Abstract: Embodiments described herein provide a client system for facilitating enhanced offline payment. During operation, the system obtains a location indicator, which indicates the location of a service, from a charging system. The system then generates an offline code that allows access to the service and corresponds to the location indicator. The offline code can be readable by the charging system, and the client system and the charging system can both be offline. Subsequently, the system encodes the historical data associated with the service in a field of the offline code and sends a message comprising the offline code to the charging system.
Type:
Grant
Filed:
December 22, 2022
Date of Patent:
March 11, 2025
Assignee:
Advanced New Technologies Co., Ltd.
Inventors:
Fen Zhai, Chunlei Gu, Yi Zhang, Xiao Wang, Yingyuan Wang
Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.
Type:
Grant
Filed:
June 17, 2022
Date of Patent:
March 11, 2025
Assignee:
ADVANCED MICRO DEVICES, INC.
Inventors:
Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal
Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes an antenna layer, a first circuit layer and a second circuit layer. The antenna layer has a first coefficient of thermal expansion (CTE). The first circuit layer is disposed over the antenna layer. The first circuit layer has a second CTE. The second circuit layer is disposed over the antenna layer. The second circuit layer has a third CTE. A difference between the first CTE and the second CTE is less than a difference between the first CTE and the third CTE.
Type:
Grant
Filed:
February 20, 2024
Date of Patent:
March 11, 2025
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: Disclosed is a write method comprising a step in which a storage device determines an execution order between received first and second write commands, and executes the first write command and the second write command according to the determined execution order. The first write command comprises first stream identification information having {first stream ID, first epoch ID}, the second write command comprises second stream identification information having {second stream ID, second epoch ID}, and when the first stream ID and the second stream ID are different from each other, the execution order is determined without using the result of comparison between the first epoch ID and the second epoch ID.
Type:
Grant
Filed:
November 29, 2021
Date of Patent:
March 11, 2025
Assignee:
Korea Advanced Institute of Science and Technology
Abstract: An arm rest apparatus, according to one embodiment, may comprise: a fixed part fixed to an external object; a horizontal movement module having one end rotatably connected to the fixed part and the other end having two-translational-degree-of-freedom movement with respect to the fixed part; and an arm support module installed to have two rotational degrees of freedom with respect to the other end of the horizontal movement module.
Type:
Grant
Filed:
October 18, 2021
Date of Patent:
March 11, 2025
Assignees:
ROEN Surgical, Inc., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventors:
Dong Soo Kwon, Duk Sang Kim, Byung Sik Cheon, Un Je Yang
Abstract: An optical connector has a connector housing assembly for holding one or more ferrules, the connector housing assembly having a height align a vertical alignment axis and a width perpendicular to the height. The connector housing assembly includes an inner front body and an outer release component, the outer release component being movable in relation to the inner front body between a front position and a back position. The optical fiber connector is configured to mate with a receptacle having an upper receptacle hook such that the upper receptacle hook is received in the upper receptacle hook recess and latches with the upper hook retainer surface when the outer release component is in the front position and such that the upper ramp lifts the upper receptacle hook out of the upper receptacle hook recess when the outer release component moves to the back position.
Abstract: Pre-ceramic particle solutions can prepared by a Coordinated-PDC process, a Direct-PDC process or a Coordinated-Direct-PDC process. The pre-ceramic particle solution includes a polymer selected from the group consisting of (i) an organic polymer including a metal or metalloid cation, (ii) a first organometallic polymer and (iii) a second organometallic polymer including a metal or metalloid cation different from a metal in the second organometallic polymer, a plurality of particles selected from the group consisting of (a) a ceramic fuel particle and (b) a moderator particle, a dispersant, and a polymerization initiator. The pre-ceramic particle solution can be supplied to an additive manufacturing process, such as digital light projection, and made into a structure (which is pre-ceramic particle green body) that can then be debinded to form a polymer-derived ceramic sintered body. In some embodiments, the polymer-derived ceramic sintered body is a component or structure for fission reactors.
Abstract: A method and an apparatus for decoding an image are disclosed. A region of the image is selected and the decoding is selected region and associated metadata is performed. Pixels for a generated for a decoded image based on the decoded selected region and metadata.
Type:
Grant
Filed:
November 11, 2022
Date of Patent:
March 11, 2025
Assignee:
Advanced Micro Devices, Inc.
Inventors:
Andrew S. Pomianowski, Konstantine Iourcha
Abstract: A display panel and a formation method thereof, and a display apparatus are provided in the present disclosure. The method includes providing a base substrate; forming an array layer on a side of the base substrate; forming a light-emitting structure layer on a side of the array layer away from the base substrate, where the light-emitting structure layer includes a plurality of light-emitting units; and forming a light-blocking layer on a side of the light-emitting structure layer away from the base substrate, where the light-blocking layer includes a black matrix and openings. Before forming the openings, the method further includes forming a first inorganic layer between the light-emitting structure layer and the light-blocking layer, where the first inorganic layer at least includes first sub-portions; and a vertical projection of a first sub-portion on the base substrate overlaps a vertical projection of a corresponding opening on the base substrate.
Type:
Grant
Filed:
December 22, 2021
Date of Patent:
March 11, 2025
Assignee:
Hubei Yangtze Industrial Innovation Center of Advanced Display Co., LTD.
