Abstract: A light emitting device and a method of fabricating the device include a wavelength selective reflector that is formed between a light source and a layer of phosphorescent material. The light emitting device is a phosphor-conversion light emitting diode (LED) that outputs secondary light that is converted from primary light emitted from the light source. In the preferred embodiment, the light source is a Gallium Nitride (GaN) die and the wavelength selective reflector is a distributed Bragg reflector (DBR) mirror. The DBR mirror is comprised of multiple alternating layers of high and low refractive index materials. The high refractive index material may be Titanium Dioxide (TiO.sub.2) and the low refractive index material may be Silicon Dioxide (SiO.sub.2). An encapsulating layer over the GaN die provides a distance between the GaN die and the DBR mirror. Preferably, the encapsulating layer is a dome-shaped structure and the DBR mirror forms a dome-shaped shell over the encapsulating layer.

Abstract: In an apparatus for testing an electronic device, a life of a measurement board is significantly extended by interposing a plate member between the measurement board and a device mounting member for accommodating the electronic device. The plate member has a plurality of rear pads to be brought into contact with each of the pads of the measurement board on a back surface thereof and a plurality of front pads electrically connected to each of the rear pads through via holes on a front surface thereof. The plate member is places between the measurement board and the device mounting member on testing the electronic device and can be readily replaced by a new one when it is worn away.

Abstract: This invention relates to an external defibrillator whose language of operation can be easily changed when the defibrillator is deployed for use. Defibrillators include, manual defibrillators, automatic or semi-automatic external defibrillators ("AEDs") and defibrillator trainers. In one embodiment, the invention provides a way to change the language in which the defibrillator delivers instructions to a user. Defibrillators of this invention would contain multiple languages in their memory. During the set-up of the defibrillator some or all of the languages could be designated as a language in which a prompt will be offered. Additionally, during set-up, one language will be designated as the default language. Once the defibrillator is deployed for use in an emergency, the operator will indicate a language preference for the defibrillator operating instructions.

Abstract: A fan assisted heat sink cooling device is disclosed in which the heat sink assembly also forms the housing surrounding the fan. The housing is constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. The vanes are angled in an approximately opposite manner to the orientation of the fan blades in order to minimize the noise generated by the cooling device when in operation. The cooling device operates in an extremely efficient manner by causing air to pass over the cooling vanes twice.

Abstract: A mass spectrometer method and apparatus improve resolution and sensitivity. A voltage supply is coupled to a mass filter for applying a radio frequency voltage and for operating at at least one selected frequency. An ion optical element such as an entrance lens is driven by a voltage supply that is phase coherent with the voltage applied to the mass filter. The ion beam is tailored so that the phase space relationship of the ions is more closely matched to the acceptance of the mass filter. The ions in the incoming beam are dynamically matched to the acceptance of the mass filter over each cycle of the voltage applied to the mass filter. The ion optical element may be a single entrance lens to which is applied only a single phase coherent voltage.

Abstract: An automatic ultrasound measurement system reduces the necessary amount of user interaction by correlating the results of one or more basic ultrasound measurements with a known set of parameters corresponding to the diagnoses of various potential conditions to automatically provide the user with the most probable potential diagnoses and with recommendations for additional measurements relevant to those potential diagnoses.

Abstract: An application-specific integrated circuit (ASIC) with a CPU module and a memory module connected to the CPU. The memory has a size selected from a set of alternative memory sizes. The CPU has a memory interface device having an output connected to the memory, and includes a memory test device connected to the memory. The memory test device has a size selector input that receives a memory size code, so that the memory test device is operable to test a memory module of any of the alternative memory sizes in response to alternative memory size codes received on the size selector input. The memory may be RAM or ROM, and the size codes may correspond to address size data stored in the memory test device.

Abstract: A pen like computer pointing device images as an array of pixels the spatial features of generally any micro textured or micro detailed work surface below the tip of the pen. The photo detector responses are digitized and stored as a frame into memory. Motion produces successive frames of translated patterns of pixel information, which are compared by autocorrelation to ascertain the direction and amount of movement. A contact sensor senses when the tip of the pointing device is in contact with the work surface. Buttons are included on the body of the pointing device that allow it to function in place of a computer mouse device.

Abstract: A Group III-nitride semiconductor device that has a low voltage-drop p-contact and comprises a substrate layer, a metal electrode and an intermediate layer sandwiched between the substrate layer and the metal electrode. The substrate layer is a layer of a p-type Group III-nitride semiconductor, and the intermediate layer includes a Group III-nitride semiconductor in which atoms of a Group V element other than nitrogen have been substituted for a fraction of nitrogen atoms. The Group III-nitride semiconductor device is made by providing a substrate including a p-type Group III-nitride semiconductor having an exposed surface. Atoms of a Group V element other than nitrogen are substituted for a fraction of the nitrogen atoms of the p-type Group III-nitride semiconductor to form an intermediate layer extending into the p-type Group III-nitride semiconductor from the exposed surface. Metal is then deposited on the exposed surface to form an electrode in electrical contact with the intermediate layer.

Abstract: Method and apparatus for low-power charge transition in an I/O system of an integrated circuit comprising an interconnected linking of stepwise charging and charge recycling of capacitive loads. The I/O system according to the invention does not need additional pins for recycling capacitors, additional silicon area for on-chip capacitors, or additional power supplies. This I/O system achieves power savings of 20% to 30% of CV.sup.2 f.

