Patents Assigned to Advanced Optoelectronic Technology
  • Patent number: 8466033
    Abstract: A light emitting diode comprises a substrate, a buffer layer, a semiconductor layer and a semiconductor light emitting layer. The buffer layer is disposed on the substrate. The semiconductor layer is disposed on the buffer layer. The semiconductor light emitting layer is disposed on the semiconductor layer. A plurality of voids is defined within the semiconductor layer. Each void encloses air therein. A method for manufacturing the light emitting diode is also provided. Light generated by the semiconductor light emitting layer toward the substrate is reflected by the voids to emit out of the light emitting diode.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: June 18, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Po-Min Tu, Shih-Cheng Huang, Shun-Kuei Yang, Chia-Hung Huang
  • Patent number: 8461619
    Abstract: An LED chip includes a substrate, a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer, a first electrode and a second electrode formed on the substrate in sequence. A surface of the first type semiconductor layer away from the substrate comprises an exposed first area and a second area covered by the light-emitting layer. The first electrode is formed on the exposed first area of the substrate. A number of recesses are defined in the second area of the surface of the first type semiconductor layer. The recesses are spaced apart from each other and arranged in sequence in a direction away from the first electrode; depths of the recesses gradually decrease following an increase of a distance between the recesses and the first electrode. The second electrode is formed on the second type semiconductor layer.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: June 11, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chia-Hung Huang, Shih-Cheng Huang, Po-Min Tu, Shun-Kuei Yang
  • Patent number: 8459838
    Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: June 11, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh
  • Patent number: 8461666
    Abstract: A gallium nitride-based semiconductor device includes a composite substrate and a gallium nitride layer. The composite substrate includes a silicon substrate and a filler. The silicon substrate includes a first surface and a second surface opposite to the first surface, and the first surface defines a number of grooves therein. The filler is filled into the number of grooves on the first surface of the silicon substrate. A thermal expansion coefficient of the filler is bigger than that of the silicon substrate. The gallium nitride layer is formed on the second surface of the silicon substrate.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: June 11, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Po-Min Tu, Shih-Cheng Huang, Shun-Kuei Yang, Chia-Hung Huang
  • Patent number: 8455274
    Abstract: A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: June 4, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin, Wen-Liang Tseng
  • Patent number: 8455275
    Abstract: A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: June 4, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Meng-Hsien Hong, Wen-Liang Tseng, Hsin-Tung Chiang, Pin-Chuan Chen
  • Patent number: 8455901
    Abstract: An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of each LED are connected to those of adjacent LEDs to electrically connect the LEDs in series or in parallel.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: June 4, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shiun-Wei Chan, Chih-Hsun Ke
  • Patent number: 8450765
    Abstract: An LED chip includes a transparent substrate and a number of lighting structure units each including a p-type semiconductor and an n-type semiconductor and a recess extending from the p-type semiconductor to the n-type semiconductor. The recess is filled with metal material which covers the surface of the lighting structure units. By filling the recess with metal material, the heat generated by the lighting structure units can rapidly transfer to the metal material. A method for manufacturing the light emitting diode chip is also provided.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: May 28, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chia-Hui Shen, Tzu-Chien Hung
  • Patent number: 8450749
    Abstract: A light emitting element includes a substrate, a GaN layer formed on the substrate, a first low refractive index semiconductor layer formed on the GaN layer, and a lighting structure having a high refractive index formed on the first low refractive index semiconductor layer. A second low refractive index semiconductor layer is embedded in the first low refractive index semiconductor layer. The first low refractive index semiconductor layer and the GaN layer exhibit a lattice mismatch therebetween.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: May 28, 2013
    Assignee: Advanced Optoelectronics Technology, Inc.
