Patents Assigned to ADVANCED
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Publication number: 20130069964Abstract: A method, integrated circuit and apparatus are operative to control a plurality of passive variable resistance memory cells to store complimentary state information from at least one active memory circuit, such as a flop, latch, or any other suitable state generation circuit. The method, apparatus and integrated circuit may be operative to control the plurality of passive variable resistance memory cells to also restore the stored complimentary state information for the at least one active memory.Type: ApplicationFiled: September 21, 2012Publication date: March 21, 2013Applicant: ADVANCED MICRO DEVICES, INC.Inventor: ADVANCED MICRO DEVICES, INC.
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Publication number: 20130070514Abstract: An integrated circuit employs a plurality of functional blocks, such as but not limited to, processors (e.g., cores), and an on-die distributed programmable passive variable resistance memory array configured to provide configuration information for each of the plurality of functional blocks. A corresponding sub-portion of the on-die distributed programmable passive variable resistance memory array is fabricated in layers above each respective plurality of functional blocks. The on-die distributed programmable passive variable resistance memory array is used as either non-volatile prepackage configuration information store, or a non-volatile post-package configuration information store that may allow dynamic changing of hardware configuration of the functional blocks both during normal operation and prior to die packaging. A method for making the same is also disclosed.Type: ApplicationFiled: September 14, 2012Publication date: March 21, 2013Applicant: ADVANCED MICRO DEVICES, INC.Inventors: Donald R. Weiss, John J. Wuu
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Publication number: 20130072391Abstract: The following disclosure relates to a technology of genotyping a particular single nucleotide polymorphism (SNP) having significant association with attention deficit hyperactivity disorder (ADHD) and using the SNP genotypes for predicting the risk of ADHD. The present invention relates to providing a method of predicting ADHD risk by identifying the nucleotide of rs5508181 SNP in GIT1, which is C or T at the 24926101st residue on human chromosome 17, and a linkage disequilibrium block harboring rs5508181. Further, the present invention relates to a composition for diagnosing ADHD risk, including a probe for detecting the SNP or a primer for amplifying the chromosomal region, and a diagnosing kit having the probe immobilized on a surface thereof. Therefore, the method, the composition and the kit for diagnosing ADHD risk according to the following disclosure are useful technologies that can conveniently classify risk groups for ADHD at high sensitivity.Type: ApplicationFiled: April 13, 2012Publication date: March 21, 2013Applicants: SNU R&DB FOUNDATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Changwon KANG, Eunjoon KIM, Jae-Won Kim, Eunjin KIM, Hyejung WON, Won MAH, Soo-Churl CHO
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Publication number: 20130069076Abstract: Provided is a nitride semiconductor device comprising a base substrate; a buffer layer formed above the base substrate; an active layer formed on the buffer layer; and at least two electrodes formed above the active layer. The buffer layer includes one or more composite layers that each have a plurality of nitride semiconductor layers with different lattice constants, and at least one of the one or more composite layers is doped with carbon atoms and oxygen atoms in at least a portion of a carrier region of the nitride semiconductor having the largest lattice constant among the plurality of nitride semiconductor layers, the carrier region being a region in which carriers are generated due to the difference in lattice constants between this nitride semiconductor layer and the nitride semiconductor layer formed directly thereon.Type: ApplicationFiled: September 14, 2012Publication date: March 21, 2013Applicant: ADVANCED POWER DEVICE RESEARCH ASSOCIATIONInventors: Masayuki IWAMI, Takuya KOKAWA
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Publication number: 20130071674Abstract: The present invention provides a film for a back sheet of a solar cell exhibiting excellent water vapor barrier properties, water resistance and gas barrier properties, has flexibility and mechanical strength and has excellent heat stability, and a method for producing the film. The present invention is a water vapor barrier film comprising a clay membrane coated on a PET substrate, wherein the clay membrane is formed of clay and an additive; the weight ratio of the clay relative to the total sold is 60 to 90% by weight in the clay membrane; the production process thereof comprises a water resistance imparting heat treatment at 100 to 200° C. after the coating and drying; the film has a water vapor transmission rate of less than 3 g/m2·day; the additive in the modified clay is a polyimide; and at least 90% by mole of exchangeable ions is lithium ion, and a method for producing the water vapor barrier film.Type: ApplicationFiled: June 2, 2011Publication date: March 21, 2013Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeo Ebina, Shinichi Iwata, Nobuhiko Teshima
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Publication number: 20130070845Abstract: Provided is a video encoding apparatus, including a signal separator to separate a differential image block into a first domain and a second domain, based on a boundary line included in the differential image block, the differential image block indicating a difference between an original image and a prediction image with respect to the original image, a transform encoder to perform a transform encoding with respect to the first domain using a discrete cosine transform (DCT), a quantization unit to quantize an output of the transform encoding unit in a frequency domain, a space domain quantization unit to quantize the second domain in a space domain, and an entropy encoder to perform an entropy encoding using outputs of the quantization unit and the space domain quantization unit.Type: ApplicationFiled: August 6, 2010Publication date: March 21, 2013Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Sung-Chang Lim, Hahyun Lee, Hui Yong Kim, Se Yoon Jeong, Sukhee Cho, Hae-Chul Choi, Jongho Kim, Jinho Lee, Jin Soo Choi, Jin Woo Hong, Dong-Gyu Sim, Seoung-Jun Oh, Gwang Hoon Park, Mun Churl Kim, Neung-Joo Hwang, Sea-Nae Park
