Abstract: The invention relates to a composition containing a particulate solid, a plastic material (such as a thermoplastic polymer) and a hydrogenated vegetable oil wax. The hydrogenated vegetable oil wax is capable of being a dispersant.

Abstract: A system and method for gathering, analyzing, managing and sharing data from a ground modification project is disclosed. The system includes a process, a data producer interface, a storage device and a data consumer interface. The data producer interface interfaces with one or more data producers, which are located on-site of the ground modification project and produce data associated with the ground modification project. The storage device stores the data produced by the one or more data producers and received using the data producer interface. The data consumer interface interfaces with one or more data consumers, the data consumer interface providing access to the data stored in the storage device.

Abstract: A connector has a fixture with multiple slits defined therein, multiple terminals, a metal housing and a metal casing. One ends of the terminals are received in corresponding slits and the other ends of the terminals are exposed from the fixture. The metal housing encloses the exposed other ends of the terminals and connected to the metallic baffle. The metal casing encloses the fixture and a part of the metal housing.

Abstract: The present invention provides a droplet actuator device and methods for multiplexed PCR amplification and detection of target amplicons within a single droplet. The methods of the invention combine quantitative real-time PCR (qPCR) amplification with fluorescence-based sequence specific detection technologies for amplified DNA. In one embodiment, fluorescently-labeled oligonucleotide probes may be used for hybridization-based multiplexed detection of target amplicons. The methods of the invention generally involve combining the necessary reactants to form a PCR-ready droplet and thermal cycling the droplet at temperatures sufficient to result in amplification of one or more target nucleic acids. Fluorescence-based detection techniques may be used for end-point or real-time analysis of DNA amplification. For end-point analysis, the accumulation of a signal, e.g., a fluorescence signal, is measured after the amplification of the target sequence is complete.

Abstract: A method for emulating a command for communication with an input/output (I/O) port includes receiving the command from a host and redirecting the command to a microcontroller, whereby the microcontroller emulates the command by communicating with the I/O port.

Abstract: A method for manufacturing an LED package includes following steps. A plate is provided. The plate defines a plurality of the through holes extending from an upper surface to a bottom surface of the plate. A blue film is attached to the bottom surface of the plate and covers openings of the through holes. The blue film and an inner wall of the plate defining the through hole cooperatively define a groove. Glue doped with phosphor particle is injected into the groove. The phosphor particles are condensed to a bottom surface of the glue adjacent to the blue film. The LED chips are embedded in the grooves and positioned at upper ends of the grooves. Finally, the blue film is removed and the plate is severed to obtain a plurality of individual LED packages each including a corresponding LED chip.

Abstract: A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package.

Abstract: An LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, an encapsulation formed on the substrate to cover the LED die, and a reflective cup surrounding the substrate and the encapsulation. A curved surface is formed on the reflective cup, and abuts against and protrudes towards the encapsulation. The present disclosure also provides a method for manufacturing the LED package described above.

Abstract: An exemplary LED lamp includes a main body, a phosphor layer and an LED module. The main body is an elongated tube. The phosphor layer is formed on an inner surface of the main body. The LED module includes a circuit board mounted on an outer surface of the main body and an LED chip mounted on the circuit board. Light emitted from the LED chip radiates into an interior of the main body to excite the phosphor layer.

Abstract: The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.

Abstract: A method for manufacturing a method for manufacturing a light emitting diode (LED) package includes following steps: providing a substrate and a blocking member formed on a top surface of the substrate; providing an LED chip and mounting the LED chip on the top surface of the substrate, the LED chip enclosed by the blocking member; providing a dispensing machine with glue, dispensing the glue in the blocking member to make the glue encapsulate the LED chip; and heating the glue to obtain a lens formed on the substrate directly.

Abstract: An LED light bar includes a substrate, a plurality of LED chips, an encapsulation covering each of the LED chips, a protecting layer, a first cover and a second cover. The substrate includes a first surface and a second surface. A plurality of pairs of first electrode and second electrode are formed on the first surface. The LED chips are formed on the first surface of the substrate and electrically connected with the first electrodes and the second electrodes. The protecting layer covers the first electrodes and the second electrodes to protect them from moisture and dust. The first cover and the second cover covers on the first surface and the second surface of the substrate respectively.

Abstract: A semiconductor package includes leads around the periphery of a chip and leads under the chip having connecting segments for increasing I/O capability. A filling material may be used under the chip, which may provide a lead locking function. Various methods of forming the semiconductor package are further provided.

Abstract: A light emitting diode includes a first illumination region, a second illumination region, and the third illumination, wherein a first fluorescent conversion layer and a second fluorescent conversion layer cover the first illumination region and the second illumination region, respectively. The fluorescent conversion layers can convert lights from the illumination regions to other lights with different wavelengths whereby the light emitting diode generates light with multiple wavelengths.

Abstract: The disclosed embodiments relate to apparatus for accurately, efficiently and quickly executing a multiplication instruction. The disclosed embodiments can provide a multiplier module having an optimized layout that can help speed up computation of a result during a multiply operation so that cycle delay can be reduced and so that power consumption can be reduced.

Abstract: There is provided an at least partially implantable device for picking up sound impinging onto a skin area of a person, comprising means for generating an audio signal corresponding to the change in time of the distance between a position of the device and the outer surface of the skin area, wherein the device position is adjacent to the skin area.

Abstract: Provided is a semiconductor wafer including a base wafer, a first insulating layer, and a semiconductor layer. Here, the base wafer, the first insulating layer and the semiconductor layer are arranged in an order of the base wafer, the first insulating layer and the semiconductor layer, the first insulating layer is made of an amorphous metal oxide or an amorphous metal nitride, the semiconductor layer includes a first crystal layer and a second crystal layer, the first crystal layer and the second crystal layer are arranged in an order of the first crystal layer and the second crystal layer in such a manner that the first crystal layer is positioned closer to the base wafer, and the electron affinity Ea1 of the first crystal layer is larger than the electron affinity Ea2 of the second crystal layer.

Abstract: An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow.

Abstract: A composite flexible circuit planar cable includes a flat cable, a first section, and a second section. The flat cable includes a plurality of straight line like parallel and non-jumping conductor lines. At least one jumping line is formed on the first section to interchangeably connect a selected conductive line of the first section to an another selected conductive line. The second section may also form at least one jumping line to interchangeably connect a selected conductive line of the second section to an another selected conductive line. Through such a jumping line, electrical connection can be formed between signal terminals and corresponding and interchanged signal terminals. The plurality of conductor lines of the flat cable includes at least a pair of differential signal conductor lines, a grounding line, and a power line.

Abstract: A system and method are provided for producing controlled vibrations within a borehole. In one example, the system includes an encoder plate having a first surface, an anvil plate having a second surface, a movement mechanism configured to enable translational movement of the encoder plate relative to the anvil plate to allow the first surface to repeatedly impact the second surface to produce a plurality of vibration beats, and a vibration control mechanism configured to selectively control an amplitude of the vibration beats to encode information therein.