Abstract: A light emitting diode includes a first electrode, a second electrode, and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure out from the top of the epitaxial structure. A method for manufacturing the light emitting diode is also presented. The light emitting diode and the method increase lighting efficiency of the light emitting diode.

Abstract: A light emitting diode chip comprises a light emitting diode chip core and a coating layer. The coating layer covers side surfaces of the light emitting diode chip core. And a display composed of the light emitting diode chips is also provided.

Abstract: An LED die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer and the light emitting structure are formed on the structure that order. The substrate includes a first electrode, a second electrode and an insulating part. The insulating part is formed between the first electrode and the second electrode. The LED die further includes a second insulating layer and a metal layer which are formed around the pre-growth layer. The present disclosure includes a method for manufacturing the LED die.

Abstract: A light emitting device includes a base and a light emitting diode chip, the light emitting diode chip is formed on a top surface of the base, an outline of a projection of the light emitting diode chip projected on the top surface of the base is positioned in the top surface of the base. The light emitting device further includes a light reflecting portion, the light reflecting portion is formed on the top surface of the base, the light reflecting portion is defined around the light emitting diode chip, a height of the light reflecting portion is less than a height of the light emitting diode chip.

Abstract: An LED light source includes a connecting body and a mounting base. The mounting base includes a mounting platform having a top surface, and an LED unit connected to the top surface, the top surface having good heat-dissipating properties. The LED unit includes LEDs, an LED driving device, and a circuit board. The circuit board includes a first portion for mounting the driving device and a second portion for mounting the LEDs. The first portion is connected to the top surface. The second portion is bent away from the first portion; the LEDs being mounted to outer surface of the integral second portion.

Abstract: A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.

Abstract: A vertically shallow LED package structure includes at least one LED chip, a package layer, and a first cover layer. Each LED chip includes a first bottom surface. The package layer covers and wraps around each LED chip, and can absorb light emitted by each LED chip and emit light with a different preset wavelength. The package layer includes a second bottom surface facing the first bottom surface, a first side surface perpendicular to the second bottom surface, and a convex surface interconnecting the second bottom surface and the first side surface. The convex surface protrudes away from the LED chip. The convex surface can reflect the light with the preset wavelength towards the first side surface. The first cover layer covers the package layer and exposes the first side surface.

Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.

Abstract: A reflector configured for reflecting light emitted from a light emitting diode (LED) toward a desired area is provided. The reflector defines a groove therein for accommodating the LED. Light emitted from the LED is reflected by an inner surface of the reflector toward a desired area located below the reflector, wherein the light reflected out of the reflector travels along a direction opposite to the main emitting direction of the LED. An LED illumination device incorporating the reflector is also provided.

Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.

Abstract: A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.

Abstract: A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.

Abstract: A light emitting diode includes a first electrode, a second electrode and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure to emit out from the top of the epitaxial structure. This disclosure also relates to a method for manufacturing the light emitting diode. The light emitting diode and the method help solve the problem of low light efficiency of the light emitting diode.

Abstract: An LED die includes a base, and an N-typed semiconductor layer, an active layer and a P-typed semiconductor layer formed on the base that order. The LED die also includes an N-electrode and a P-electrode. The N-electrode is arranged on the N-typed semiconductor layer and electrically connected therewith. The P-electrode is arranged on the P-typed semiconductor layer and electrically connected therewith. The LED die further includes a barrier layer arranged between the P-typed semiconductor layer and the P-electrode. The barrier layer includes at least two materials of Cr, Ni and Ti. The at least two materials of Cr, Ni and Ti are stacked together to form the barrier layer.

Abstract: A light emitting diode (LED) bulb includes a connecting body, a lamp cap located at a first end of the connecting body, a mounting base located at a second end of the connecting body opposite to the first end, a plurality of LED modules mounted on the mounting base and a sheath assembled to the second end of the connecting body. The sheath includes a first portion and a second portion detachably engaged with the first portion to cooperatively define an enclosed space enclosing the mounting base and the LED modules therein.

Abstract: A light emitting diode (LED) die module includes an LED die and a guiding layer formed on the LED die. The guiding layer includes a first portion, a second portion and a third portion. The first portion and the second portion are positioned at two edges of the surface of the LED die opposite to each other. The third portion is connected between the first portion and the second portion and divides the surface into a first electrically connecting area and a second electrically connecting area. The first portion, the second portion and the third portion defines a first opening and a second opening. The first opening and the second opening face two opposite directions. The present disclose also provides an LED element with the LED die module and a method of manufacturing the LED die module.

Abstract: A light emitting diode module includes a substrate, a first soldering section, a second soldering section, a block and a light emitting diode die. The substrate has a top surface and includes a circuit structure. The block is formed on the top surface. The soldering section and the second solder section are formed on the top surface of the substrate and electrically connected with the circuit structure. The block is positioned between the first soldering section and the second solder section. A height of the block is larger than thicknesses of the first soldering section and the second soldering section. The light emitting diode die includes a first electrode and a second electrode being respectively electrically connected to the first soldering section and the second soldering section. The block is positioned between the first soldering section and the second soldering section.

Abstract: A fault detection circuit includes a micro processing unit configured to output a first pulse width modulation (PWM) signal, a driver electrically coupled to the micro processing unit, and a comparator configured to electrically connect the micro processing unit and the driver. The first PWM signal is configured to drive the driver to output a second PWM signal configured to drive the electrical device. The comparator is configured to compare the second PWM signal with a reference level to output a third PWM signal to the micro processing unit. The third PWM signal contains a number of high level signals and low level signals. The micro processing unit is configured to detect the number of the high level signals and the number of the low level signals during at least one time period to determine a status of an electrical device.

Abstract: A lens includes a substrate, a light concentrating portion mounted on the substrate. The substrate includes a first substrate and a second substrate, the light concentrating portion includes a first light concentrating portion and a second light concentrating portion. The first light concentrating portion extends outward from the first substrate, the second light concentrating portion extends outward from the second substrate. The first light concentrating portion has a first axis, the second light concentrating portion has a second axis. The first axis and the second axis are configured in an angle and intersect in an extending direction thereof.

Abstract: An LED die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer and the light emitting structure are formed on the structure that order. The substrate includes a first electrode, a second electrode and an insulating part. The insulating part is formed between the first electrode and the second electrode. The LED die further includes a second insulating layer and a metal layer which are formed around the pre-growth layer. The present disclosure includes a method for manufacturing the LED die.