Patents Assigned to Advanced Micro Devices, Incs.
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Publication number: 20250110887Abstract: Preemptive flushing of data involved in executing a processing-in-memory command, from a cache system to main memory that is accessible by a processing-in-memory component, is described. In one example, a system includes an asynchronous flush controller that receives an indication of a subsequent processing-in-memory command to be executed as part of performing a computational task. While earlier commands of the computational task are executed, the asynchronous flush controller evicts or invalidates data elements involved in executing the subsequent processing-in-memory command from the cache system, such that the processing-in-memory command can proceed without stalling.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: David Andrew Werner, Travis Henry Boraten, Michael Warren Boyer
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Publication number: 20250110884Abstract: Systems and techniques for selectively transferring one or more portions of a cache block in response to a request are described. Computing system components are informed as to instances where data transfer operations involve moving less than an entirety of data included in a cache block cache block. In one example, executable code for a computational task includes hints that identify when memory requests involve accessing and transmitting less than an entirety of a cache block and cause system components to communicate a subset of the cache block during a memory access. In another example, a data differentiator unit is implemented to analyze a cache block and return a portion of the cache block that is selected based on one or more criteria specified for a computational task. The described techniques thus overcome conventional drawbacks facing systems that transmit an entire cache block when only a portion is needed.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Shaizeen Dilawarhusen Aga, Nuwan S. Jayasena, Michael J. Schulte, Srilatha Manne
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Publication number: 20250111585Abstract: A technique for building a bounding volume hierarchy is disclosed. The technique includes for a subject node, selecting a dimension along which to perform a split to form child nodes of the subject node; assigning primitives of the subject node to the child nodes; and updating bounds for the child nodes in a next split dimension and not in the other dimensions.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventor: Leo Hendrik Reyes Lozano
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Publication number: 20250111600Abstract: A technique for rendering is provided. The technique includes performing a visibility pass that designates portions of shade space textures visible in a scene, wherein the visibility pass generates tiles that cover shade space textures visible in the scene; performing a rate controller operation on output of the visibility pass using spatially-adaptive sampling; performing a sparse shade space shading operation on the tiles that cover the shade space textures visible in the scene based on a result of the spatially-adaptive sampling; performing a regularization operation based on an output of the sparse shade space shading operation; and performing a reconstruction operation using output from the regularization operation to produce a final scene.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Guennadi Riguer, Michal Adam Wozniak
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Publication number: 20250111006Abstract: Fast Fourier transforms for processing-in-memory are described. In accordance with the described techniques, a computing device includes a memory, a host processing unit, and a processing-in-memory unit that operates on data of one or more banks of the memory. The host processing unit stores interacting elements of a fast Fourier transform at locations in the one or more banks. The locations are mapped to a lane of the processing-in-memory unit. The host processing unit issues processing-in-memory commands instructing the processing-in-memory unit to load the interacting elements from the locations into the lane of the processing-in-memory unit, and execute an operation on the interacting elements.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Mohamed Assem Abd ElMohsen Ibrahim, Shaizeen Dilawarhusen Aga
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Publication number: 20250110792Abstract: In accordance with the described techniques, a host processor receives a task graph including tasks and indicating dependencies between the task graph. The host processor formats the task graph, in part, by sorting the tasks of the task graph in an order based on the dependencies between the tasks. Further, the host processor submits the formatted task graph to a scalable input/output virtualization (SIOV) device, which directs the SIOV device to process the tasks of the task graph based on the order.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Stephen Alexander Zekany, Anthony Thomas Gutierrez
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Publication number: 20250111587Abstract: Devices and methods for rendering objects using ray tracing are provided which include during a build time: generating an accelerated hierarchy structure comprising data representing an approximate volume bounding a group of geometric shapes representing the objects in the scene and data representing the geometric shapes; and generating additional data used to transform rays, to be cast in the scene, from a high precision space to a low precision space; and during a render time occurring after the build time: performing ray intersection tests, using the additional data generated during the build time, for the rays in the scene; and rendering the scene based on the ray intersection tests. Because the additional data is generated prior to render time, the additional data can be used to perform the ray intersection testing more efficiently.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Andrew Erin Kensler, Sean Keely, Michael John Livesley, David William John Pankratz
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Publication number: 20250110538Abstract: The disclosed device includes a processing component having various compute blocks, and a control circuit that switches at least one of the compute blocks from a normal voltage rail for the processing component to a second voltage rail in response to power gating a normal voltage rail. Various other methods, systems, and computer-readable media are also disclosed.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Meeta Surendramohan Srivastav, Indrani Paul, Akila Subramaniam
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Publication number: 20250112470Abstract: The disclosed device includes power circuits that can communicate with a control circuit. In response to a power circuit communicating a low efficiency state, the control circuit can redistribute at least a portion of a load of the power circuit to one or more other power circuits. Various other methods, systems, and computer-readable media are also disclosed.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: David King Wai Li, Indrani Paul
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Publication number: 20250110898Abstract: Method and apparatus for collaborative memory accesses is described. A system includes a memory controller that receives a command from a host. The command is associated with at least one of a plurality of data elements. The memory controller causes execution of data casting operations that adjust a bit size of the plurality of data elements to generate casted data elements. The system includes an interface for communicating data between the host and a memory.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Shaizeen Dilawarhusen Aga, Mahzabeen Islam, Nuwan S. Jayasena
