Patents Assigned to Advanced Micro Devices, Inc.
  • Publication number: 20250088193
    Abstract: A method for driver calibration in die-to-die interfaces can include calibrating a delay lock loop of a delay line unit cell, by at least one processor, based on drive and load conditions of one or more driver unit cells of a physical layer of a die-to-die interconnect. The method can additionally include generating a clock signal, by the at least one processor, based on the delay lock loop. The method can further include communicating data, by the at least one processor, over the die-to-die interconnect based on the clock signal. Various other methods and systems are also disclosed.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 13, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Srikanth Reddy Gruddanti, Debasish Dwibedy, Manoj N. Kulkarni, Prasant Kumar Vallur, Priyadarshi Saxena
  • Publication number: 20250086515
    Abstract: Techniques are disclosed for communicating between a machine learning accelerator and one or more processing cores. The techniques include obtaining data at the machine learning accelerator via an input/output die; processing the data at the machine learning accelerator to generate machine learning processing results; and exporting the machine learning processing results via the input/output die, wherein the input/output die is coupled to one or more processor chiplets via one or more processor ports, and wherein the input/output die is coupled to the machine learning accelerator via an accelerator port.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 13, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventor: Maxim V. Kazakov
  • Patent number: 12250379
    Abstract: A method and an apparatus for decoding an image are disclosed. A region of the image is selected and the decoding is selected region and associated metadata is performed. Pixels for a generated for a decoded image based on the decoded selected region and metadata.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: March 11, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Andrew S. Pomianowski, Konstantine Iourcha
  • Patent number: 12249519
    Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: March 11, 2025
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal
  • Patent number: 12248516
    Abstract: An accelerator device includes a first processing unit to access a structure of a graph dataset, and a second processing unit coupled with the first processing unit to perform computations based on data values in the graph dataset.
    Type: Grant
    Filed: February 8, 2024
    Date of Patent: March 11, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Ganesh Dasika, Michael Ignatowski, Michael J Schulte, Gabriel H Loh, Valentina Salapura, Angela Beth Dalton
  • Patent number: 12248789
    Abstract: Techniques are provided for executing wavefronts. The techniques include at a first time for issuing instructions for execution, performing first identifying, including identifying that sufficient processing resources exist to execute a first set of instructions together within a processing lane; in response to the first identifying, executing the first set of instructions together; at a second time for issuing instructions for execution, performing second identifying, including identifying that no instructions are available for which sufficient processing resources exist for execution together within the processing lane; and in response to the second identifying, executing an instruction independently of any other instruction.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: March 11, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Maxim V. Kazakov
  • Patent number: 12248423
    Abstract: An apparatus includes logic circuitry that selects a retag transaction identifier for an original transaction identifier of an incoming transaction request, based on a plurality of sub-groups of retag tracking data. Each sub-group of retag tracking data is associated with a corresponding sub-group of retag transaction identifiers in a group of retag transaction identifiers. The logic circuitry retags the incoming transaction request with the selected retag transaction identifier (ID) by replacing the original transaction identifier associated with the incoming transaction request and sends the retagged incoming transaction request to a target. A returned response is received from the target. The retag transaction ID in the returned response is removed and replaced with the original transaction ID before being sent as a reply to the requesting unit. Associated methods are also presented.
    Type: Grant
    Filed: February 2, 2023
    Date of Patent: March 11, 2025
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULC
    Inventors: Buheng Xu, Dong Yu, Philip Ng, Lianji Cheng
  • Patent number: 12250493
    Abstract: Machine learning-based multi-view video conferencing from single view video data, including: identifying, in video data, a plurality of objects; and generating a user interface comprising a plurality of first user interface elements each comprising a portion of the video data corresponding to one or more of the plurality of objects.
    Type: Grant
    Filed: May 25, 2023
    Date of Patent: March 11, 2025
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Roto Le
  • Publication number: 20250077320
    Abstract: A message passing interface processing system is described. In accordance with message passing logic, a node selects an affinity domain for communication of data associated with a message passing interface and selects a first rank of a first process of the message passing interface assigned to a first partition of the affinity domain as a first partition leader rank and an affinity domain leader rank. The node selects a second rank of a second process of the message passing interface assigned to a second partition of the affinity domain as second partition leader rank, receives the data at the first partition leader rank, and communicates the data from the first partition leader rank to the second partition leader rank.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Nithya Viswanathan Shyla, Manu Shantharam
  • Publication number: 20250077307
    Abstract: In accordance with the described techniques, a command processor processes a fiber graph that includes fibers each having one or more tasks and indicates dependencies between the fibers and between tasks within the fibers. As part of this, the command processor dispatches a task from a fiber for execution by a processing element array based on the fiber being enqueued in a ready queue and the dependencies of the task being resolved. While the task is dispatched and unexecuted by the processing element array, the command processor enqueues the fiber in a sleep queue. Further, the command processor enqueues the fiber in a check queue based on the one or more tasks of the fiber having been executed by the processing element array. Based on the fiber being in the check queue, the command processor enqueues a dependent fiber in the ready queue that depends from the fiber.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 6, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Ali Arda Eker, Martha Massee Barker, Anthony Thomas Gutierrez
  • Publication number: 20250077379
    Abstract: Techniques for performing memory operations are disclosed herein. The techniques include obtaining statistics for operation of a device, the statistics including either or both of performance statistics and memory access statistics; generating a plurality of visualizations of the statistics in one of an overlay mode or a scene annotation mode; and displaying the plurality of visualizations.