Abstract: A semiconductor package structure and a method of manufacturing the same are provided. The semiconductor package structure includes an electronic component having a first surface, a second surface opposite to the first surface and a circuit structure closer to the first surface than to the second surface. The semiconductor package structure also includes a passive component connected to the second surface of the electronic component. The semiconductor package structure further includes a conductive element extending into the electronic component and configured to electrically connect the circuit structure with the passive component.
Type:
Grant
Filed:
June 23, 2021
Date of Patent:
March 11, 2025
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: A coherent beam combination (CBC) system (10) includes an array of beam sources (12a, 12b and 12c) generating coherent beams directed towards a target (T). The phase modulators (14a, 14b and 14c) allow adjustment of relative phase offsets of the beams. A detector (16) monitors an intensity of the radiation impinging on an area of the target (T). A controller (18) receives the intensity parameter and controls a phase adjustment of the beams according to a deterministic (i.e., quantitative) measurement of a phase offset of each beam relative to a representative phase of the sum of all the other beams. This is achieved by using interferometric techniques, referred to herein as Target In-the-Loop Interferometry (TILI).
Type:
Grant
Filed:
February 29, 2024
Date of Patent:
March 11, 2025
Assignee:
RAFAEL ADVANCED DEFENSE SYSTEMS LTD.
Inventors:
Daniel Golubchik, Yehonathan Segev, David Shwa
Abstract: Provided is an apparatus for accelerating graph neural network (GNN) pre-processing, the apparatus including a set-partitioning accelerator configured to sort each edge of an original graph stored in a coordinate list (COO) format by a node number, perform radix sorting based on a vertex identification (VID) to generate a COO array of a preset length, and perform uniform random sampling on some nodes of a given node array, a merger configured to merge the COO array of the preset length to generate one sorted COO array, a re-indexer configured to assign new consecutive VIDs respectively to the nodes selected through the uniform random sampling, and a compressed sparse row (CSR) converter configured to the edges sorted by the node number into a CSR format.
Type:
Grant
Filed:
August 22, 2023
Date of Patent:
March 11, 2025
Assignee:
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Abstract: The present invention provides a copper powder which is capable of fusion bonding with a low energy laser by enabling heat to be efficiently inputted with a high absorption rate for laser irradiation and has high convenience in handling, and provides a method for manufacturing the copper powder. One embodiment of the present invention is a copper powder, having an absorption rate for light having a wavelength ?=1060 nm of 18.9% to 65.0%, and an index, which is indicated by (the absorption rate for light having a wavelength ?=1060 nm)/(an oxygen concentration), of 3.0 or more.
Type:
Grant
Filed:
January 12, 2018
Date of Patent:
March 11, 2025
Assignee:
JX Advanced Metals Corporation
Inventors:
Yosuke Endo, Hiroyoshi Yamamoto, Ryo Suzuki, Kenji Sato
Abstract: A weight-bearing system for hanging items from the roof structure of a metal building is disclosed. The system includes a purlin with at least one flange, a span aperture in the vertical span of the purlin, a clip that attaches to the purlin using the span aperture, and a fastener on the clip for transferring weight applied to the fastener to the clip and to the vertical span of said purlin.
Type:
Grant
Filed:
September 27, 2022
Date of Patent:
March 11, 2025
Assignee:
Advanced Fastener and Assembly Solutions LLC
Abstract: Machine learning-based multi-view video conferencing from single view video data, including: identifying, in video data, a plurality of objects; and generating a user interface comprising a plurality of first user interface elements each comprising a portion of the video data corresponding to one or more of the plurality of objects.
Abstract: An electrolyte-solution composition and a secondary battery using the same. The electrolyte-solution composition is configured in contact with an aluminous surface of a cathode. The electrolyte-solution composition includes an electrolyte solution and a hydroxyquinoline compound. With the hydroxyquinoline compound included in the electrolyte-solution composition, oxidation and corrosion occurred on the aluminous surface, which are caused by the electrolyte-solution composition, is reduced. Accordingly, the capacity of the secondary battery is improved, and the occurrence of self-discharge phenomenon is avoided.
Abstract: An electronic device is disclosed. The electronic device includes an interposer, a voltage regulator, a first circuit structure, and an electronic component. The voltage regulator is attached to the interposer. The first circuit structure is supported by the interposer. The electronic component is disposed adjacent to the interposer and electrically connected to the voltage regulator through the first circuit structure and the interposer.
Type:
Application
Filed:
August 30, 2023
Publication date:
March 6, 2025
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.
Type:
Application
Filed:
November 19, 2024
Publication date:
March 6, 2025
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: A dual-mode coaxial fiber sensor has a structure in which a core fiber, a strain sensing layer formed on the core fiber and made of a conductive material, and a temperature sensing layer formed on the surface of the strain sensing layer and made of a conductive material are stacked, thereby simultaneously measuring a temperature and a strain using one sensor.
Type:
Application
Filed:
July 16, 2024
Publication date:
March 6, 2025
Applicant:
Korea Advanced Institute of Science and Technology
Inventors:
Seong Su KIM, Won Vin KIM, Seong Yeon PARK, Seung Yoon ON
Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.
Type:
Application
Filed:
August 29, 2023
Publication date:
March 6, 2025
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
Hao-Chih HSIEH, Chun-Kai CHANG, Chao Wei LIU