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Publication number: 20130069092Abstract: An LED includes a base, first and second electrodes embedded in the base, and an LED chip electrically connected with the first and second electrodes. The first electrode includes a first main body portion and three first branch portions. The second electrode includes a second main body and three second branch portions. The first and second branch portions are exposed at sidewalls of the base. One of the first branch portions and one of the second branch portions are exposed at two opposite lateral sides of the base respectively, and another one of the first branch portions and another one of the second branch portions are exposed at the same lateral side of the base. This disclosure also discloses a manufacture method for making the LED.Type: ApplicationFiled: March 8, 2012Publication date: March 21, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: PIN-CHUAN CHEN, HSIN-CHIANG LIN
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Publication number: 20130068517Abstract: A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at a first surface and a second surface of the substrate, respectively. The second surface is opposite to the first surface. Then, the first dielectric layer and the second dielectric layer are patterned. After that, a first trace layer is formed at a surface of the patterned first dielectric layer. The first trace layer is embedded into the patterned first dielectric layer and is coplanar with the first dielectric layer. Then, a second trace layer is formed on a surface of the second dielectric layer.Type: ApplicationFiled: November 9, 2012Publication date: March 21, 2013Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: ADVANCED SEMICONDUCTOR ENGINEERING,
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Publication number: 20130073811Abstract: A system and method for region privatization in a directory-based cache coherence system is disclosed. The system and method includes receiving a request from a requesting node for at least one block in a region, allocating a new entry for the region based on the request for the block, requesting from the memory controller the data for the region be sent to the requesting node, receiving a subsequent request for a block within the region, determining that any blocks of the region that are cached are also cached at the requesting node, and privatizing the region at the requesting node.Type: ApplicationFiled: September 16, 2011Publication date: March 21, 2013Applicant: ADVANCED MICRO DEVICES, INC.Inventors: Bradford M. Beckmann, Arkaprava Basu, Steven K. Reinhardt
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Publication number: 20130070123Abstract: A zoom lens system used in a spectrum region including visible light has movable lens groups moved for zooming, and has, in a movable lens group, a negative lens element made of a material fulfilling the conditional formulae Vd<55 and 0.0018×Vd+P<0.65 and, in a movable lens group, a positive lens element made of a material fulfilling the conditional formulae 60<Vd, 0.645<0.0018×Vd+P, and 9×10?6<dN/dT, where Vd is the Abbe number for a d-line; P=(Ng?NF)/(NF?NC); Ng, NF, and NC are the refractive indices for the g-, F-, and C-lines respectively; and dN/dT is the variation rate in refractive index accompanying variation in room temperature. The negative and positive lens elements move in the same direction during zooming.Type: ApplicationFiled: September 21, 2012Publication date: March 21, 2013Applicant: KONICA MINOLTA ADVANCED LAYERS, INC.Inventor: KONICA MINOLTA ADVANCED LAYERS, INC.
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Publication number: 20130072411Abstract: A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.Type: ApplicationFiled: October 23, 2012Publication date: March 21, 2013Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventor: Advanced Technology Materials, Inc.
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Publication number: 20130073755Abstract: A processing unit package includes a processing unit disposed on an interposer and a device protocol translator disposed on the interposer. Through-silicon vias (TSVs) may be used to provide connections from the device protocol translator through the interposer to an external device. The device protocol translator uses a controller to control a plurality of buffers that store information received from respective information buses coupled to the processing unit, such that the processing unit information is translated according to a protocol of the external device.Type: ApplicationFiled: September 20, 2011Publication date: March 21, 2013Applicant: ADVANCED MICRO DEVICES, INC.Inventors: Greg Sadowski, John W. Brothers, Konstantine Iourcha
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Publication number: 20130069901Abstract: A thin touch panel includes a transparent substrate with a black bordering around the inner surface of the transparent substrate. A plurality of metal connecting structures, metal guiding lines, transparent insulating structures and a transparent sensing layer are formed on the inner surface, so that the transparent substrate not only provides a touch surface, but also has the touch sensing ability, to decrease the manufacture material and increase the transmittance of the touch panel. Besides, the manufacture of the thin touch panel may not use any optical adhesive to decrease the manufacture cost and improve the yield. Further, the thin touch panel may satisfy the trend of thin design.Type: ApplicationFiled: November 16, 2012Publication date: March 21, 2013Applicant: BUWON ADVANCED COATING TECHNOLOGY CO., LTD.Inventor: Buwon Advanced Coating Technology Co., Ltd.
