Patents Assigned to Advanced Optoelectronic Technology
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Patent number: 8388181Abstract: A light source assembly comprises a plurality of reflective sheets, a plurality of light emitting diodes and a printed circuit board. Each reflective sheet comprises a plate member and a plurality of openings formed on the plate member. The plurality of light emitting diodes are mounted on the printed circuit board. The plurality of reflective sheets are also mounted on the printed circuit board. The plurality of light emitting diodes are respectively located in the openings. The light emitted from the light emitting diodes is reflected by the surface of the plate member.Type: GrantFiled: September 9, 2009Date of Patent: March 5, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Kuan Her Chiu, Irene Chen, Jian Shihn Tsang
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Patent number: 8384276Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.Type: GrantFiled: June 24, 2011Date of Patent: February 26, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh
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Patent number: 8384113Abstract: A photoelectric device includes a ceramic substrate defining a cavity in a top thereof and having two electrode layers beside the cavity. A photoelectric die is received in the cavity. A first packing layer is received in the cavity and encapsulates the photoelectric die. The photoelectric die is electrically connected with the electrode layers via two wires. A reflective cup is mounted on the ceramic substrate and defines a receiving space above the top of the ceramic substrate and the first packing layer. A second packing layer is received in the receiving space and covers the first packing layer.Type: GrantFiled: November 29, 2011Date of Patent: February 26, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chester Kuo, Hung-Chin Lin
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Patent number: 8378378Abstract: A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode. The cap layer covers the light emitting diode die.Type: GrantFiled: October 12, 2010Date of Patent: February 19, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Shen Bo Lin, Chao Hsiung Chang, Wen Liang Tseng
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Patent number: 8373189Abstract: An LED package includes an insulated frame, a first metallic conductor and a second metallic conductor, a chip and an encapsulation. The insulated frame has a receiving groove defined therein. The two metallic conductors are both mounted on bottom of the insulated frame and separated from each other. The chip is placed in the receiving groove and electrically connected to the two metallic conductors. The encapsulation is located in the receiving groove. The first metallic conductor and the second metallic conductor each comprise a mounting portion exposed to the receiving groove and a reflecting portion extending from the mounting portion into the insulated frame. The first reflecting portion and the second reflecting portion cooperatively surround the receiving groove of the insulated frame.Type: GrantFiled: November 7, 2011Date of Patent: February 12, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
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Patent number: 8368085Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.Type: GrantFiled: October 12, 2010Date of Patent: February 5, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Hung-Chin Lin, Kuo-Fu Peng, Chien-Min Chen, Ko-Wei Chien
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Patent number: 8366308Abstract: A backlight module includes a plurality of first light sources emitting first light and a light guide plate. The first light sources are arranged in a line and spaced from each other. Two adjacent first light sources define a first space therebetween. The light guide plate includes a first light incident surface and a light output surface. The first light incident surface has a plurality of bright areas respectively corresponding to the first light sources and a plurality of dark areas respectively corresponding to the first spaces. A plurality of first reflectors is disposed on the plurality of dark areas of the first incident surface. The light output surface is adjacent and perpendicular to the light incident surface.Type: GrantFiled: March 1, 2010Date of Patent: February 5, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Kuan-Her Chiu, Irene Chen
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Patent number: 8349742Abstract: A gallium nitride-based semiconductor device includes a composite substrate and a gallium nitride layer. The composite substrate includes a silicon substrate and a filler. The silicon substrate includes a first surface and a second surface opposite to the first surface, and the first surface defines a number of grooves therein. The filler is filled into the number of grooves on the first surface of the silicon substrate. A thermal expansion coefficient of the filler is bigger than that of the silicon substrate. The gallium nitride layer is formed on the second surface of the silicon substrate.Type: GrantFiled: January 26, 2011Date of Patent: January 8, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Po-Min Tu, Shih-Cheng Huang, Shun-Kuei Yang, Chia-Hung Huang
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Patent number: 8344406Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.Type: GrantFiled: December 17, 2010Date of Patent: January 1, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao, Jian-Shihn Tsang
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Patent number: 8344408Abstract: An exemplary light emitting diode (LED) package includes a substrate, an LED chip mounted on the substrate, and a wire. The LED chip includes a semiconductor structure and an electrode disposed on the semiconductor structure. The wire electrically connects the electrode of the LED chip to an electrical portion of the substrate. The wire has a first joint and a second joint connected to the substrate. The wire forms a first curved portion between the electrode and the first joint and a second curved portion between the first joint and the second joint.Type: GrantFiled: May 31, 2011Date of Patent: January 1, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Kai-Lun Wang, Shih-Yuan Hsu
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Patent number: 8345180Abstract: An exemplary liquid crystal display device includes a backlight module, a metallic bracket and a liquid crystal panel. The backlight module includes a back bezel, a planar lighting source mounted on the back bezel and a frame. The frame includes a metallic beam and three plastic beams. The metallic beam and the plastic beams enclose the back bezel. The metallic beam is located at a top of the liquid crystal display device. The metallic bracket supports the backlight module and thermally connects with the metallic beam of the frame of the backlight module. The liquid crystal panel is located at a surface of emission of the planar lighting source.Type: GrantFiled: March 1, 2010Date of Patent: January 1, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Kuan-Her Chiu, Irene Chen
