Patents Assigned to ADVANCED
  • Patent number: 11824029
    Abstract: A semiconductor package structure includes a first semiconductor die having an active surface and a passive surface opposite to the active surface, a conductive element leveled with the first semiconductor die, a first redistribution layer (RDL) being closer to the passive surface than to the active surface, a second RDL being closer to the active surface than to the passive surface, and a second semiconductor die over the second RDL and electrically coupled to the first semiconductor die through the second RDL. A first conductive path is established among the first RDL, the conductive element, the second RDL, and the active surface of the first semiconductor die.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: November 21, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi-Han Chen, Hung-Yi Lin
  • Patent number: 11824031
    Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure includes a substrate, a chip and a dielectric structure. The substrate includes a first portion and a second portion surrounding the first portion. The second portion defines a cavity over the first portion. The chip includes a terminal on an upper surface of the chip. The dielectric structure fills the cavity and laterally encroaches over the upper surface of the chip. The dielectric structure is free from overlapping with the terminal of the chip.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: November 21, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Cheng Lee, Jiming Li
  • Patent number: 11821834
    Abstract: A method and apparatus for measuring a 3-D refractive index tensor are presented. The method for measuring a 3-D refractive index tensor according to an embodiment comprises the steps of: controlling incident light of a plane wave with respect to at least one angle and polarization; and measuring, in a polarization-dependent manner, the 2-D diffracted light of a specimen with respect to the incident light incident at the at least one angle and polarization, wherein the birefringence value and the 3-D structure of an alignment direction of molecules in the specimen having birefringence may be measured.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: November 21, 2023
    Assignees: TOMOCUBE, INC., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yongkeun Park, Seungwoo Shin
  • Patent number: 11823142
    Abstract: A method for allocating virtual articles comprises: receiving at least two acquisition requests directed at a virtual article packet, and respectively recording receiving times of the acquisition requests, wherein the virtual article packet comprises one or more virtual article sub-packets; allocating acquisition sequence numbers respectively to the acquisition requests according to a sequential order of the receiving times of the acquisition requests; and allocating the virtual article sub-packets according to the acquisition sequence numbers for the acquisition requests corresponding to the acquisition sequence numbers, and sending virtual articles in the virtual article sub-packets to users corresponding to the acquisition requests.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: November 21, 2023
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventors: Chunxiao Guo, He Zhang
  • Patent number: 11825229
    Abstract: A dynamic vision sensor such as an event based vision sensor employs analog to digital converters (ADC), such as ramp ADCs, that analog to digital converts the signals from photoreceptors. Only previous light values need to be stored in the pixels. This is accomplished by generating three ramps. In addition, log compression can be implemented by increasing the count linearly while increasing the reference voltage exponentially, or increasing the count logarithmically while increasing the reference voltage linearly.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: November 21, 2023
    Assignee: SONY ADVANCED VISUAL SENSING AG
    Inventors: Christian Brändli, Raphael Berner
  • Patent number: 11820848
    Abstract: Polyolefins having the same or different functional groups covalently bound to the polyolefin, such as polyolefins having hindered phenol groups bound thereto, can be prepared by from a maleic anhydride modified polyolefin, with or without a coupling agent, and a hindered phenol reagent under heat, e.g., by heating the components to at least about 170° C., such as by reactive extrusion. A polyolefin having hindered phenol groups can be added to the components as a stabilizer prior to or during reacting the components together under heat.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: November 21, 2023
    Assignee: ADVANCED POLYOLEFIN TECHNOLOGIES LLC
    Inventors: Tim Hsu, Minren Lin, Tze-Chiang Chung
  • Patent number: 11822085
    Abstract: The present disclosure provides an optical adaptive device and a wearable device. The optical adaptive device includes a carrier, a first light adjusting element, and a second light adjusting element. The first light adjusting element is in or on the carrier and configured to focus a first light from a first article on a visual area. The second light adjusting element is in or on the carrier and configured to focus a second light from a second article on the visual area. The second article is further away from the area than the first article.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: November 21, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ko-Fan Tsai, Tien-Chia Liu, Kuo Sin Huang, Cheng-Te Chou
  • Patent number: 11821941
    Abstract: A method for open-loop or closed-loop control of the temperature of a chuck for a wafer includes detecting the position of a test device for testing a wafer and determining the spatial distances between the test device and a plurality of temperature measurement devices for measuring the temperature of the chuck or of a wafer supported or clamped by the chuck. The method proceeds by selecting at least one temperature measurement device from the plurality of temperature measurement devices as a reference temperature measurement device; and controlling the temperature of the chuck by open-loop or closed-loop control on the basis of the temperature(s) of the chuck or wafer as measured by the selected one or more reference temperature measurement devices.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: November 21, 2023
    Assignee: ATT ADVANCED TEMPERATURE TEST SYSTEM GMBH
    Inventor: Markus Eibl
  • Patent number: 11820845
    Abstract: Polyamine additives are disclosed that are useful to provide early water resistant to drying anionically colloidally stabilized polymer dispersions in aqueous media. The polyamines are polymerization products from ethylenically unsaturated monomers with pendant tertiary amine groups with ethylenically unsaturated monomers with pendant poly(alkylene oxide) chains of 88 to 1200 g/mole molecular weight.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 21, 2023
    Assignee: LUBRIZOL ADVANCED MATERIALS, INC
    Inventors: Shui-Jen R. Hsu, Dominic Cremona, Darlene D. Rota, Adlai J. Perry, Keith Rawlins, Stephan A. Horvath
  • Publication number: 20230369190
    Abstract: The present application discloses an integration package with insulating boards, which features an insulating board structure replacing a plurality of printed circuit boards and packaging materials in a conventional POP structure and comprises a base substrate, a basic circuit and at least an electronic component: the basic circuit is exposed on an upper surface of the base substrate; the electronic component and the basic circuit are electrically connected with each other; both the base substrate and the electronic component are thermally compressed and covered by a first insulating board.
