Abstract: A frustum bounds a subset of rays projected into a virtual scene to be rendered. The frustum is transformed from a Cartesian coordinate space to a spherical coordinate space using a transform matrix that places a central ray of the frustum as the Z-axis. A projection hemisphere centered around the central ray is defined. The extents of the intersection of the transformed frustum and the surface of the projection hemisphere are bound by a frustum circle. A geometric object in the scene or a bounding volume is bound by a bounding sphere, which is transformed into the spherical coordinate system using the transform matrix, and then projected onto the surface of the projection sphere to define a bounding circle. The frustum is identified as intersecting the geometric object or bounding volume responsive to angular overlap and distance overlap between the frustum circle and the bounding circle.

Abstract: Disclosed are a capacitor for DRAM, a DRAM including the same, and a method of fabricating the same. The DRAM capacitor according to an embodiment may include a first electrode of the DRAM; a second electrode spaced apart from the first electrode; and a dielectric layer including a HfZrO film disposed between the first electrode and the second electrode. The HfZrO film may have an intermediate state corresponding to a phase transition region between a first state in which a tetragonal crystalline phase with anti-ferroelectricity property or a tetragonal crystalline phase is dominant, and a second state in which the orthorhombic crystalline phase with anti-ferroelectricity property or the orthorhombic crystalline phase is dominant. The HfZrO film may include both of the tetragonal crystalline phase and the orthorhombic crystalline phase. The HfZrO film maintains an intermediate state corresponding to the phase transition region within the operating voltage range of the capacitor.

Abstract: This application discloses a two-dimensional code identification method, device and a mobile terminal. The two-dimensional code identification method comprises: sensing a capture operation performed by a user on an application interface, the application interface containing a two-dimensional code; in response to the sensed capture operation, capturing an image of the application interface; scanning the image to obtain two-dimensional code information of the two-dimensional code contained in the image.

Abstract: A technique for performing ray tracing operations is provided. The technique includes determining a set of keys and a set of values corresponding to dimensions of a bounding box for a scene; sorting the set of keys and the set of values to generate a sorted set of values; and based on the sorted set of values, generating a Morton code for a triangle of the scene.

Abstract: A semiconductor package includes a substrate having opposing first and second surfaces as well as a semiconductor chip component disposed at the second surface and having third and fourth opposing surfaces. A package lid structure is affixed to the second surface of the substrate and the fourth surface of the semiconductor chip component, and has a planar component overlying the semiconductor chip component and having a fifth surface facing the fourth surface and an opposing sixth surface. The planar component includes an aperture extending between the fifth surface and the sixth surface so as to expose at least a portion of the fourth surface of the semiconductor chip component. A thermal exchange structure can be mounted on the package lid structure to form a thermal extraction pathway with the semiconductor die component via the aperture, either directly or via an interposing thermally conductive plate.

Abstract: A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

Abstract: Disclosed is a method for timed pattern-based collaboration failure analysis in a platooning system-of-systems (SoS). A method for timed pattern-based collaboration failure analysis in a SoS performed by a computer device may include extracting an interaction collaboration failure pattern through a collaboration failure analysis in an interaction model generated from an interaction log executed in the SoS; and localizing a fault of an interaction bug from the extracted interaction collaboration failure pattern.

Abstract: A method can include overriding settings of an integrated circuit device by reading one or more settings from a setting record that correspond to a part number of the integrated circuit device. The method can also include performing an override of the settings of the integrated circuit device based on the one or more settings of the setting record that correspond to the part number of the integrated circuit device. Various other methods and systems are also disclosed.

Abstract: A SNP-based model for predicting the occurrence of irAEs induced by immunotherapy. The dbSNP database rs541169 and a single nucleotide polymorphism (SNP) site in the TMEM162 (FAM187B) gene are closely correlated with the occurrence of irAEs. The rs541169 can be advantageously used as a biomarker for predicting the occurrence of irAEs induced by immunotherapy or predicting responsiveness to immunotherapy.

Abstract: A fluid transfer system component for internally measuring fluid density in real- time. The component may be a flange comprising a base having a first face and a second face, a primary fluid passageway extending through the base from the first face to the second face, a secondary fluid passageway extending through the base from the first face to the second face, and an outside wall, a portion of which is configured to operably engage with a measuring device and comprises a third opening. The primary fluid passageway may have a non-circular cross-section allowing the secondary fluid passageway to be parallel to the primary fluid passageway. The third opening may be in fluid communication with the secondary fluid passageway allowing the measurement device to measure fluid data such as fluid density via the secondary fluid passageway.

Abstract: A system and a method include a container configured to retain one or more liquids. A liquid level sensor is disposed within the container. The liquid level sensor includes sensing elements configured to sense a level of the one or more liquids within the container. A control unit is in communication with the liquid level sensor. The control unit is configured to determine a status of each of the sensing elements based on signals received from the sensing elements.

Abstract: One embodiment of the present disclosure provides a scintillation crystal and a method and a device for preparing the scintillation crystal. A molecular formula of the scintillation crystal is: Cey:Cas:Lu2(1-xysz)Y2zSc2xSiO5, wherein x=0-1, y=0.0000001-0.06, z=0.00001-0.5, s=0.0000001-0.05.

Abstract: A polyester multi-layer film of the present invention comprises: a substrate layer comprising polyester; and a skin layer located on at least one surface of the substrate layer, wherein the polyester multi-layer film suppresses generation of oligomers in the film and migration to the surface even in a high-temperature treatment process by satisfying a predetermined correlation between the concentration of cyclic oligomers in the film and a haze value before and after heat treatment, thereby maintaining transparency and visibility of the film in the long term.

Abstract: The present disclosure addresses the problem of providing a method for decomposing a crosslinked rubber that can improve monomer yield. The solution is a method of decomposing a crosslinked rubber that includes: a first decomposition step of pyrolyzing a crosslinked rubber containing a diene rubber at a temperature of 150° C. or more and 400° C. or less, and a second decomposition step of pyrolyzing a decomposition product obtained by the first decomposition step under an inert gas atmosphere and in the presence of a catalyst at a temperature of 300° C. or more and 950° C. or less. Preferably 80 mass % or more of the diene rubber in the crosslinked rubber is decomposed to diene oligomers having a weight-average molecular weight of 100 to 50,000 via the first decomposition step.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Abstract: Method and apparatus monitor eviction conflicts among cache directory entries in a cache directory and produce cache directory victim entry information for a memory manager. In some examples, the memory manager reduces future cache directory conflicts by changing a page level physical address assignment for a page of memory based on the produced cache directory victim entry information. In some examples, a scalable data fabric includes hardware control logic that performs the monitoring of the eviction conflicts among cache directory entries in the cache directory and produces the cache directory victim entry information.

Abstract: Relatively non-invasive devices and methods for heating or cooling a patient's body are disclosed. Devices and methods for treating ischemic conditions by inducing therapeutic hypothermia are disclosed. Devices and methods for inducing therapeutic hypothermia through esophageal cooling are disclosed. Devices and methods for operative temperature management are disclosed.

Abstract: A memory package includes first, second, third, and fourth channels arranged consecutively in a clockwise direction on the memory package, each of the first, second, third, and fourth channels having access circuitry and memory arrays. In a first mode, the first channel controls access to the memory arrays in the second channel and the fourth channel controls access to the memory arrays in the third channel.