than 25% by weight. The conductivity of the coating is between 10?9 S/cm and 10?6 S/cm even after being exposed to 150° C.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: August 20, 2024
    Assignee: The Boeing Company
    Inventor: Patrick John Kinlen
  • Patent number: 12069863
    Abstract: A first conductive pillar is formed. A plurality of second conductive pillars are formed at different sides of the first conductive pillar. A plurality of dielectric pillars are respectively formed between the first conductive pillar and the plurality of second conductive pillars. A channel layer is formed to continuously surround the first conductive pillar, the plurality of second conductive pillars and the plurality of dielectric pillars. A memory material layer is formed to surround the channel layer.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Wei Jiang, Sheng-Chih Lai, TsuChing Yang, Hung-Chang Sun, Kuo-Chang Chiang
  • Patent number: 12068218
    Abstract: A package structure includes a semiconductor package, a thermal conductive gel, a thermal conductive film and a heat spreader. The thermal conductive gel is disposed over the semiconductor package. The thermal conductive film is disposed over the semiconductor package and the thermal conductive gel. A thermal conductivity of the thermal conductive film is different from a thermal conductivity of the thermal conductive gel. The thermal conductive film is surrounded by the heat spreader.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Chin-Fu Kao, Szu-Wei Lu
  • Patent number: 12063877
    Abstract: An agricultural machine includes a main frame, an adjustable frame coupled to the main frame and, a row unit which includes a linking arm coupled to the adjustable frame, and an actuator coupled to the main frame and the adjustable frame. The agricultural machine also includes a controller configured to command the actuator to output various downforces to the row units based on signals received from one or more sensors. The one or more sensors are configured to measure one more indicators associated with an actual height of the row unit relative to ground.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: August 20, 2024
    Assignee: DEERE & COMPANY
    Inventors: Grant J. Wonderlich, Colter W. Kinney, Bradley A. Wackerle, Nathan A. Mariman, James R. Peterson, Randall A. Maro, Kenneth E. Herrmann
  • Patent number: 12068273
    Abstract: A package includes a die and a redistribution layer. A top surface of the die has a first area and a second area connected with the first area. The redistribution layer structure includes a first insulation layer, a redistribution layer, and a second insulation layer. The first insulation layer is overlapping with the second area. The redistribution layer is disposed above the die. The second insulation layer is disposed above the redistribution layer and overlapping with the second area and the first area. The second insulation layer covers a top surface of the first insulation layer and is in contact with a side surface of the first insulation layer and the top surface of the die.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tian Hu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 12065102
    Abstract: A vehicle includes: a camera disposed on left and right sides of an exterior of the vehicle and configured to acquire image data by photographing a surrounding area of the vehicle. A controller is configured to, upon a touch of a user on a door handle of a driver door being identified based on image processing on the image data, determine a height of the user based on the image processing on the image data and to adjust positions of a driver's seat, a steering wheel, and a head up display (HUD) to correspond to the determined height of the user.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: August 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Seungkyu Kang, Heongseok Kim
  • Patent number: 12067826
    Abstract: Technologies are disclosed herein for providing content management for deploying and updating a fleet of resources. A system for providing content management may include a web server or other apparatus configured to receive a local content request from a local device of a fleet of resources, the local content request comprising a canonical uniform resource locator (URL) that uniquely identifies the local device. The web server may be further configured to analyze the local content request to determine if the URL matches one or more rewrite rules, formulate a response to the local content request based on the analyzing, and transmit the formulated response.
    Type: Grant
    Filed: July 5, 2021
    Date of Patent: August 20, 2024
    Assignee: The Coca-Cola Company
    Inventor: Andrew Jarnagin
  • Patent number: 12068318
    Abstract: Semiconductor structures and methods are provided. A method according to the present disclosure includes providing a workpiece that includes a plurality of active regions including channel regions and source/drain regions, and a plurality of dummy gate stacks intersecting the plurality of active regions at the channel regions, the plurality of dummy gate stacks including a device portion and a terminal end portion. The method further includes depositing a gate spacer layer over the workpiece, anisotropically etching the workpiece to recess the source/drain regions and to form a gate spacer from the gate spacer layer, forming a patterned photoresist layer over the workpiece to expose the device portion and the recessed source/drain regions while the terminal end portion is covered, and after the forming of the patterned photoresist layer, epitaxially forming source/drain features over the recessed source/drain regions.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Yang Huang, Yung Feng Chang, Tung-Heng Hsieh, Bao-Ru Young
  • Patent number: D1039621
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: August 20, 2024
    Assignee: WING HING MANUFACTURING COMPANY LIMITED
    Inventor: Lap Shun Lo