Abstract: A barrier for preventing water or oxygen from a source thereof from reaching a device that is sensitive to water or oxygen. The barrier is constructed by depositing a first polymer layer between the device and the source. An inorganic layer is deposited on the first polymer layer of the device by plasma enhanced chemical vapor deposition utilizing an electron cyclotron resonance source ECR-PECVD. A second polymer layer is then deposited on the inorganic layer. The inorganic layer is preferably an oxide or nitride. A second barrier layer having a compound that absorbs oxygen or water can be placed between the inorganic layer and the device to further retard the passage of oxygen or water. The present invention is particularly useful in encapsulating electroluminescent displays.

Abstract: The present inventions provides a method and apparatus for analyzing serial data. The invention comprises a serial analyzer which receives serial data from a logic analyzer. The serial analyzer processes the data to convert the serial data into parallel words. A listing tool receives the parallel words and generates a listing to be displayed. The listing generated is arranged in a first column and the sampled serial data is in a second column, so that, a user may view simultaneously the parallel word and the serial data corresponding to it. The listing tool also receives a time and state at which each bit of serial data was captured by the logic analyzer. The listing tool arranges the time of each bit of serial data in a third column, and the state at which each bit of serial data occurred in a fourth column. Thus, the user may simultaneously view on a display the parallel words, the sampled serial data, the time of capture, and the states corresponding to each bit in the serial data.

Abstract: A drive circuit that produces an over-voltage signal and protects circuit components from the over-voltage signal (i.e., such that circuit components operate within process specification limits). A photosensitive pixel cell can be driven by the drive circuit. Use of the drive circuit increases dynamic range of the pixel cell and reduces "ghost images." Control logic selectively passes an over-voltage signal to individual rows of a 2-D pixel array.

Abstract: A variable optical delay element that is physically compact introduces time delays to an applied optical signal. The variable optical delay element includes a pair of substantially parallel members, each having a linear reflective surface facing the reflective surface of the other member. An input lens secured to a first end of the first linear member collimates an optical beam launched by an input fiber while an output lens secured to a second member focuses the collimated optical beam onto an optical output fiber. A first actuator adjusts the offset relationship between the members in a direction parallel to the pair of members to designate the number of reflections of the collimated optical beam by the reflective surfaces before being received by the output lens. A second actuator adjusts the distance separating the linear reflectors. The optical signal is delayed by a predefined time interval by adjusting the offset positions of the members and the distance separating the members.

Abstract: Uniform height solder bumps are created on a semiconductor wafer by exposing a dummy pattern of under bump metal for solder plating. The dummy pattern of exposed under bump metal follows the outer edge outline of a pattern of die that exists on the semiconductor wafer. The dummy pattern of under bump metal is exposed by removing a portion of a layer of photoresist that is deposited over the under bump metal. The dummy pattern of under bump metal is exposed on the wafer at the same time that under bump metal above the contact pads is exposed. Solder material is then plated onto the exposed under bump metal that exists above the contact pads and in the dummy pattern. The dummy pattern of exposed under bump metal around the outer edge of the die pattern causes current crowding to occur primarily at the dummy pattern of exposed under bump metal instead of at the contact pads that are on die at the outer edge of the die pattern.

Abstract: A printed circuit assembly includes a printed circuit board with an electrically conductive via formed therein that extends from the front side of the printed circuit board to the back side of the printed circuit board. A ball grid array package mounted to the front side of the printed circuit board is electrically connected to the electrically conductive via. A probe pad formed on the back side of the printed circuit board is laterally displaced from the electrically conductive via and is electrically connected thereto. A solder mask layer deposited on the back side of the printed circuit board includes a probe pad aperture formed therein that is substantially aligned with the probe pad so that the probe pad is exposed by the probe pad aperture formed in the solder mask layer.

Abstract: A method and apparatus for adding shielding for electronic circuit packs. The invention includes a circuit pack cage, which has a first pair of parallel longitudinal circuit pack slots for receiving the circuit packs and further has a first longitudinal shield slot disposed between first pair of circuit pack slots for receiving a conductive sheet member. At least one conductive resilient member is disposed in the first shield slot in electrical coupling with a conductive chassis. Upon sliding the conductive sheet member between the pair of circuit packs and into the shield slot, the resilient member flexibly engages the conductive sheet member and electrically couples the conductive sheet member with the conductive chassis.

Abstract: An ultrasound imaging system is provided with an adaptive filter for transforming an input signal to produce an output signal having one or more desired signal statistics (e.g., signal-to-noise ratio, Gaussian function specification, etc.). The adaptive filter includes a digital filter configured to receive input signals and produce output signals. The adaptive filter exhibits a transfer function H defined by one or more coefficients C. A controller is configured to generate the filter coefficients based upon one or more signal constraints that are provided to the controller by a user and a sample signal that exhibits one or more sample signal statistics and that is communicated to the digital filter. The controller communicates the filter coefficients to the adaptive filter.

Abstract: Disclosed is a process to manufacture an interposer which includes an interposer socket assembly to use in probing dense pad arrays that minimizes the associated extraneous pin loading and cross-talk caused by a probe tip. The process comprises the steps of: mounting a number of resistors onto a number of predetermined positions in a pad array on an interposer board; inserting a number of interposer pins of a pin socket into the pads of the pad array on the interposer board, wherein the ends of the interposer pins protrude through the interposer board; placing a solder preform around the ends of the interposer pins; and, heating the solder preforms in a solder re-flow oven to solder the interposer pins to the respective pads of the pad array.

Abstract: A handheld measurement device combines a logic probe, a timing analyzer, a voltmeter and a continuity detector. The measurement device provides a visual logic level indicator with an audible logic level indicator. Three channels are provided, each with simultaneous combinational triggering, to facilitate the analysis of signal timing. The device provides simultaneous measurements from a single probe.