Patents Assigned to Advanced Micro Devices, Incs.
-
Publication number: 20250103342Abstract: A method, apparatus and computer readable medium that use of a lightweight finite state machine (FSM) control flow block to enable limited execution of data-dependent control flow, thereby enhancing the control flow flexibility of array scale SIMD processors. In certain cases, the FSM block contains registers responsible for decoding and managing single global instructions into multiple local instructions that can incorporate data-dependent control flow.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Ryan Lynn Swann, Alexander Sean Underwood, Derrick A. Aguren, Karthik Ramu Sangaiah, Sumanth Gudaparthi, Rose R. Thompson
-
Publication number: 20250103517Abstract: A computer-implemented method for data communication bus address sharing can include selecting, by at least one processor, one of two or more peripheral devices sharing an address of a data communication bus. The method can additionally include modulating, by the at least one processor, a duty cycle of a clock signal transmitted over the data communication bus to the two or more peripheral devices, wherein the modulating causes a low period of the clock signal to satisfy a threshold condition for indicating selection of the selected one of the two or more peripheral devices. The method can also include performing, by the at least one processor using the address, data communication over the data communication bus with the selected one of the two or more peripheral devices. Various other methods, systems, and computer-readable media are also disclosed.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Applicant: Advanced Micro Devices, Inc.Inventors: KaiFei Zhao, LiLi Chen, JunDong Yang
-
Publication number: 20250107045Abstract: A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.Type: ApplicationFiled: September 21, 2023Publication date: March 27, 2025Applicant: Advanced Micro Devices, Inc.Inventors: Girish Anant Kini, Shardul Suresh Adkar, Salvador D. Jimenez, III, Mark Steinke, Ethan Cruz, Edgar Stone, Ahmed Mohamed Abou-Alfotouh
-
Publication number: 20250106403Abstract: The disclosed computer-implemented method for video encoding rate control can include governing, by at least one processor, a video encoding rate at least partly in response to video encoding quality information. The method can additionally include generating, by the at least one processor, an encoded video data bitstream based on input pixel data and according to the video encoding rate. The method can also include determining, by the at least one processor, the video encoding quality information based on reconstructed pixel data. Various other methods, systems, and computer-readable media are also disclosed.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Applicant: Advanced Micro Devices, Inc.Inventor: Jonathan Philip Bonsor-Matthews
-
Publication number: 20250104285Abstract: Devices and methods for rendering objects using ray tracing are provided which include generating a low resolution version of a high resolution mesh representing objects in the scene, determining points on curved surfaces of curved surface patches defined for one of triangles and bi-linear quadrangles of the low resolution version of the high resolution mesh, performing ray intersection testing by casting rays toward surfaces of the high resolution mesh which are approximated from new points calculated by offset values along interpolated normals from the points on the curved surfaces of the curved surface patches and rendering the objects in the scene based on the ray intersection testing.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Applicant: Advanced Micro Devices, Inc.Inventor: Holger Gruen
-
Publication number: 20250103371Abstract: The disclosed computing device can include host circuitry configured to provide a physical function and guest circuitry configured to provide a virtual function. The host circuitry is configured to dynamically assign request identifiers for accessing at least the host circuitry in a manner that allows the request identifiers to change on a command-to-command basis instead of a time-to-time basis that uses fixed value request identifiers in time slices. Various other methods, systems, and computer-readable media are also disclosed.Type: ApplicationFiled: September 22, 2023Publication date: March 27, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: JinYun Liu, Yinan Jiang, HaiJun Chang
-
Publication number: 20250102570Abstract: A disclosed technique includes based on a clock pattern, determining an enable configuration for setting enable signals for one or more multi-cycle paths of a hardware logic network; controlling a selector to set the enable configuration for the one or more multi-cycle paths; and executing testing operations for the hardware logic network with the one or more multi-cycle paths enabled according to the enable configuration.Type: ApplicationFiled: September 26, 2023Publication date: March 27, 2025Applicant: Advanced Micro Devices, Inc.Inventor: Nehal Patel
-
