Patents Assigned to Amkor Technology Singapore Holding Pte Ltd.
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Publication number: 20240136242Abstract: In one example, an electronic device comprises a base, a substrate over the base and comprising a top side, a bottom side, and a conductive structure, wherein the substrate further comprises a channel opening and an aperture, and wherein the bottom side of the substrate is oriented toward the base, an electronic component over the top side of the substrate and over the aperture, wherein the electronic component is coupled with the conductive structure, and a funnel over the top side of the substrate and comprising a funnel opening. A top side of the electronic component is exposed through the funnel opening. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeon Gyu Lee, Byong Jin Kim, Kyoung Yeon Lee
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Patent number: 11967567Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: GrantFiled: April 24, 2023Date of Patent: April 23, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
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Patent number: 11961742Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.Type: GrantFiled: August 23, 2021Date of Patent: April 16, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11961867Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.Type: GrantFiled: June 10, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
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Patent number: 11961797Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.Type: GrantFiled: September 8, 2021Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Publication number: 20240112975Abstract: In one example, an electronic device includes a substrate including a substrate first side, a conductive structure, and a substrate sidewall on the substrate first side. The substrate sidewall forms a perimeter, the substrate first side within the perimeter defines a substrate base, and the substrate sidewall and the substrate base form a substrate cavity. An electronic component includes a component first side, a component second side, and a component lateral side. The electronic component is disposed over a first portion of the substrate base within the substrate cavity and is coupled to the conductive structure. An encapsulant encapsulates at least a portion of the component lateral side, and a lid is over at least a portion of the component first side. At least a portion of the component first side is devoid of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 3, 2022Publication date: April 4, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kwang Seok PARK, Won Bae BANG, Seo Yoon CHANG
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Publication number: 20240113090Abstract: In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 30, 2022Publication date: April 4, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Myoung KI, In Su MOK, Soo Hyun KIM, Tae Kyeong HWANG, Shaun BOWERS, George SCOTT
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Patent number: 11948808Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: December 6, 2021Date of Patent: April 2, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Patent number: 11948887Abstract: Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.Type: GrantFiled: April 26, 2022Date of Patent: April 2, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Ki Yeul Yang, Kyung Han Ryu, Hyun Cho
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Patent number: 11942581Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.Type: GrantFiled: September 2, 2022Date of Patent: March 26, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: David Clark, Curtis Zwenger
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Publication number: 20240096725Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 18, 2023Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dae Young PARK, Byong Jin KIM, Gi Jeong KIM, Hyeong Il JEON, Kwang Soo SANG, Jin Young KHIM
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Publication number: 20240096858Abstract: In one example, an electronic device comprises a lower substrate comprising a lower dielectric structure and a lower conductive structure, an electronic component coupled with a bottom side of the lower substrate and coupled with the lower conductive structure, an upper substrate over a top side of the lower substrate and comprising an upper dielectric structure and an upper conductive structure, an internal interconnect between the upper substrate and the lower substrate and coupled with the upper conductive structure and the lower conductive structure, and a first antenna component between the upper substrate and the lower substrate and coupled with the upper conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Jae Beom Shim, Byong Jin Kim
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Publication number: 20240096766Abstract: In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 17, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Byong Jin KIM, Gi Jeong KIM
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Patent number: 11935856Abstract: A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.Type: GrantFiled: June 21, 2021Date of Patent: March 19, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jong Sik Paek, Doo Hyun Park
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Publication number: 20240088114Abstract: An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.Type: ApplicationFiled: November 27, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyun Goo Cha, Dong Hee Kang, Sang Yun Ma, Sang Hyeok Cho, Jae Yeong Bae, Ron Huemoeller
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Publication number: 20240088059Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
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Publication number: 20240079282Abstract: In one example, an electronic device includes a substrate, which includes a substrate first side, a substrate second side opposite to the substrate side, a conductive structure, and a substrate opening extending through substrate from the substrate first side to the substrate second side. A pipe is coupled to the substrate first side and includes a pipe wall including an exterior surface and an interior surface defining a pipe passage aligned with the substrate opening, and a pipe top distal to the substrate first side. A electronic component is coupled to the conductive structure adjacent to the substrate first side. An encapsulant is over the substrate first side, the exterior surface of the pipe wall and over at least a portion of the electronic component. The pipe passage and the substrate opening are devoid of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 7, 2022Publication date: March 7, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Yasuyuki TAKEHARA, Hidenari SATO
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Patent number: 11923280Abstract: A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.Type: GrantFiled: September 2, 2021Date of Patent: March 5, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Won Bae Bang, Kwang Seok Oh