Abstract: In one example embodiment, a programmable filter is provided, including a plurality of variable-inductance networks and a plurality of variable-capacitance networks. The programmable filter may be implemented in a classical filter topology, with variable-capacitance networks replacing discrete capacitors and variable-inductance networks replacing discrete inductors. An example variable-inductance network comprises a primary inductor with an intermediate tap, and secondary inductor connected at the intermediate tap, with switches for selecting an inductance.

Abstract: Various embodiments of the present invention methods for discovery, configuration, and coordinating data communications between master and slave devices in a communication system. Exemplary embodiments are described with reference to a two-wire point-to-point bus system, although the method can be used in other communication systems. Provisions are included for controlling the sequential powering of the bus and slave devices.

Abstract: A microelectronic device tester has a mounting member (for mounting a device), a drive shaft connected to the mounting member, and a vibration shaft mechanically in communication with the drive shaft. The drive shaft and vibration shaft are non-coaxial, and the drive shaft has a drive shaft proximal end and a drive shaft distal end. The drive shaft proximal end is connected to the mounting member, and the drive shaft distal end terminates proximal of the entire vibration shaft.

Abstract: An exemplary method and system of addressing an integrated circuit within a daisy chain network. In the exemplary method, the address of the integrated circuit may be initialized to a predetermined initial address. The integrated circuit may receive a command that includes a type identifier and an address field. Based on the type identifier, the type of command may be determined. As a result of the determination, reading the address from the address field. The read address may be stored in a register. The address may be modified, and may be output. Upon receipt of the data or a command, the integrity of the data including data within the received command, may be confirmed by an error checking algorithm.

Abstract: A signal processing device has a first discrete time analog signal processing section, which has an input, an output, a plurality of charge storage elements, and plurality of switch elements coupling the charge storage elements. The device has a controller coupled to the first signal processing section configured to couple different subsets of the charge elements of the first signal processing section in successive operating phases to apply a signal processing function to an analog signal presented at the input of the first signal processing section and provide a result of the applying of the signal processing function as an analog signal to the output of first signal processing section. The signal processing function of the first signal processing section comprises a combination of a filtering function operating at a first sampling rate and one or more modulation functions operating at corresponding modulation rates lower than the first sampling rate.

Abstract: The invention is directed to a multi-bit digital signal isolation system including a plurality of micro-transformers, each having a primary winding and a secondary winding, a transmitter circuit receiving a multi-bit signal and transmitting an encoded logic signal across the plurality of micro-transformers corresponding to the multi-bit signal, the primary winding of each micro-transformer receiving a signal corresponding to one of at least three possible states, and a receiver circuit receiving the encoded logic signal from the secondary windings of the plurality of transformers, decoding the encoded logic signal and reconstructing the received multi-bit signal based upon the decoded signal.

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

Abstract: Apparatus and methods for multi-channel autozero and chopper amplifiers are provided herein. In certain configurations, an amplifier includes at least three channels that operate using multiple phases, including at least a non-inverting chop phase, an inverting chop phase, and an autozero phase. The amplifier further includes an autozero and chopping timing control circuit, which at least partially interleaves or staggers timing of the channels' phases. For example, in certain configurations, when one or more of the channels are being autozeroed at a certain time instance, at least some of the remaining channels operate in the non-inverting chop phase or the inverting chop phase.

Abstract: The present disclosure describes a mechanism to digitally correct for the static mismatch of the digital-to-analog converter (DAC) in at least the first-stage of a multi-stage noise shaping (MASH) analog-to-digital converter (ADC). The correction is applicable to continuous-time implementations, and is especially attractive for high-speed applications.

Abstract: A method of etching a plurality of cavities in a wafer provides a wafer having a patterned hard mask layer. The patterned hard mask has open areas defining locations for first cavities and second cavities. A mask is applied to cover the patterned hard mask layer. The mask is etched to remove wafer material from areas defined by the second cavities. The mask is removed and etching then removes wafer material except as prevented by the hard mask layer. This leaves the first cavities with a first depth and further deepens the second cavities to a depth greater than the first depth. By suitably configuring the second cavities, a capped die can be formed by securing the wafer to a second wafer and removing at least a portion of the unsecured side of the first wafer to expose the second cavities, thereby forming a plurality of caps on the second wafer.

