Patents Assigned to ADVANCED
  • Publication number: 20250131533
    Abstract: An image processing device includes an image sensor including a unit block including a plurality of pixels arranged adjacent to each other, wherein a plurality of nano-posts are arranged on the unit block, and a processor that processes an input image acquired through the image sensor.
    Type: Application
    Filed: October 24, 2024
    Publication date: April 24, 2025
    Applicants: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Soongeun Jang, Changick Kim, Woo-Shik Kim, Hongkyu Park, Sangyun Lee, Sangyoon Lee, Junho Lee, Minbeom Kim, Yooseung Wang, Jaehyuk Jang, Seungjun Jeong
  • Publication number: 20250130110
    Abstract: A microbolometer and a method of manufacturing the same are provided. The microbolometer may include a substrate, an absorption layer configured to absorb incoming light in a specific wavelength range and including an absorption body configured to float from the substrate and electrically isolated by a channel; a resistance layer provided between the substrate and the absorption body of the absorption layer and having a resistance value that changes based on temperature variations caused by thermal energy absorbed through the absorption layer; and a resistance reduction layer provided between the absorption layer and the resistance layer to reduce interface resistance and divided by a channel correspond to the channel of the absorption layer.
    Type: Application
    Filed: June 17, 2024
    Publication date: April 24, 2025
    Applicants: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jae Chul PARK, Sanghun JEON
  • Publication number: 20250130794
    Abstract: The disclosed processing circuit can perform an operation with a first operand having a first number format and a second operand having a second number format by directly using the first operand in the first number format and the second operand in the second number format to produce an output result. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 24, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Shubh Shah, Ashutosh Garg, Bin He, Michael Mantor, Shubra Marwaha, Subramaniam Maiyuran
  • Publication number: 20250130769
    Abstract: The disclosed circuit is configured to round a value in a first number format using a random value. Using the rounded value, the circuit can convert the rounded value to a second number format that has a lower precision than a precision of the first number format. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 24, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Shubh Shah, Ashutosh Garg, Bin He, Michael Mantor, Shubra Marwaha, Subramaniam Maiyuran
  • Publication number: 20250133322
    Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.
    Type: Application
    Filed: December 30, 2024
    Publication date: April 24, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Yi WU, Hung Yi LIN, Jenchun CHEN
  • Publication number: 20250133662
    Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.
    Type: Application
    Filed: December 31, 2024
    Publication date: April 24, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tun-Ching PI, Ming-Hung CHEN
  • Publication number: 20250130958
    Abstract: Root-trusted guest memory page management is described. A root-trusted guest is loaded by a hardware platform and authenticated. The root-trusted guest is configured to manage memory operations of different guests via special privileges that permit the root-trusted guest to execute memory operations using a guest's private memory page. To do so, a guest page table includes a novel “T-bit” in each entry, which indicates whether the root-trusted guest or a different guest owns the associated memory page. Each entry in the guest page table for the root-trusted guest additionally includes a “C-bit” that indicates whether the corresponding memory page is a protected page. Combined C-bit and T-bit values for a page table entry dictate whether operations performed as part of handling a guest's memory request are offloaded from the hardware platform to the root-trusted guest.
    Type: Application
    Filed: October 24, 2024
    Publication date: April 24, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Reshma Lal, David A. Kaplan, Jelena Ilic
  • Publication number: 20250129451
    Abstract: A copper alloy for electronic materials, in which an amount of Ni is 1.0% by mass or less, the copper alloy including 0.5 to 2.5% by mass of Co, and including Si such that a mass ratio (Ni+Co)/Si is 3 to 5, the remainder consisting of copper and inevitable impurities, wherein an average Taylor factor under plane strain that elongates in a direction perpendicular to a rolling direction and reduces plate thickness is 3.5 or less, a crystal grain size is 10 ?m or less, and a 0.2% yield stress in the rolling direction is 700 MPa or more, and an electrical conductivity in the rolling direction is 50% IACS or more.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 24, 2025
    Applicant: JX Advanced Metals Corporation
    Inventor: Yuta NAKAMURA
  • Publication number: 20250128057
    Abstract: An exemplary assembly may be adapted for insertion into a cochlea. The assembly may comprise a tubular element and an electrode lead having a flexible body and one or more electrode contacts located on the flexible body. The tubular element may comprise a lumen that extends along a length of the flexible body; and a plurality of fiber windings that wrap around and extend along the length of the tubular element. The plurality of fiber windings may include a first section having a first winding configuration and second section having a second winding configuration. In response to application of pressure within the lumen, the first section is configured to move in a first manner based on the first winding configuration and the second section is configured to move in a second manner based on the second winding configuration such that the electrode lead is steerable during insertion into the cochlea.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 24, 2025
    Applicant: Advanced Bionics LLC
    Inventors: Stephan Geiger, Martin Grossoehmichen
  • Publication number: 20250130774
    Abstract: The disclosed circuit can interpret a bit sequence as a value based on one of multiple floating point number formats in a bias mode indicated by a bias mode indicator. The circuit can and perform an operation using the value in the bias mode. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 24, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Shubh Shah, Ashutosh Garg, Bin He, Michael Mantor, Shubra Marwaha, Subramaniam Maiyuran
  • Publication number: 20250132261
    Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.