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Publication number: 20250112113Abstract: A method can include embedding one or more thermal sources in a semiconductor package substrate and positioning one or more substrate buildup layers above the one or more thermal sources. The method can also include forming one or more thermal vias in the one or more substrate buildup layers. Various other methods and systems are also disclosed.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Sriram Chandrasekaran, Hemanth Kumar Dhavaleswarapu, Robert Grant Spurney
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Publication number: 20250112389Abstract: A data interface connector and method of manufacture and/or assembly thereof can include first electrical terminals at a first end of the data interface connector, the first electrical terminals being configured to interface with a mating data interface connector conforming to a first data interface specification. The data interface connector and method of manufacture and/or assembly thereof can include second electrical terminals at a second end of the data interface connector, the second electrical terminals being configured to interface with data interface pads on a circuit board; where the data interface pads have pitches and lengths according to a second data interface specification.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventor: HaiFeng Gu
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Publication number: 20250112047Abstract: A hybrid bonding method includes fabricating plural semiconductor devices in a region of a bottom wafer adjacent to a front surface thereof, fusion bonding the front surface to a carrier substrate, thinning the bottom wafer opposite to the front surface to expose conductive regions of the semiconductor devices, forming a dielectric layer over a backside of the semiconductor devices, forming openings in the dielectric layer to expose the conductive regions, forming metal pads within the openings, dicing the bottom wafer and the carrier substrate to singulate the plural semiconductor devices, bonding the dielectric layer overlying the backside of the semiconductor devices to a dielectric layer overlying a front surface of a top wafer, bonding the metal pads within the openings in the dielectric layer to metal pads overlying the front surface of the top wafer, and removing the carrier substrate from the front surface of the bottom wafer.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Chandra Sekhar Mandalapu, Raja Swaminathan, Liwei Wang, John Wuu
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Publication number: 20250111582Abstract: A technique for rendering is provided. The technique includes determining a level of detail for a shade space texture and a screen space; shading the shade space texture having a resolution based on the level of detail; and for a reconstruction operation, performing sampling from the shade space texture, the sampling including a high frequency attenuation of samples of the shade space texture.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Boris Ivanovic, Guennadi Riguer, Michal Adam Wozniak
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Publication number: 20250110894Abstract: Scratchpad memory translation lookaside buffer techniques are described. In an implementation, the techniques described herein relate to a device including a memory management unit implemented in hardware of an integrated circuit to receive a mapping instruction from a mapping instruction source, the mapping instruction specifying a mapping between a virtual memory address and a physical memory address of a scratchpad memory and store a virtual-to-physical mapping entry in a translation lookaside buffer based on the mapping instruction.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventor: Mark Evan Wilkening
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Publication number: 20250110525Abstract: A computer-implemented method for enabling a feature of a semiconductor device can include receiving, by at least one processor of a semiconductor device, a command to enable a feature of the semiconductor device. The method can also include burning, by the at least one processor and in response to the command, an electronic fuse of the semiconductor device. Various other methods, systems, and computer-readable media are also disclosed.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Paul Blinzer, Maulik Ojas Mankad, Victor Ignatski, Ashish Jain, Gia Phan, Ranjeet Kumar
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Publication number: 20250111599Abstract: A technique for rendering is provided. The technique includes performing a visibility pass that designates portions of shade space textures visible in a scene, wherein the visibility pass generates tiles that cover the shade space textures visible in the scene; performing a temporal rate controller operation; performing a shade space shading operation on the tiles that cover the shade space textures visible in the scene based on a temporal shading rate output by the temporal rate controller operation, wherein only a subset of samples in the tiles that cover the shade space textures visible in the scene are shaded in the shade space shading operation; and performing a reconstruction operation using output from the shade space shading operation to produce a final scene.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Guennadi Riguer, Michal Adam Wozniak
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Publication number: 20250110819Abstract: Memory access validation for input/output operations using an interposer is described. In one or more implementations, an interposer is disposed logically between an input/output device and a memory. The interposer receives a plurality of requests from the input/output device to access the memory non-sequentially in association with an input/output operation. Responsive to each request, the interposer updates an accumulated error code using error-detection logic. Based upon the accumulated error code, the interposer outputs an I/O validity indicator.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventor: David Joseph Clinton
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Publication number: 20250110886Abstract: Speculative cache invalidation techniques for processing-in-memory instructions are described. In one example, a system includes a cache system including a plurality of cache levels and a cache coherence controller. The cache coherence controller is configured to perform a cache directory lookup using a cache directory. The cache directory lookup is configured to indicate whether data associated with a memory address specified by a processing-in-memory request is valid in memory. The system employs speculative evaluation logic to identify whether the data associated with the processing-in-memory request is stored in the cache system before the processing-in-memory request is transmitted to the cache coherence controller. If the data is stored in the cache system, the cache system locally invalidates or flushes the data to avoid stalling the processing-in-memory request during a cache directory lookup.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Travis Henry Boraten, Jagadish B. Kotra, David Andrew Werner
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Publication number: 20250110663Abstract: A data processor that is operable to be coupled to a memory includes a memory operation array, a controller, a refresh logic circuit, and a selector. The memory operation array is for storing memory operations for a first power state of the memory. The controller is responsive to a power state change request to execute a plurality of memory operations from the memory operation array when the first power state is selected. The refresh logic circuit generates refresh cycles periodically for the memory. The selector is for multiplexing the refresh cycles with the memory operations during a power state change to the first power state.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Jean J. Chittilappilly, Kevin M. Brandl, Jing Wang, Kedarnath Balakrishnan