Patents Assigned to Advanced Optoelectronic Technology
  • Light emitting diode package having interconnection structures
    Patent number: 8569790
    Abstract: A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: October 29, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Pi-Chiang Hu
  • LED and method for manufacturing the same
    Patent number: 8569791
    Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: October 29, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin
  • Method for manufacturing light emitting chip
    Patent number: 8563340
    Abstract: A method for manufacturing light emitting chips includes steps of: providing a substrate having a plurality of separate epitaxy islands thereon, wherein the epitaxy islands are spaced from each other by channels; filling the channels with an insulation material; sequentially forming a reflective layer, a transition layer and a base on the insulation material and the epitaxy islands; removing the substrate and the insulation material to expose the channels; and cutting the reflective layer, the transition layer and the base to form a plurality of individual chips along the channels.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: October 22, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shih-Cheng Huang, Po-Min Tu, Shun-Kuei Yang, Chia-Hung Huang
  • LED package
    Patent number: 8564003
    Abstract: An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees.
    Type: Grant
    Filed: November 20, 2011
    Date of Patent: October 22, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Hsun Ke, Ming-Ta Tsai, Chao-Hsiung Chang, Shiun-Wei Chan
  • Backlight module
    Patent number: 8556487
    Abstract: An exemplary illuminating apparatus includes a light guiding plate, a light source facing a light input surface of the light guiding plate, and a complementary color element adjacent to the light source. The light source comprises a number of LEDs which emit light with at least two wavelengths. The at least two wavelengths light mix with each other to gain a white light. The complementary color element is configured for receiving light emitted from adjacent, outmost LED and converting the light into white light. The white light is reflected by the complementary color element and emits from the light guiding plate through the light output surface. The complementary color element includes a plurality of first and second complementary color zones arranged alternatively and in a line.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: October 15, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Kuan-Her Chiu, Irene Chen
  • LED package and mold of manufacturing the same
    Patent number: 8551794
    Abstract: A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode. The cap layer covers the light emitting diode die.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: October 8, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shen-Bo Lin, Chao-Hsiung Chang, Wen-Liang Tseng
  • Backlight module
    Patent number: 8550685
    Abstract: A direct-type backlight module includes a light guiding plate, a light source facing a light input surface of the light guiding plate, a complementary color element adjacent to the light source, and an enclosure. The light source comprises a number of LEDs which emit light with at least two wavelengths. The at least two wavelengths light mix with each other to gain a white light. The complementary color element is configured for receiving light emitted from adjacent, outmost LED and converting the light into white light. The white light is reflected by the complementary color element and emits from the light guiding plate through the light output surface. The LEDs are mounted on a base of the enclosure and arranged in an array.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: October 8, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Kuan-Her Chiu, Irene Chen
  • Method for packaging light emitting diodes
    Patent number: 8546160
    Abstract: A method for packaging LEDs includes steps of: forming a substrate with a rectangular frame, a plurality of first and second electrode strips received within the frame and alternately arranged along a width direction of the frame; forming a carrier layer on each pair of the first and second electrode strips, the carrier layer defining a plurality of recesses; arranging an LED die in each recess and electrically connecting the LED die with first and second electrodes; forming an encapsulation in each recess to cover the LED die; and cutting the first and second electrode strips along the width direction of the frame to obtain a plurality of separated LED packages each including the first and second electrodes, the LED die, the encapsulation and a part of the carrier layer.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: October 1, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Pin-Chuan Chen
  • LED package and light emitting device having the same
    Patent number: 8546833
    Abstract: An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: October 1, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin
  • Light emitting diode device with lens having a cavity
    Patent number: 8545061
    Abstract: An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: October 1, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin, Ming-Ta Tsai
  • Method for distributing phosphor particulates on LED chip
    Patent number: 8546158
    Abstract: A method for distributing phosphor particulates on an LED chip, includes steps of: providing a substrate having an LED chip mounted thereon; dispensing an adhesive on the chip, wherein the adhesive have positively charged phosphor particulates doped therein; providing an upper mold and a lower mold for producing an electric field through the adhesive and moving the upper mold to press the adhesive, wherein the phosphor particulates are driven by the electric field to move to a top face of the chip; and curing the adhesive and removing the upper mold and the lower mold.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: October 1, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shiun-Wei Chan, Chih-Hsun Ke