    Inventors: Po-Min Tu, Shih-Cheng Huang, Shun-Kuei Yang, Chia-Hung Huang
  • Patent number: 8449153
    Abstract: An LED module includes a substrate comprising a base plate and an elastic arm extending from a periphery side of the base plate. The elastic arm includes a horizontal portion parallel to and spaced from the base plate. A receiving space is defined between the horizontal portion of the elastic arm and the base plate. A circuit layer is formed on the base plate. An LED is mounted on the base plate and electrically connects with the circuit layer. The LED comprises a base and at least one electrode extending outwardly from the base. The LED is fixed on the substrate via the at least one electrode slideably received in the receiving space with a downward force applied on the electrode by the horizontal portion of the elastic arm.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: May 28, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsing-Fen Lo, Chih-Hsun Ke, Shiun-Wei Chan
  • Patent number: 8439547
    Abstract: An exemplary illuminating apparatus includes a light guiding plate, a light source facing a light input surface of the light guiding plate, and a complementary color element adjacent to the light source. The light source comprises a number of LEDs which emit light with at least two wavelengths. The at least two wavelengths light mix with each other to gain a white light. The complementary color element is configured for receiving light emitted from adjacent, outmost LED and converting the light into white light. The white light is reflected by the complementary color element and emits from the light guiding plate through the light output surface.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: May 14, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Kuan-Her Chiu, Irene Chen
  • Patent number: 8440477
    Abstract: A method for manufacturing an LED (light emitting diode) includes following steps: providing a first electrode, a second electrode and a Zener diode, the Zener diode being electrically connected to the first and second electrodes; providing a mold; the first electrode, the second electrode and the Zener diode being received in the mold; injecting a liquid molding material into the mold, thereby integrally forming a base, a dam, and a reflective cup, the Zener diode being encapsulated in the dam; setting first and second LED chips respectively on the first and second electrodes; filling an encapsulation material in the reflective cup to encapsulate the first and second LED chips. The first and second LED chips are separated from each other by the dam.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: May 14, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Hsing-Fen Lo
  • Patent number: 8436387
    Abstract: An LED package includes a substrate, a blue LED chip, an encapsulant and a fluorescent layer. The blue LED chip is arranged on the substrate. The encapsulant covers the blue LED chip. The fluorescent layer is arranged on a top surface of the encapsulant. The fluorescent layer includes a first fluorescent area above the blue LED chip and a second fluorescent area encircling the first fluorescent area. The first fluorescent area includes red fluorescent substance and green fluorescent substance mixed therein. The second fluorescent area includes yellow fluorescent substance mixed therein.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: May 7, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Ming-Ta Tsai
  • Patent number: 8436392
    Abstract: A light emitting diode package comprises a substrate with a first surface and a second surface opposite to each other, a circuit on the substrate, a support on the substrate for reinforcing strength of the substrate, a plurality of light emitting diodes on the substrate and electrically connected to the circuit, and a cover layer on the plurality of light emitting diodes. A method for manufacturing a light-emitting diode package is further provided.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: May 7, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Chieh-Ling Chang, Shen-Bo Lin
  • Patent number: 8431934
    Abstract: An exemplary LED chip includes a substrate, a buffer layer formed on the substrate and a light emitting layer formed on the buffer layer. The light emitting layer includes an n-type semiconductor layer and a p-type semiconductor layer. A first electrode is electrically connected with one of the n-type semiconductor layer and the p-type semiconductor layer. A second electrode is electrically connected with the other one of the n-type semiconductor layer and the p-type semiconductor layer. A bonding pad is formed on a top surface of the first electrode. A bonding wire is secured to the bonding pad. A ratio between a contacting area between the bonding pad and the top surface of the first electrode and an area of the top surface of the first electrode is no less than 6:10.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: April 30, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Yen-Kei Lei, Ko-Wei Chien
  • Patent number: 8415179
    Abstract: A light emitting diode and a light emitting diode (LED) manufacturing method are disclosed. The LED comprises a substrate; a first n-type GaN layer; a second n-type GaN layer; an active layer; and a p-type GaN layer formed on the substrate in sequence; the second n-type GaN layers has a bottom surface interfacing with the first n-type GaN layer, a rim of the bottom surface has a roughened exposed portion, and Ga—N bonds on the bottom surface has an N-face polarity.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: April 9, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Tzu-Chien Hung, Shun-Kuei Yang, Chia-Hui Shen
  • Patent number: 8409885
    Abstract: An LED packaging method includes: providing a mold with two isolated receiving spaces and a substrate with a die supporting portion and an electrode portion respectively received in the two receiving spaces; disposing an LED die on the die supporting portion and electrically connecting the LED die to the electrode portion of the substrate by metal wires; injecting a light wavelength converting material into the first receiving space and covering the LED die with the light wavelength converting material; communicating the first receiving space to the second receiving space, injecting a first light transmissive material into the communicated first and second spaces, and covering the light wavelength converting material and the metal wires with the first light transmissive material; and removing the mold to obtain a packaged LED.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: April 2, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shiun-Wei Chan, Chih-Hsun Ke
  • Patent number: 8410516
    Abstract: A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 2, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Pi-Chiang Hu
  • Patent number: 8405096
    Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: March 26, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chien-Min Chen, Ko-Wei Chien, Hung-Chin Lin
  • Patent number: 8394653
    Abstract: A method for fabricating a semiconductor lighting chip includes steps of: providing a substrate with a first block layer dividing an upper surface of the substrate into a plurality of epitaxial regions; forming a first semiconductor layer on the epitaxial regions; forming a second block layer partly covering the first semiconductor layer; forming a lighting structure on an uncovered portion of the first semiconductor layer; removing the first and the second block layers thereby defining clearances at the bottom surfaces of the first semiconductor layer and the lighting structure; and permeating etching solution into the first and second clearances to etch the first semiconductor layer and the lighting structure, thereby to form each of the first semiconductor layer and the lighting structure with an inverted frustum-shaped structure.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: March 12, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Po-Min Tu, Shih-Cheng Huang, Ya-Wen Lin, Chia-Hung Huang, Shun-Kuei Yang