Publication number: 20250103360Abstract: A circuit design emulation system having a plurality of integrated circuits (ICs) includes a first IC. The first IC includes an originator circuit configured to issue a request of a transaction directed to a completer circuit. The request is specified in a communication protocol. The first IC includes a completer transactor circuit coupled to the originator circuit and configured to translate the request into request data. The first IC includes a first interface circuit configured to synchronize the request data from an originator clock domain to a transceiver clock domain operating at a higher frequency than the originator clock domain. The first IC includes a first transceiver circuit configured to convey the request data over a communication link that operates asynchronously to the originator clock domain.Type: ApplicationFiled: September 21, 2023Publication date: March 27, 2025Applicants: Advanced Micro Devices, Inc., Xilinx, Inc.Inventors: Ananta S. Pallapothu, Raghukul Bhushan Dikshit
-
Patent number: 12259767Abstract: Performance adaptation for an integrated circuit includes receiving, by a workload prediction system of a hardware processor, telemetry data for one or more systems of the hardware processor. A workload prediction is determined by processing the telemetry data through a workload prediction model executed by a workload prediction controller of the workload prediction system. A profile is selected, from a plurality of profiles, that matches the workload prediction. The selected profile specifies one or more operating parameters for the hardware processor. The selected profile is provided to a power management controller of the hardware processor for controlling an operational characteristic of the one or more systems.Type: GrantFiled: March 8, 2023Date of Patent: March 25, 2025Assignee: Advanced Micro Devices, Inc.Inventor: Julian Daniel John
-
Patent number: 12260120Abstract: An electronic device includes a processor that executes a guest operating system; a memory having a guest portion that is reserved for storing data and information to be accessed by the guest operating system; and an input-output memory management unit (IOMMU). The IOMMU writes, in the guest portion, information into guest buffers and/or logs used for communicating information from the IOMMU to the guest operating system. The IOMMU also reads, from the guest portion, information in guest buffers and/or logs used for communicating information from the guest operating system to the IOMMU.Type: GrantFiled: June 10, 2019Date of Patent: March 25, 2025Assignee: Advanced Micro Devices, Inc.Inventors: Maggie Chan, Philip Ng, Paul Blinzer
-
Patent number: 12260494Abstract: In response to receiving a scene description, a processing system generates a set of planes in the scene and a bounding volume representing a partition of the scene. Using the set of planes in the scene, a compute unit of an accelerated processing unit performs a spatial test on the bounding volume to determine whether the bounding volume intersects one or more planes of the set of planes in the scene. Based on the spatial test, the compute unit generates intersection data indicating whether the bounding volume intersects one or more planes of the set of planes in the scene. The accelerated processing unit then uses the intersection data to render the scene.Type: GrantFiled: September 30, 2022Date of Patent: March 25, 2025Assignee: Advanced Micro Devices, Inc.Inventors: Christopher J. Brennan, Matthaeus G. Chajdas
-
Publication number: 20250098184Abstract: A method for increasing capacitance density within an integrated passive device can include forming a first trench capacitor within a substrate, forming a second trench capacitor within an insulating layer overlying the substrate, and connecting the first and second trench capacitors through connection vias that extend through the insulating layer to form an integrated passive device (IPD) capacitor. A high capacitance density device can include a stacked and co-integrated architecture of two or more tiers of trench capacitors.Type: ApplicationFiled: September 20, 2023Publication date: March 20, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Arsalan Alam, Anadi Srivastava, Rajen Singh Sidhu, Alexander Helmut Pfeiffenberger, Liwei Wang
-
Publication number: 20250096161Abstract: A method for increasing capacitance density within an integrated passive device can include forming a first trench capacitor within a first insulating layer overlying a substrate, forming a second trench capacitor within a second insulating layer overlying the first insulating layer, and connecting the first and second trench capacitors through connection vias that extend through the second insulating layer to form an integrated passive device (IPD) capacitor. A high capacitance density device can include a stacked and co-integrated architecture of two or more such layers.Type: ApplicationFiled: September 20, 2023Publication date: March 20, 2025Applicants: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Arsalan Alam, Anadi Srivastava, Rajen Singh Sidhu, Alexander Helmut Pfeiffenberger, Liwei Wang
-
Publication number: 20250096136Abstract: A disclosed semiconductor device includes (1) a silicon stack comprising a front-side Back-End-of-Line (BEOL) stack and a back side BEOL stack, the front-side BEOL stack comprising a plurality of signal routes and the back-side BEOL stack comprising a plurality of power delivery routes, and (2) a plurality of auxiliary power paths formed within the front-side BEOL stack and electrically coupled to the plurality of power delivery routes of the back-side BEOL stack via a plurality of programmable switches, the plurality of power delivery routes, the plurality of programmable switches, and the plurality of auxiliary power paths forming a programmable power delivery network (PDN). Various other apparatuses, systems, and methods of operation are also disclosed.Type: ApplicationFiled: September 20, 2023Publication date: March 20, 2025Applicants: Advanced Micro Devices, Inc., Xilinx, Inc.Inventors: Divya Madapusi Srinivas Prasad, Gabriel H. Loh, Richard Schultz, Jeffrey Richard Rearick, Shidhartha Das, Suresh Ramalingam