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Patent number: 8334175Abstract: A method for manufacturing a holder of an LED package structure includes steps: providing first and second electrical portions; providing a mold including an upper die and a bottom die, the bottom die defining a receiving groove in a top surface thereof, the upper die including a core component and a wall around and spaced from the core component; putting the first and second electrical portions in the receiving groove of the bottom die, mounting the upper die on the bottom die; injecting liquid molding material into the receiving groove of the bottom die through a sprue between the wall and the core component; solidifying the liquid molding material and removing the upper die and the bottom die to obtain the holder which includes the first and second electrical portions and the solidified liquid molding material.Type: GrantFiled: April 9, 2012Date of Patent: December 18, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chih-Hsun Ke, Ming-Ta Tsai
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Patent number: 8328380Abstract: A light module of an LCD backlight module includes a circuit board and a plurality of light-emitting diodes (LEDs) arranged on the circuit board. Each of the LEDs has a wide far-field pattern and is without a reflector, and each of the LEDs includes at least one LED chip and a molding unit packaging the LED chip. The LED chip is electrically connected to the circuit board and is also suitable for backlighting use. When a light-emitting angle of each of the LEDs is at 120 degrees, a light intensity thereof is still more than 50% of the intensity at frontage.Type: GrantFiled: February 10, 2012Date of Patent: December 11, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Irene Chen, Jian-Shihn Tsang
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Patent number: 8298861Abstract: A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.Type: GrantFiled: August 13, 2010Date of Patent: October 30, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Pin Chuan Chen, Shen Bo Lin
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Patent number: 8292489Abstract: A back plate assembly utilized in a side light type backlight module includes two cases each including a main plate, a side plate extending upwardly extending from an end of the main plate and a pressing plate inwardly extending from a free end of the side plate. An opposite end of the main plate of one of the cases has a first stepped portion extending inwardly from a top portion thereof, and an opposite end of the main plate of the other one of the cases has a second stepped portion extending inwardly from a bottom portion thereof. A plurality of bolts extend through the second and first stepped portions and secure the cases together. A space is defined between the first and second cases for receiving a light guiding plate and a reflection plate between the main plates and the light guiding plate.Type: GrantFiled: March 19, 2010Date of Patent: October 23, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Kuan-Her Chiu, Irene Chen
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Patent number: 8288789Abstract: An LED package includes a transparent substrate, an LED die, and an encapsulating layer. The transparent substrate has a first surface defining a recess therein, a second surface opposite to the first surface, and a lateral surface interconnecting the first and second surfaces. The LED die is arranged on the bottom of the recess. The encapsulating layer is in the recess and covers the LED die. The LED package further includes a metal layer formed on the second surface and the lateral surface of the substrate. A pair of electrodes is located at the bottom of the recess and extends through the metal layer. An insulated material is filled between the transparent substrate and the electrodes. Light emitted from the LED die is transmitted through the transparent substrate and reflected by the metal layer.Type: GrantFiled: January 7, 2011Date of Patent: October 16, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Tzu-Chien Hung, Ya-Wen Lin
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Patent number: 8278645Abstract: A light emitting diode is disclosed, wherein the light emitting diode comprises a metal reflective layer for enhancing the light reflection efficiency inside the light emitting diode and reducing the resistance to avoid the power loss. In addition, the light emitting diode further comprises a buffer layer sandwiched between the metal reflective layer and a semiconductor layer, wherein the buffer layer is mixed with metal and non-metallic transparent material for reducing the stress between the semiconductor and the metal to decrease the possibility of the die cracking.Type: GrantFiled: July 15, 2009Date of Patent: October 2, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Tzu Chien Hong, Chia Hui Shen, Chih Pang Ma, Chih Peng Hsu, Shih Hsiung Chan
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Patent number: 8268652Abstract: A method for distributing fluorescence onto a light emitting diode chip includes steps: providing a base; mounting the LED chip having a light-emergent face on the base; disposing a baffle sleeve on the base whereby the baffle sleeve surrounds the LED chip; disposing a solid fusible block with the fluorescence mixed therein on the LED chip; heating the solid fusible block to be in a liquid state, and the fusible block flowing over the light-emergent face of the LED chip; and cooling the fusible block to be in a solid state again.Type: GrantFiled: May 31, 2011Date of Patent: September 18, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Shiun-Wei Chan, Chih-Hsun Ke
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Patent number: 8270444Abstract: A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.Type: GrantFiled: October 8, 2010Date of Patent: September 18, 2012Assignee: Advanced Optoelectronics Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin
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Patent number: 8258540Abstract: An LED package includes a base, an LED chip and an encapsulation. The LED chip is mounted on the base. The encapsulation encapsulates the LED chip. A heat dissipating plate is sandwiched between the LED chip and the base. The heat dissipating plate includes a first surface and a second surface. The LED chip is mounted on the first surface of the heat dissipating plate and has an interface engaging with the first surface of the heat dissipating plate. The first surface of the heat dissipating plate has an area greater than that of the interface. The second surface of the heat dissipating plate is attached to the base.Type: GrantFiled: March 23, 2011Date of Patent: September 4, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Tzu-Chien Hung, Chia-Hui Shen