Abstract: A semiconductor device includes a first semiconductor die, a second semiconductor die and a plurality of supporting structures. The first semiconductor die includes a plurality of first bumps disposed adjacent to a first active surface thereof. The second semiconductor die includes a plurality of second bumps disposed adjacent to a second active surface thereof. The second bumps are bonded to the first bumps. The supporting structures are disposed between the first active surface of the first semiconductor die and the second active surface of the second semiconductor die. The supporting structures are electrically isolated and are disposed adjacent to a peripheral region of the second active surface of the second semiconductor die.

Abstract: The present invention provides a novel albumin-free preparation of Factor VIII has a high amount of salt and a low concentration of sugar and of glycine. The high salt provides stability and an elegant cake structure as the major crystalline component. The sugar and glycine provide a complex amorphous matrix together with some amorphous non-crystallized salt for stabilization of Factor VIII. This formulation is suitable for B-domain deleted Factor VIII that requires a high ionic strength environment for stability. The addition of low amount of glycine to the sucrose prevents the crystallization of salt. This results in an amorphous matrix comprising of glycine, sucrose, and salt. This amorphous matrix provides a stabilizing environment where Factor VIII is protected by three stabilizers; amino acid (glycine), sugar (sucrose or trehalose), and salt (NaCl). Such an amorphous matrix that can stabilize the Factor VIII across lyophilization and during storage as a lyophile.

Abstract: A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 ?m.

Abstract: A voice guide device and a method thereof provided in the present disclosure are characterized that a terminal module is inserted into a smart device's jack through which a little electricity is received, stored, transformed and transmitted to a voice generation unit so that an audio signal, which is generated with default voice data read, is transmitted to the smart device from a terminal module for driving the smart device.

Abstract: Square root operations in a computer processor are disclosed. A first iteration for calculating partial results of a square root operation is performed in a larger number of cycles than remaining iterations. The first iteration requires calculation of a first digit that is larger than the subsequent digits. The first iteration thus requires multiplication of values that are larger than corresponding values for the subsequent other digits. By splitting the first digit into two parts, the required multiplications can be performed in less time than if the first digit were not split. Performing these multiplications in less time reduces the total delay for clock cycles associated with the first digit calculations, which increases the possible clock frequency allowed. A multiply-and-accumulate unit that performs either packed-single operations or double-precision operations may be used, along with a combined division/square root unit for simultaneous execution of division and square root operations.

Abstract: A vehicle and ladar sensor assembly system is proposed which makes use of forward mounted long range ladar sensors and short range ladar sensors mounted in auxiliary lamps to identify obstacles and to identify potential collisions with the vehicle. A low cost assembly is developed which can be easily mounted within a body panel cutout of a vehicle, and which connects to the vehicle electrical and computer systems through the vehicle wiring harness. The vehicle has a digital processor which interprets 3D data received from the ladar sensor assembly, and which is in control of the vehicle subsystems for steering, braking, acceleration, and suspension. The digital processor onboard the vehicle makes use of the 3D data and the vehicle control subsystems to avoid collisions and steer a best path.

Abstract: Techniques for improving branch target buffer (“BTB”) operation. A compressed BTB is included within a branch prediction unit along with an uncompressed BTB. To support prediction of up to two branch instructions per cycle, the uncompressed BTB includes entries that each store data for up to two branch predictions. The compressed BTB includes entries that store data for only a single branch instruction for situations where storing that single branch instruction in the uncompressed BTB would waste space in that buffer. Space would be wasted in the uncompressed BTB due to the fact that, in order to support two branch lookups per cycle, prediction data for two branches must have certain features in common (such as cache line address) in order to be stored together in a single entry.

Abstract: With the success of programming models such as OpenCL and CUDA, heterogeneous computing platforms are becoming mainstream. However, these heterogeneous systems are low-level, not composable, and their behavior is often implementation defined even for standardized programming models. In contrast, the method and system embodiments for the heterogeneous parallel primitives (HPP) programming model disclosed herein provide a flexible and composable programming platform that guarantees behavior even in the case of developing high-performance code.

Abstract: Electronic circuitry for mounting on articles, such as vehicles, is concealed by embedding the circuitry using at least an overlying polymeric material within a concealed embedded circuitry structure. The concealed embedded circuitry is capable of ready and effective application to an article and is capable of being retrofitted to articles after their fabrication.

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

Abstract: A polyarylene composition containing one or more polyarylenes and one or more sterically hindered phenolic stabilizers. The polyarylene composition has enhanced resistance to discoloration and degradation under thermal stress.

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.

Abstract: A semiconductor package structure includes at least one semiconductor die, at least one conductive pillar, an encapsulant and a circuit structure. The semiconductor die has an active surface. The conductive pillar is disposed adjacent to the active surface of the semiconductor die. The encapsulant covers the semiconductor die and the conductive pillar. The encapsulant defines at least one groove adjacent to and surrounding the conductive pillar. The circuit structure is electrically connected to the conductive pillar.

Abstract: A coordinated transmission method based on beam division multiple access and an apparatus performing the same are disclosed. The coordinated transmission method in a beam division multiple access environment, which divides a service target region into a plurality of beam sectors through a plurality of antenna arrays having at least one of a pattern characteristic and a polarization characteristic, includes receiving a coordination request from a user terminal located in the service target region and performing any one among a macro diversity operation, a coordinated silence operation, and a coordinated beamforming operation for the user terminal based on an interference level included in the coordination request.

Abstract: A digitalized voice guide device and a method thereof provided in the present disclosure are characterized that: a connecting interface of a digitalized voice guide device is inserted into a smart device's jack through which electricity is transmitted to all components on a substrate; a voice unit communicates with the smart device for signal exchange based on a acoustic mode; voice data read by the voice unit is transmitted to the smart device through the connecting interface.

Abstract: A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. The package element includes at least two electrical contacts electrically connected to the circuit layer. The first encapsulant is disposed on the circuit layer. The first encapsulant encapsulates the electronic component and the package element and exposes the electrical contacts of the package element.

Abstract: A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. The first encapsulation layer surrounds a portion of the electrical connection terminal and exposes the electrical connection terminal.

Abstract: Disclosed are a three-phase wireless power transfer (WPT) system and three-phase wireless rechargeable unmanned aerial vehicle (UAV) system based on the same. Three power receiving coils, including resonators, are installed at the ends of three landing leg of the UAV. A three-phase power converter installed in the UAV receives the three-phase AC induction current induced in three power receiving coils, including resonators, converting the three-phase AC induction current into a DC current to be charged in a battery. A three-phase power wireless charging apparatus wirelessly transfers three-phase power from three power transmitting coils to the three power receiving coils of the UAV when the three landing legs land on three coil seating units provided on a charging platform. A magnetic flux leakage shielding coil may be provided to prevent magnetic flux leakage from approaching the UAV. The power transfer efficiency is excellent, and electromagnetic interference can be also reduced.

Abstract: A method and system are described for a refrigerant distributor, and for attaching the distributor tubes to an evaporator coil. A short tube can inserted into the bell end of a tube and the bell end can be crimped around the short tube to lock it into place. The short tube preferably has a bead or widened shaft around which to crimp the bell. The disclosure is particularly beneficial for aluminum based components because aluminum is more susceptible to blockages or leaking due to problems from brazing.