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Publication number: 20130068030Abstract: The invention relates to a thermal protection element (1), which is arranged on the front side for protecting a diaphragm (11) of a pressure sensor (10) to which pressure is applied. According to the invention, the thermal protection element (1) has, in the region of the sensor diaphragm (11), lamellae (2) which run parallel or are configured as circular arc segments (8) and cover 40% to 60% of the diaphragm surface, with the ratio between the cross-sectional height (h) of the lamellae (2) and the cross-sectional width (b) thereof being 8:1 to 12:1.Type: ApplicationFiled: May 24, 2011Publication date: March 21, 2013Applicant: PIEZOCRYST ADVANCED SENSORICS GMBHInventors: Alexander Friedl, Wolfgang Michelitsch
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Publication number: 20130070515Abstract: A method and apparatus for controlling state information retention determines at least a state information save or restore condition for at least one processing circuit such as one or more CPU or GPU cores or pipelines, in an integrated circuit. In response to determining the state information save or restore condition, the method and apparatus controls either or both of saving or restoring of state information for different virtual machines operating on the processing circuit, into corresponding on-die persistent passive variable resistance memory. The state information save or restore condition is a virtual machine level state information save or restore condition. State information for each of differing virtual machines is saved or restored from differing on-die passive variable resistance memory cells that are assigned on a per-virtual machine basis.Type: ApplicationFiled: September 14, 2012Publication date: March 21, 2013Applicant: ADVANCED MICRO DEVICES, INC.Inventors: David Mayhew, Mark Hummel, Michael Ignatowski
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Publication number: 20130062650Abstract: The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package.Type: ApplicationFiled: November 6, 2012Publication date: March 14, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: SHIUN-WEI CHAN, Chih-Hsun KE
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Publication number: 20130061615Abstract: A highly efficient condensate-free cooling unit functionally based on vapor-compression refrigeration cycle has been described. The condensate collected from the evaporator of the cooling unit is routed through a sub-cooling heat exchanger where it exchanges heat with the primary heat exchange medium emerging through the condenser of the cooling unit, thus, sub-cooling the primary heat exchange medium to a lower temperature before it enters the expansion valve. Emerging from the sub-cooling heat exchanger, the condensate flows through a condensate outlet pipe into multiple spray nozzles disposed over the condensate outlet pipe. The spray nozzles sprinkle the condensate over the hot air blown into the condenser to reduce its temperature. The cooling unit has a substantially higher coefficient of performance compared to the conventional cooling units utilizing vapor-compression refrigeration cycle, and eliminates the problems of condensate removal persistent in the art.Type: ApplicationFiled: September 8, 2011Publication date: March 14, 2013Applicant: ADVANCED TECHNICAL SOLUTIONS GMBHInventor: AHMED MOHAMED MOHAMED OMER
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Publication number: 20130065332Abstract: A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.Type: ApplicationFiled: August 23, 2012Publication date: March 14, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: HSIN-CHIANG LIN, WEN-LIANG TSENG
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Publication number: 20130063857Abstract: Disclosed herein is an MEMS variable capacitor and its driving method, the MEMS variable capacitor including, a first electrode, a second electrode floating over the first electrode upper part, a fixed electrode separated at the second electrode side surface, and a drifting electrode placed between the second electrode and the fixed electrode, connected to the second electrode, and physically contacting the fixed electrode by a voltage applied to the fixed electrode.Type: ApplicationFiled: May 27, 2011Publication date: March 14, 2013Applicants: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, LG INNOTEK CO., LTD.Inventors: Chang Wook Kim, Dong Chan Park, Ju Young Song, Sang Hun Lee, Sung Bae Cho, Hyun Ho Yang, Jun Bo Yoon, Dong Hoon Choi, Chang Hoon Han
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Publication number: 20130062636Abstract: An LED device comprises a substrate, a circuit, two LED dies, a dam and a reflector. The dam divides the substrate into a first area and a second area, wherein one of the two LED dies is disposed on the first area and the other is disposed on the second area. The dam insulates radiant lights emitted from the two LED dies, whereby interference between the radiant lights can be prevented. Four separate electrodes are provided on the substrate, wherein one LED die is connected to two electrodes and the other LED die is electrically connected to the other two electrodes.Type: ApplicationFiled: March 27, 2012Publication date: March 14, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: HSING-FEN LO