-
Patent number: 12253892Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.Type: GrantFiled: March 25, 2022Date of Patent: March 18, 2025Assignee: Advanced Micro Devices, Inc.Inventors: Jerry Anton Ahrens, William Robert Alverson, Amitabh Mehra, Grant Evan Ley, Anil Harwani, Joshua Taylor Knight
-
Patent number: 12254527Abstract: A graphics processing unit (GPU) includes a plurality of programmable processing cores configured to process graphics primitives and corresponding data and a plurality of fixed-function hardware units. The plurality of processing cores and the plurality of fixed-function hardware units are configured to implement a configurable number of virtual pipelines to concurrently process different command flows. Each virtual pipeline includes a configurable number of fragments and an operational state of each virtual pipeline is specified by a different context. The configurable number of virtual pipelines can be modified from a first number to a second number that is different than the first number. An emulation of a fixed-function hardware unit can be instantiated on one or more of the graphics processing cores in response to detection of a bottleneck in a fixed-function hardware unit. One or more of the virtual pipelines can then be reconfigured to utilize the emulation instead of the fixed-function hardware unit.Type: GrantFiled: May 21, 2020Date of Patent: March 18, 2025Assignee: Advanced Micro Devices, Inc.Inventors: Timour T. Paltashev, Michael Mantor, Rex Eldon McCrary
-
Patent number: 12254353Abstract: In order to efficiently process graphics data, operations are performed including allocating a first set of resource slots for a first execution instance of a pipeline shader program; correlating the first set of resource slots with graphics pipeline passes; and on a second execution instance of the pipeline shader program, assigning resource slots, from the first set of resource slots, to the graphics pipeline passes, based on the correlating.Type: GrantFiled: December 28, 2021Date of Patent: March 18, 2025Assignees: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Zhuo Chen, Steven J. Tovey
-
Patent number: 12254077Abstract: An apparatus includes one or more processors that are configured to determine a pixel-by-pixel bounds for a perturbed image, generate an adversarial example using an adversarial example generation technique, and modify the adversarial example to generate the perturbed image based on the pixel-by-pixel bounds. When an initial perturbed image does not reside within the pixel-by-pixel bounds, the one or more processors adjust the initial perturbed image to generate the perturbed image by a Weber-Fechner based adversarial perturbation to reside within the pixel-by-pixel bounds. The one or more processors provide the perturbed image to a computing device in an image-based Completely Automated Public Turing Test to tell Computers and Humans Apart (CAPTCHA).Type: GrantFiled: December 10, 2019Date of Patent: March 18, 2025Assignee: Advanced Micro Devices, Inc.Inventors: Scott Moe, Nicholas Penha Malaya, Sudhanva Gurumurthi, Naman Maheshwari
-
Patent number: 12254195Abstract: Sparse matrix operations using processing-in-memory is described. In accordance with the described techniques, a processing-in-memory component of a memory module receives a request for a vector element stored at a first location in memory of the memory module. The processing-in-memory component identifies an index value for a non-zero element in a sparse matrix using a representation of the sparse matrix stored at a second location in the memory. The processing-in-memory component then outputs a result that includes the vector element by retrieving the vector element from the first location in memory using the index value.Type: GrantFiled: November 1, 2022Date of Patent: March 18, 2025Assignee: Advanced Micro Devices, Inc.Inventor: Matthew R Poremba
-
Patent number: 12254217Abstract: Systems, apparatuses, and methods for dynamically coalescing multi-bank memory commands to improve command throughput are disclosed. A system includes a processor coupled to a memory via a memory controller. The memory also includes processing-in-memory (PIM) elements which are able to perform computations within the memory. The processor generates memory requests targeting the memory which are sent to the memory controller. The memory controller stores commands received from the processor in a queue, and the memory controller determines whether opportunities exist for coalescing multiple commands together into a single multi-bank command. After coalescing multiple commands into a single combined multi-bank command, the memory controller conveys, across the memory bus to multiple separate banks, the single multi-bank command and a multi-bank code specifying which banks are targeted. The memory banks process the command in parallel, and the PIM elements process the data next to each respective bank.Type: GrantFiled: May 2, 2023Date of Patent: March 18, 2025Assignee: Advanced Micro Devices, Inc.Inventors: Johnathan Alsop, Shaizeen Dilawarhusen Aga