Abstract: A high voltage device includes a semiconductor substrate and a gate. The semiconductor substrate includes a first doped region having a first conductive type, a second doped region having a second conductive type, a third doped region having the second conductive type, a fourth doped region surrounding the third doped region and having the second conductive type, and a fifth doped region surrounding the third doped region and having the second conductive type. The gate is disposed between two spacers to separate the second doped region from the third doped region, so as to control the conduction of the second doped region and the third doped region. In the high voltage device, the fifth doped region surrounds the third doped region, so as to strengthen the coverage for the third doped region and improve the ion concentration uniformity on the bottom of the third doped region to reduce leakage current.

Abstract: A low voltage triggering silicon controlled rectifier (LVTSCR) is disclosed. The LVTSCR utilizes an added resistor disposed in a second doped region between the anode of the LVTSCR and the emitter of the parasitical bipolar PNP transistor to increase the holding voltage thereof when the LVTSCR is triggered. The LVTSCR includes a semiconductor substrate with a first conductive type and a gate. The semiconductor substrate includes a first doped region with a second conductive type, a second doped region with the first conductive type, a third doped region with the second conductive type, a fourth doped region with the second conductive type and a fifth doped region with the first conductive type. The gate is applied with a lower triggering voltage to trigger the LVTSCR.

Abstract: The present invention discloses a DC-to-DC step-up converter to which a logic control unit is added in order to reduce the ripples of a DC output voltage and improve the power quality. The converter of the present invention comprises a step-up circuit, a ring oscillator, a divider circuit, a PFM (pulse frequency modulation) comparator and a logic control unit. The step-up circuit is used to step up a source voltage to generate a DC output voltage. The ring oscillator is used to generate an oscillator output signal. The divider circuit receives the DC output voltage to generate a feedback voltage. The PFM comparator compares the feedback voltage with a reference voltage to generate a comparator output signal to control outputting of the oscillator output signal.

Abstract: A semiconductor wafer includes a wafer body, a plurality of analog IC dies spacedly and alignedly formed on the wafer body to define a scribe line as a margin formed between each two dies wherein each of the dies has an internal circuit formed therewithin and at least a terminal pad formed along the scribe line, and a conductive arrangement including at least a conductive element formed on the wafer body to electrically connect the terminal pad with the internal circuit of the die in such a manner that when the die is cut off from the wafer body along the scribe line, the terminal pad is cut off from the die so as to keep the internal circuit in the die.