    Type: Application
    Filed: December 24, 2024
    Publication date: April 24, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chao Wei LIU
  • Publication number: 20250129285
    Abstract: The disclosure provides a composition containing nylon 66 used in treatment fluids during well stimulation methods for application in reservoirs with very high temperatures. Methods for the application of nylon 66 in treatment fluid as a diverting and bridging agent for high temperature reservoirs are also discussed.
    Type: Application
    Filed: October 18, 2024
    Publication date: April 24, 2025
    Applicant: LyondellBasell Advanced Polymers Inc.
    Inventor: Bradley L. Todd
  • Publication number: 20250130715
    Abstract: A system includes memory hardware including a memory and a processing-in-memory component. A system includes a host including at least one core. A system includes a memory controller including a scheduling system. The scheduling system transforms an all-bank processing-in-memory command into multiple masked processing-in-memory commands. The scheduling system also schedules the multiple masked processing-in-memory commands to the processing-in-memory component.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 24, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Vignesh Adhinarayanan, Shaizeen Dilawarhusen Aga
  • Patent number: 12281047
    Abstract: Disclosed is a low temperature co-fired dielectric material with an adjustable dielectric constant, wherein it comprises a zirconia main phase and a silicon-based amorphous filler, a weight ratio of the zirconia main phase to the silicon-based amorphous filler is 40-65:35-60; a weight percentage of SiO2 in the silicon-based amorphous filler is ?50%. The dielectric constant of low temperature co-fired dielectric material can be continuously adjusted in a wide range of 7-12, the dielectric loss can be as low as 0.1% at 1 MHz. The material system can be sintered at 800-900° C. and co-fired with silver electrode. It can be used as the low temperature co-fired dielectric material. The invention also discloses a method for preparing the low temperature co-fired dielectric material with an adjustable dielectric constant.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: April 22, 2025
    Assignee: GUANGDONG FENGHUA ADVANCED TECHNOLOGY HOLDING CO., LTD.
    Inventors: Shiwo Ta, Xiaozhou Wang, Tao Chen, Yun Liu, Terry James Frankcombe, Zhenxiao Fu, Xiuhua Cao, Chunyuan Hu
  • Patent number: 12281196
    Abstract: The present invention relates to a polyester tire cord made of polyester yarn and having a 5% LASE of 1.2 g/d or more as measured according to ASTM D885 at 80° C., a 5% LASE of 1.0 g/d or more as measured according to ASTM D885 at 120° C., and a toughness retention rate of 65% or more at 80° C. and 120° C. The tire cord of the present invention has a modulus comparable to that of rayon even in a high-temperature environment at 120° C. or higher, and has excellent dimensional stability and heat resistance, and thus it can be advantageously applied to a high-performance tire.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: April 22, 2025
    Assignee: HS Hyosung Advanced Materials Corporation
    Inventors: Si-Hwan Joo, Cheol Kim, Jin-Kyeong Park
  • Patent number: 12280542
    Abstract: Additive manufacturing compositions include low-absorbing particles or non-absorbing particles that have an absorbance for wavelengths of 300 nm to 700 nm that is equal to or greater than 0 Au and is less 1.0 Au, such as 0.001 Au absorbance?0.7 Au. Slurries including such particles and an uranium-containing particle and that are used in additive manufacturing processes have an increased penetration depth for curative radiation. Removal of low-absorbing particles or non-absorbing particles during post-processing of as-manufactured products results in pores that create porosity in the as-manufactured product that provide a volume accommodating fission gases and/or can enhance wicking of certain heat pipe coolant liquids.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: April 22, 2025
    Assignee: BWXT Advanced Technologies LLC
    Inventors: John R. Salasin, Benjamin D. Fisher
  • Patent number: 12282428
    Abstract: In response to generating one or more speculative prefetch requests for a last-level cache, a processor determines prefetch analytics for the generated speculative prefetch requests and compares the determined prefetch analytics of the speculative prefetch requests to selection thresholds. In response to a speculative prefetch request meeting or exceeding a selection threshold, the processor selects the speculative prefetch request for issuance to a memory-side cache controller. When one or more system conditions meet one or more condition thresholds, the processor issues the selected speculative prefetch request to the memory-side cache controller. The memory-side cache controller then retrieves the data indicated in the selected speculative prefetch request from a memory and stores it in a memory-side cache in the data fabric coupled to the last-level cache.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: April 22, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Tarun Nakra, Akhil Arunkumar, Paul Moyer, Jay Fleischman
  • Patent number: 12283900
    Abstract: A flexible actuator for curved surfaces and a control method thereof is used for curved surfaces and generates high vibration using a relatively low voltage.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: April 22, 2025
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyoung Jin Chang, Dong Chul Park, Ki Uk Kyung, Hyun Woo Kim, Min Ki Kim, Jong Seok Nam, Ji Hyeong Ma
  • Patent number: 12280288
    Abstract: An exercise device is provided using, for example, handles, connected to cords that increase in tension as the handles are pulled. The tension may be provided using elasticity of the cords or by an actuator, for example powered by an electric motor. Pulleys allow adequate extension while remaining compact enough to fit in a standard height room and allowing accessibility to components. Upper and forward pulleys may be used. The upper pulleys may be displaced from potential obstacles, including the forward pulleys.
    Type: Grant
    Filed: November 6, 2023
    Date of Patent: April 22, 2025
    Assignee: Genesis Advanced Technology Inc.
    Inventors: James Brent Klassen, David Michael Bernhardt, Javier Peter Fernandez-Han
  • Patent number: 12283537
    Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 22, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: You-Lung Yen, Bernd Karl Appelt