Abstract: A leaching chamber for implementation in a leaching field is provided. The leaching chamber may include a first end with a first end flange and a second end with a second end flange. The first end flange may be configured to overlap and rotatably connect with a complementary end flange of a second leaching chamber such that the leaching chamber is configured to rotate with respect to the second leaching chamber and to be disposed at a selected angular orientation relative to the second leaching chamber. A first locking feature on the first end flange may be configured to engage with a locking feature on the complementary end flange to lock the leaching chamber in the selected angular orientation relative to the second leaching chamber.

Abstract: The purpose of the present invention is to provide a granulation adsorbent having high strength and in particular stability in water that ensures certain throughputs at low costs. The granulated adsorbent of the invention comprises a metal-cyano complex as an effective component, a flocculation precipitant for flocculation precipitation of the metal-cyano complex from slurry containing the metal-cyano complex, a binder, and a crosslinking agent. The granulated adsorbent is produced by a step of adding the flocculation precipitant to the metal-cyano complex slurry and then dehydrating the metal-cyano complex slurry to prepare a metal-cyano complex dehydrated cake, a step of heat drying the metal-cyano complex dehydrated cake to prepare a metal-cyano complex dried block, a step of pulverizing the metal-cyano complex dried block into metal-cyano complex powder, and a step of preparing a mixture containing the metal-cyano complex powder, binder and crosslinking agent, and then granulating using the mixture.

Abstract: The present invention relates to novel compounds that bind to the prostate-specific membrane antigen (PSMA)-binding and their use in the diagnosis and treatment of certain diseases where PSMA is upregulated.

Abstract: Disclosed is an image processing method and apparatus. The image processing method includes extracting a content latent code and a style latent code for each of a plurality of input images, obtaining a content feature vector by calculating a weighted sum of content latent codes extracted from the input images based on a morphing control parameter, obtaining a style feature vector by calculating a weighted sum of style latent codes extracted from the input images based on the morphing control parameter, and generating a morphing image based on the content feature vector and the style feature vector.

Abstract: The present invention provides a computerized system for mapping an orchard, and a method for producing precise map and database with high resolution and accuracy of all trees in an orchard.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.

Abstract: An assembly structure and a method for manufacturing the same are provided. The method for manufacturing the assembly structure includes providing a substrate defining an active region and a side rail surrounding the active region; and forming a frame structure on the side rail.

Abstract: Provided is a thin film including Mo1-xWxTe2 stacked in a plurality of layers. The thin film has a thickness of about 1 nm to about 100 nm in a stacking direction, has a symmetric lattice structure at a temperature higher than a threshold temperature, and has an asymmetric lattice structure at a temperature equal to or lower than the threshold temperature.

Abstract: A light weight composite deck panel comprising at least two pre-defined shaped and sized foams that are encapsulated with multiple layers of the bi-directionally and/or uni-directionally oriented synthetic glass fabric and the resin system and the encapsulated foams are arranged in a pre-defined configuration of the deck with at least one joint; said composite deck panel is cured. A process and assembly for manufacturing the light weight composite deck panels of the invention is disclosed.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.

Abstract: A system and method are provided that include a power supply having positive and negative terminals. The negative terminal defines a reference ground. First and second electrodes are positioned within a patient and configured to be located proximate to tissue of interest that is associated with a target region. A control circuit is configured to control delivery of current for a therapy between the first and second electrodes. A current regulator (CR) circuit is connected to, and configured to control current flow through, at least the first electrode during delivery of the therapy under direction of the control circuit. A floating power supply is connected across power supply terminals of the CR circuit. The CR circuit and floating power supply are coupled to a floating ground node that is electrically separate from the reference ground.

Abstract: A non-occluding drug-coated balloon catheter device for use in a blood vessel transporting blood comprises a catheter shaft including a guidewire lumen, a fluid lumen and a connector port. A balloon is mounted on the catheter shaft and includes an outer envelope surrounding the guidewire lumen in fluid communication with the fluid lumen; a drug coating applied on the exterior surface of the outer envelope; and at least one bypass lumen forming a passage extending from the proximal end of the outer envelope to the distal end of the outer envelope. When the balloon is positioned in a blood vessel and inflated, the exterior surface of the outer envelope presses the drug coating against the blood vessel and the bypass lumen is open between the distal end of the outer envelope and the proximal end of the outer envelope such that blood transport continues through the bypass lumen.

Abstract: A policy creation unit creates a plurality of policies each including a predetermined number of rules in which a condition for determining a state of an object is combined with an action in the state. An action determination unit determines, for each of the plurality of created policies, an action to be performed while a state of the object is changed from a first state to a second state in accordance with the policy. A policy evaluation unit determines, in accordance with a difference between a state between the first state and the second state and a desired state, the quality of the determined action and determines, for each of the plurality of policies, the quality of the policy based on the determined quality of the action. A policy selection unit selects the policy that is determined to have a high quality.

Abstract: An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.

Abstract: Various semiconductor chips and chip stack arrangements are disclosed. In one aspect, a semiconductor chip stack is provided that includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first logic layer and a first semiconductor layer on the first logic layer. The first semiconductor layer has plural first through-silicon transistors operable to selectively control the transmission of data from the first semiconductor chip to the second semiconductor chip and has plural first through-silicon vias to convey control signals to the second semiconductor chip.

Abstract: Methods and apparatuses control the clock rate of a processing unit. The methods and apparatus control the clock rate by generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking. The methods include: receiving an analog voltage supply in response to detecting overclocking in the processing unit; dynamically sensing measurements of an output voltage from a voltage generator based on the received analog voltage supply; determining characteristics of a voltage droop in the output voltage based on the dynamically sensed output voltage measurements; determining a frequency adjustment for the clock rate of the processing unit based on the determined characteristics of the voltage droop; and generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking.

Abstract: The present invention relates to a soft robot using diamagnetic levitation. Such a soft robot using diamagnetic levitation is formed of a diamagnetic material to levitate on the ground on which a magnetic field is formed, and moves in a direction toward a predetermined point of a head part when the predetermined point of the head part is heated, and may thus move and change its direction in a state in which it is not in contact with the ground.

Abstract: An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.