    Type: Application
    Filed: September 4, 2023
    Publication date: March 6, 2025
    Applicants: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Guennadi Riguer, Christopher J. Brennan
  • Patent number: 12242893
    Abstract: A system and method for ranking computing resources in a distributed computing marketplace is disclosed. Ranking may be based on the performance factors that the system predicts will have the greatest impact on the particular application the user plans to run. A performance database stores historical performance data for applications that have been executed on multiple different computer systems. The database is checked to see if the application, or one similar, has already been run on any of the computing systems participating in the distributed computing marketplace. If so, the existing performance data is used to predict which performance factors will have the greatest impact on the application. Those factors are then used to rank the available computing systems options for the user.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: March 4, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Max Alt, Gabriel Martin
  • Patent number: 12242325
    Abstract: Core activation and deactivation for a multi-core processor is described. In accordance with the described techniques, a processor having multiple cores operates using a first core configuration. A request to switch from the first core configuration to a second core configuration is received. Responsive to the request, a switch from the first core configuration to the second core configuration occurs by adjusting a number of active cores of the processor without rebooting.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: March 4, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: William Robert Alverson, Amitabh Mehra, Jerry Anton Ahrens, Grant Evan Ley, Anil Harwani, Joshua Taylor Knight
  • Patent number: 12242828
    Abstract: A compilation technique is provided. The technique includes including a first instruction into a first executable for a first auxiliary processor, wherein the first instruction specifies execution by the first auxiliary processor; and including a second instruction into the first executable, wherein the second instruction targets resources that have affinity with the first auxiliary processor.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: March 4, 2025
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Norman Vernon Douglas Stewart, Mihir Shaileshbhai Doctor, Mingliang Lin
  • Patent number: 12242407
    Abstract: An exemplary data fabric device comprises a first traffic moderator configured to receive traffic destined for a specific endpoint accessible via a plurality of data paths and divert the traffic from a first data path included in the data paths to a second data path included in the data paths. The exemplary data fabric device also comprises a first interconnect controller that resides within the second data path and is configured to forward the traffic to the specific endpoint via a first communication link to test a functionality of the first communication link. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 4, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Samuel Abraham Lipson, Eric Christopher Morton, Bryan P. Broussard, Vydhyanathan Kalyanasundharam
  • Patent number: 12242384
    Abstract: Methods, devices, and systems for prefetching data. First data is loaded from a first memory location. The first data in cached in a cache memory. Other data is prefetched to the cache memory based on a compression of the first data and a compression of the other data. In some implementations, the compression of the first data and the compression of the other data are determined based on metadata associated with the first data and metadata associated with the other data. In some implementations, the other data is prefetched to the cache memory based on a total of a compressed size of the first data and a compressed size of the other data being less than a threshold size. In some implementations, the other data is not prefetched to the cache memory based on the other data being uncompressed.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: March 4, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Pazhani Pillai, Harish Kumar Kovalam Rajendran
  • Patent number: 12243576
    Abstract: A method for performing stutter of dynamic random access memory (DRAM) where a system on a chip (SOC) initiates bursts of requests to the DRAM to fill buffers to allow the DRAM to self-refresh is disclosed. The method includes issuing, by a system management unit (SMU), a ForceZQCal command to the memory controller to initiate the stutter procedure in response to receiving a timeout request, such as an SMU ZQCal timeout request, periodically issuing a power platform threshold (PPT) request, by the SMU, to the memory controller, and sending a ForceZQCal command prior to a PPT request to ensure re-training occurs after ZQ Calibration. The ForceZQCal command issued prior to PPT request may reduce the latency of the stutter. The method may further include issuing a ForceZQCal command prior to each periodic re-training.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: March 4, 2025
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Jing Wang, Kedarnath Balakrishnan, Kevin M. Brandl, James R. Magro
  • Patent number: 12243578
    Abstract: A memory controller monitors memory command selected for dispatch to the memory and sends commands controlling a read clock state. A memory includes a read clock circuit and a mode register. The read clock circuit has an output for providing a hybrid read clock signal in response to a clock signal and a read clock mode signal. The read clock circuit provides the hybrid read clock signal as a free-running clock signal that toggles continuously, and as a strobe signal that is active only in response to the memory receiving a read command.
    Type: Grant
    Filed: December 20, 2023
    Date of Patent: March 4, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Aaron John Nygren, Karthik Gopalakrishnan, Tsun Ho Liu
  • Patent number: 12236529
    Abstract: Systems, apparatuses, and methods for implementing a discard engine in a graphics pipeline are disclosed. A system includes a graphics pipeline with a geometry engine launching shaders that generate attribute data for vertices of each primitive of a set of primitives. The attribute data is consumed by pixel shaders, with each pixel shader generating a deallocation message when the pixel shader no longer needs the attribute data. A discard engine gathers deallocations from multiple pixel shaders and determines when the attribute data is no longer needed. Once a block of attributes has been consumed by all potential pixel shader consumers, the discard engine deallocates the given block of attributes. The discard engine sends a discard command to the caches so that the attribute data can be invalidated and not written back to memory.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: February 25, 2025
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Christopher J. Brennan, Randy Wayne Ramsey, Nishank Pathak, Ricky Wai Yeung Iu, Jimshed Mirza, Anthony Chan
  • Patent number: 12237286
    Abstract: A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: February 25, 2025
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Rahul Agarwal