    Type: Application
    Filed: August 23, 2022
    Publication date: November 16, 2023
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: CHUN JUNG LIN, RUEI TING GU
  • Publication number: 20230367175
    Abstract: The provided programmable photonic circuit includes a tunable optical coupler, an optical phase shifter, and a control unit. First and second waveguides are provided in a first section corresponding to each other in the tunable optical coupler, and the tunable optical coupler includes a first actuator to adjust optical coupling efficiency of an optical signal between the first and second waveguides. One waveguide of the first and second waveguides, and a perturbation waveguide are provided in a second section corresponding to each other in the optical phase shifter, and the optical phase shifter includes a second actuator to change the phase of an optical signal traveling through the one waveguide, by changing an effective refractive index of an optical mode of the one waveguide according to the gap between the one waveguide and the perturbation waveguide. The control unit controls driving signals applied to the first and second actuators.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 16, 2023
    Applicants: DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sangyoon HAN, Kyoungsik Yu
  • Patent number: 11813252
    Abstract: The invention relates to a method of treating or preventing Parkinson's disease in a subject comprising administering a compound of Formula I wherein, R1 is —NHC(O) C3-6 cycloalkyl and R2 is hydrogen; or R1 and R2 along with the carbon atoms to which they are attached form a six membered aromatic ring, wherein the ring is substituted with one or more groups selected from hydrogen, halogen and C1-6 alkyl; R3 and R4 are independently selected from group comprising hydrogen, halogen, C1-3 alkyl, OC1-3 alkyl, NO2, SC1-3 alkyl, C1-3 haloalkyl, OC1-3 haloalkyl, and SC1-3 haloalkyl; or a pharmaceutically acceptable salt thereof.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: November 14, 2023
    Assignee: SUN PHARMA ADVANCED RESEARCH COMPANY LTD.
    Inventors: Nitin Krishnaji Damle, Sanjay Nandlalji Mandhane, Manoj Atmaramji Upadhya, Sameer Vishwanath Mehetre, Gajanan Uttamrao Chidrewar, Prabal Sengupta, Trinadha Rao Chitturi
  • Patent number: 11815986
    Abstract: Error handling for resilient software includes: receiving data indicating a region of resilient memory; detecting an error associated with a region of memory; and preventing raising an exception for the error in response to the region of memory falling within the region of resilient memory by preventing the region of memory as being identified as including the error.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: November 14, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sudhanva Gurumurthi, Vilas Sridharan
  • Patent number: 11817178
    Abstract: In one aspect, methods are described herein for enhancing one or more nucleic acid interactions. For example, in some embodiments, methods of enhancing one or more steps of polymerase chain reaction (PCR) are described herein. In some embodiments, the optimal temperature cycling protocol for one or more PCR cycles can be determined according to methods described herein.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: November 14, 2023
    Assignee: CHAKRABARTI ADVANCED TECHNOLOGY LLC
    Inventor: Raj Chakrabarti
  • Patent number: 11812739
    Abstract: Provided are a vitrification stabilizer for an animal cell cryopreservation fluid, and an animal cell cryopreservation fluid which exhibits superior vitrification capabilities due to the animal cell cryopreservation fluid containing the vitrification stabilizer for an animal cell cryopreservation fluid. The vitrification stabilizer for an animal cell cryopreservation fluid contains: an amphoteric polymer compound selected from the group consisting of (a) a carboxylated amphoteric polymer compound obtained by reacting ?-poly-L-lysine with butyl succinic anhydride, (b) a carboxylated amphoteric polymer compound obtained by reacting ?-poly-L-lysine with butyl succinic anhydride and succinic anhydride, or (c) a carboxylated amphoteric polymer compound obtained by reacting ?-poly-L-lysine with a compound represented by formula I; and (d) a sucrose polymer macromolecule to which epichlorohydrin has been crosslinked.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: November 14, 2023
    Assignee: JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kazuaki Matsumura, Toshiaki Naka
  • Patent number: 11817421
    Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: November 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi Dao Wang, Tung Yao Lin, Rong He Guo
  • Patent number: 11816714
    Abstract: Embodiments of the present disclosure provide a service-verification method and apparatus, wherein the method comprises: respectively receiving service parameters sent by a same user account on different terminals, respectively calculating corresponding service data according to the service parameters sent by each terminal; storing a plurality of corresponding relationships, each corresponding relationship comprising: service parameters sent by one terminal and corresponding calculated service data; when a service-processing request sent by any one of the different terminals is received and the service-processing request carries a target service parameter and target service data used in a current service, obtaining service data corresponding to the target service parameter according to the corresponding relationships; and acquiring a verification result according to a comparison between the obtained service data and the target service data.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: November 14, 2023
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventor: Jian Peng
  • Patent number: 11818473
    Abstract: An ultrathin camera device is provided. The ultrathin camera device comprises an optical module including a microlens array in which microlenses are arranged, an image sensor that outputs electrical image signals by sensing light coming through the microlens array, spacers that form a focal length by separating the optical module from the image sensor, and a processor that outputs a final image by reconstructing array images generated from the image signals with a designated imaging process depending on a distance at which the object is located. Here, each microlens convexly protrudes toward the image sensor.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: November 14, 2023
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ki-Hun Jeong, Kisoo Kim, Kyung-Won Jang, Sang-In Bae
  • Patent number: 11817362
    Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: November 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pang Yuan Lee, Kuei-Hao Tseng, Chih Lung Lin
  • Patent number: 11817397
    Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: November 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Hui-Chung Liu, Yu-Che Huang