Abstract: The present invention is related to a recombinant host cell, in particular a yeast cell, comprising a dihydroxy-acid dehydratase polypeptide. The invention is also related to a recombinant host cell having increased specific activity of the dihydroxy-acid dehydratase polypeptide as a result of increased expression of the polypeptide, modulation of the Fe—S cluster biosynthesis of the cell, or a combination thereof. The present invention also includes methods of using the host cells, as well as, methods for identifying polypeptides that increase the flux in an Fe—S cluster biosynthesis pathway in a host cell.

Abstract: Thermal transfer from a silicon-on-insulator (SOI) die is improved by mounting the die in a bump-on-leadframe manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure.

Abstract: The present invention is related to a recombinant host cell, in particular a yeast cell, comprising a dihydroxy-acid dehydratase polypeptide. The invention is also related to a recombinant host cell having increased specific activity of the dihydroxy-acid dehydratase polypeptide as a result of increased expression of the polypeptide, modulation of the Fe—S cluster biosynthesis of the cell, or a combination thereof. The present invention also includes methods of using the host cells, as well as, methods for identifying polypeptides that increase the flux in an Fe—S cluster biosynthesis pathway in a host cell.

Abstract: A system generates a set of candidate signals based on a received signal, whereby each candidate signal represents an adjustment of the signal for a different amount of potential noise. The system selects one of the candidate signals based on a selected subset of previous samples and the values of the selected subset of samples. The subset of previous samples is selected based on a predicted noise pattern.

Abstract: A processing system comprises one or more processor devices and other system components coupled to a stacked memory device having a set of stacked memory layers and a set of one or more logic layers. The set of logic layers implements a helper processor that executes instructions to perform tasks in response to a task request from the processor devices or otherwise on behalf of the other processor devices. The set of logic layers also includes a memory interface coupled to memory cell circuitry implemented in the set of stacked memory layers and coupleable to the processor devices. The memory interface operates to perform memory accesses for the processor devices and for the helper processor. By virtue of the helper processor's tight integration with the stacked memory layers, the helper processor may perform certain memory-intensive operations more efficiently than could be performed by the external processor devices.

Abstract: Methods and devices for preparing microscale polymer relief structures from a thin polymer layer on an absorbing substrate are described. The described methods are ultrafast (about 8 nanoseconds) and allow formation of patterned microstructures having complex morphologies and narrow line widths that are an order of magnitude smaller than the masks used in the methods.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first substrate, a second substrate, an interposer substrate, a semiconductor chip, a package body and a first antenna layer. The first substrate comprises a grounding segment. The interposer substrate is disposed between the second substrate and the first substrate. The semiconductor chip is disposed on the second substrate. The package body encapsulates the second substrate, the semiconductor chip and the interposer substrate, and has a lateral surface and an upper surface. The first antenna layer is formed on the lateral surface and the upper surface of the package body, and electrically connected to the grounding segment.

Abstract: The invention relates to an implant for the transforaminal intracorporeal fusion of lumbar vertebral column segments. At least some sections of the surface areas that are in direct contact with the spinal column are provided with an anti-dislocation mechanism (1) while an attachment part (4) for a positioning instrument (10) is provided in or on the implant and holes (6) or hollow spaces are disposed in the implant for filling purposes. According to one embodiment of the invention, the attachment part is configured as a revolute joint. In a further embodiment, the implant member has the shape of a sickle, the curvature of which is oriented ventrally and the interior of which is oriented dorsally. The attachment part is located at one end of the sickle while the opposite end of the sickle has a beak-type, tapering shape (5). At least one filling hole is provided between the sickle walls.

Abstract: A rotating device includes a sleeve which encircles a shaft, a housing which supports the shaft and which forms an annular supporting recess where the lower end of the sleeve enters together with the shaft, a ring member which is provided above the sleeve and which is fixed to the shaft in a manner encircling the shaft. A first gap between the sleeve and the shaft includes first and second radial dynamic pressure generating portions. An annular sleeve recess is formed in upper face of the sleeve. The ring member includes a ring entering portion that enters the sleeve recess in a non-contact manner. An outward gap in the radial direction where the ring entering portion and the sleeve recess face with each other in the radial direction includes a second air-liquid interface of a lubricant.

Abstract: A removal composition and process for selectively removing a first metal gate material (e.g., titanium nitride) relative to a second metal gate material (e.g., tantalum nitride) from a microelectronic device having said material thereon. The removal composition can include fluoride or alternatively be substantially devoid of fluoride. The substrate preferably comprises a high-k/metal gate integration scheme.