  • Light-emitting element package and fabrication method thereof
    Patent number: 8541799
    Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: September 24, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao
  • Method for packaging light emitting diode having fluorescent material directly coated on LED die thereof
    Patent number: 8535960
    Abstract: A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: September 17, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin
  • Light emitting element package
    Patent number: 8536590
    Abstract: A light emitting element package includes a substrate, at least two light emitting element modules and an encapsulation member. The substrate includes a circuit layer. The circuit layer includes a plurality of solder pads. The at least two light emitting element modules are mounted on the substrate. Each of the at least two light emitting element modules includes a plurality of light emitting elements. Each light emitting element of the at least two light emitting element modules is electrically coupled to neighboring light emitting element in serial through the solder pads. The at least two light emitting element modules are reversely arranged. The encapsulation member is configured to encapsulate the at least two light emitting element modules on the substrate.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: September 17, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shih-Cheng Huang, Po-Min Tu, Shun-Kuei Yang, Chia-Hung Huang
  • LED device having two LED dies separated by a dam
    Patent number: 8536593
    Abstract: An LED device comprises a substrate, a circuit, two LED dies, a dam and a reflector. The dam divides the substrate into a first area and a second area, wherein one of the two LED dies is disposed on the first area and the other is disposed on the second area. The dam insulates radiant lights emitted from the two LED dies, whereby interference between the radiant lights can be prevented. Four separate electrodes are provided on the substrate, wherein one LED die is connected to two electrodes and the other LED die is electrically connected to the other two electrodes.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: September 17, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Hsing-Fen Lo
  • Method for fabricating light emitting diode
    Patent number: 8535958
    Abstract: A method for fabricating a light emitting diode includes steps of: forming a light emitting structure of the light emitting diode on a substrate; arranging a photoresist layer on a first semiconductor layer of the light emitting structure; depositing a plurality of dielectric material structures on the first semiconductor layer through a plurality of voids of the photoresist layer; removing the photoresist layer to form a plurality of voids between the plurality of dielectric material structures; forming a plurality of metal material structures in the plurality of voids; and forming a reflective layer on the plurality of dielectric material structures and the plurality of metal material structures.
    Type: Grant
    Filed: August 26, 2012
    Date of Patent: September 17, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Tzu-Chien Hung, Chia-Hui Shen, Chih-Pang Ma, Chih-Peng Hsu, Shih-Hsiung Chan
  • Light emitting diode with peripheral circular slots and method for manufacturing the same
    Patent number: 8536597
    Abstract: A light emitting diode chip includes an electrically conductive substrate, a reflecting layer disposed on the substrate, a semiconductor structure formed on the reflecting layer, an electrode disposed on the semiconductor structure, and a plurality of slots extending through the semiconductor structure. The semiconductor structure includes a P-type semiconductor layer formed on the reflecting layer, a light-emitting layer formed on the P-type semiconductor layer, and an N-type semiconductor layer formed on the light-emitting layer. A current diffusing region is defined in the semiconductor structure and around the electrode. The slots are located outside the current diffusing region.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: September 17, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Po-Min Tu, Shih-Cheng Huang, Shun-Kuei Yang, Chia-Hung Huang
  • LED package device
    Patent number: 8536592
    Abstract: An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: September 17, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin
  • Method for manufacturing light emitting diode
    Patent number: 8530252
    Abstract: A method for manufacturing light emitting diodes includes steps of: providing a base have an upper conductive layer and a lower conductive layer on a top face and a bottom face thereof, respectively; forming a plurality of through holes in the base; defining a plurality of grooves to divide the upper and lower conductive layers into discrete strips; forming a connection layer on an inner circumferential face of each hole to connect the opposite strips of the upper and lower conductive layers; filling a supporting layer in an upper portion of each hole; forming a reinforcing layer on the supporting layer and the upper conductive layer; fixing chips on the reinforcing layer and electrically connecting the chips with the strips of the upper conductive layer; forming an encapsulant on the reinforcing layer; and cutting the base into individual LEDs along the holes.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: September 10, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Chieh-Ling Chang
  • LED bulb
    Patent number: D691293
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: October 8, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Yung Lin, Yue-Zhi Chen, Chia-Chen Chang