Abstract: In an example, there is disclosed herein a digital-to-analog converter (DAC) including a correction circuit for a clock, including a differential clock. Error correction may take place within the DAC core, by means of replica cells that are substantially similar to conversion cells. Rather than contributing their output to the converted signal, the replica cells may be configured to provide a feedback signal to a clock receiver with information for correcting the clock signal. The feedback signal may be operable to correct errors, for example, in duty cycle and crosspoint, as measured at the DAC core.

Abstract: A circuit to detect states of a signal is provided. The circuit comprises an input node to receive an input signal. A state detection circuit detects a state of the input signal and generates a detection signal. The state corresponds to at least one of three states. Furthermore, the detection signal generated by the state detection circuit has a level based on the detected state of the input signal. A logic discriminator circuit generates first and second state signals based at least partly on the level of the detection signal. A clock detection circuit generates a clock signal based at least partly on a sequence of logic transitions of the first and second state signals.

Abstract: A system and method for classifying touches input into a four-wire resistive touch screen is presented. A voltage may be applied to electrodes in a layer making it the active layer. A first set of four voltages may be measured by a voltage sensing circuit from electrodes in the active layer of a touch screen and a passive layer of a touch screen. The voltage may be switched from electrodes of the first layer to the electrodes of the second layer. A voltage sensing circuit may measure a second set of four voltages nearly simultaneously from electrodes in the active layer and the passive layer of a touch screen. Each set of measured voltages from the passive layer and or the active may be processed. A rule set may be applied to the processing results. An indication of the type of touch that was applied to the touch screen may be provided and optionally including quantitative results.

Abstract: Certain example embodiments of the present disclosure can provide a parallelized atomic increment. A vgather instruction returns to a plurality of processing elements the value of a memory location. A vgather_hit instruction returns to a function of the number of “hits” to the memory location. In one embodiment, the function is unity. In another embodiment, the function is the number of hits having an ordinal designation less than or equal to the processing element receiving the return value.

Abstract: A connection apparatus for controlling the supply of electrical power to a load, the connection apparatus comprising first and second electrically controllable devices connected in parallel to each other and in series with the load; wherein the first and second electrically controllable devices are dissimilar, and where a safe operating area product of voltage, current and safe operating area time for the first device is greater than the product of voltage, current and the same safe operating area time for the second device, and an on state resistance for the second device is less than an on state resistance for the first device, and where a controller is provided to use the first device for a first period of time to power up the load, and thereafter the second device is used to maintain power to the load.

Abstract: A stage of a pipelined analog-to-digital converter can include first and second pluralities of digital-to-analog converters (DACs), the first plurality sufficient in number to produce a residue from the stage, the second plurality having their outputs added into an analog output of the stage. A mapping circuit can exchange inputs between selected ones of the first and second pluralities of DACs, and a calibration circuit can provide first and second calibration signals to the selected one of the first plurality and another of the second plurality of DACs. The calibration signals can correlate to each other, but be uncorrelated to an analog input and digital output of the stage, and have unequal and partially offsetting effects on the stage's residue. A correction circuit can correct the digital output of the stage for circuit path errors based on a correlation between the calibration signals and an output of a succeeding stage.

Abstract: A security-aware master is provided, such that a master can determine its security state before attempting access to secure resources or before requesting secure access level. An exemplary system include a system interconnect; one or more masters coupled with the system interconnect; and a master security check register coupled with the system interconnect. The master security check register is configured to receive a request from a master via the system interconnect to access the master security check register, wherein the request includes a master operating state signal that indicates a security state of the master requesting access, and return a data value to the master based on the master operating state signal, wherein the data value indicates a current security state of the master requesting access.

Abstract: Apparatus and methods calibrate one or more gain ranges for errors. A system can identify offset error and amplification error that occurs when the system transitions from amplifying an input signal by a first gain factor to amplifying the input signal by a second gain factor. To identify the amplification error, the system can compare the slope of the data signal in a source or reference gain range with the slope of the data signal in the destination gain range. To identify the offset error, the system can compare the amplitude of the data signal in a destination gain range with an expected value in the destination gain range.

Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Abstract: A framer interfacing between one or more data converters and a logic device is disclosed. The framer comprises a transport layer and a data link layer, and the framer is configured to frame one or more samples from the data converters to frames according to a serialized interface. In particular, the synthesis of the hardware for the framer is parameterizable, and within the synthesized hardware, one or more software configurations are possible. Instance parameters used in synthesizing the framer may include at least one of: the size of the input bus for providing one or more samples to the transport layer, the total number of bits per converter, and the number of lanes for the link. Furthermore, a transport layer test sequence generator for inserting a test sequence in the transport layer is disclosed.