Abstract: Provided is a pressure tank having a lattice structure, including: a tank body that has a high-pressure fluid accommodated therein and is manufactured to have a prismatic shape; and cell structures that are disposed in the prismatic tank body, are manufactured in a lattice form, arrive from one side wall of the tank body to the other side wall thereof facing it, and are orthogonally arranged regularly.

Abstract: Disclose is a method for preparing a cathode material for a lithium secondary battery, the method comprising the steps of: preparing an amorphous silicon oxide; using the prepared silicon oxide as a starting material; and milling the amorphous silicon oxide, a lithium silicon oxide and a transition metal silicon oxide at a predetermined ratio, drying the milled material, and heat-treating the dried material in an atmosphere of inert gas, thereby preparing a lithium transition metal silicon oxide.

Abstract: A method of producing a composite nanoparticle (M-AxOy), having: generating, in an inert gas, an alloy (A-M) nanoparticle, which contains 0.1 at. % to 30 at. % of a noble metal (M), with the balance being a base metal (A) and inevitable impurities, and which has a particle size of 1 nm to 100 nm, to heat the alloy (A-M) nanoparticle and to bring the alloy (A-M) nanoparticle into contact with a supplied oxidizing gas during transportation of the alloy (A-M) nanoparticle with the inert gas, to oxidize the base metal component (A) in the floating alloy (A-M) nanoparticle, and to phase separate into the thus-oxidized base metal component (AxOy) and the noble metal component (M), to thereby obtain a composite nanoparticle (M-AxOy) having one noble metal particle (M) combined to the surface of a particulate base metal oxide (AxOy).

Abstract: The method for producing a material loaded with gold nanoparticles, includes: impregnating a carrier with an anionic gold-hydroxo complex solution including a transparent solution that has a pH of not lower than 8, does not contain a halide anion, and contains a conjugate base of a weak acid not coordinated to gold and an anionic hydroxo complex of trivalent gold having a square planar molecular geometry whose at least one ligand is OH? and not containing a halide anion as a ligand; removing water; heating; and washing with water. According to the method, in a method for preparing a gold nanoparticle catalyst using a liquid phase method, a gold compound not containing a halide such as chloride is used as a raw material, and the gold compound can be supported efficiently. Furthermore, a gold nanoparticle-loaded catalyst having high activity can be obtained through a simple preparation method.

Abstract: The present invention relates to electrostatic dissipative polycarbonate compositions that are prepared by combining an aromatic polycarbonate polymer with a thermoplastic polyurethane based inherently dissipative polymer and a compatibilizer component that comprises a second thermoplastic polyurethane. This second thermoplastic polyurethane is a reaction product of (a) at least one polyol intermediate, (b) at least one diisocyanate, and (c) at least one chain extender, wherein (a), the polyol intermediate comprises a polycaprolactone polyol, a polycarbonate polyol, or combinations thereof.

Abstract: Methods for the fermentative production of four carbon alcohols is provided. Specifically, butanol, preferably isobutanol is produced by the fermentative growth of a recombinant bacterium expressing an isobutanol biosynthetic pathway.

Abstract: The present invention relates to a composite data transmission interface and a judgment method thereof which is based on metal contacts shared by a smart card and a universal series bus and comprise steps as follows: link a composite pin to a socket; electrical conductivity is completed with a socket linking a composite pin; a controller connected to the composite pin is activated by electricity; a smart card's or a universal series bus's electrical conductivity mode is enabled by the controller by means of the smart card's or the universal series bus's electrical connection mode.

Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed.

Abstract: An object of the present invention is to amplify the current which varies by a factor of several orders of magnitude with a constant gain without using a complicated circuit. In order to solve the problem, with a semiconductor device includes a first semiconductor region of a first conductivity, a second semiconductor region which is an opposite conductivity opposite to the first conductivity and is in contact with the first semiconductor region and a third semiconductor region which is the first conductivity and is in contact with the second semiconductor region at the second surface, a fourth semiconductor region in contact with the second semiconductor region is provided so as to be separated from the third semiconductor region and enclose the third semiconductor region and an impurity concentration of the fourth semiconductor region is larger than that of the second semiconductor region.

Abstract: The present invention provides a nanodispersion comprising nanoparticles having a mean size less than 300 nm dispersed in a vehicle comprising a water miscible solvent and water, said nanoparticles comprising one or more taxane derivative, a polymer and a surfactant comprising a mixture of fatty acids or its salts and sterol or its derivatives or its salts.