Abstract: A method, a non-transitory computer readable medium and a three-dimensional evaluation system for providing three dimensional information regarding structural elements of a specimen. The method can include illuminating the structural elements with electron beams of different incidence angles, where the electron beams pass through the structural elements and the structural elements are of nanometric dimensions; detecting forward scattered electrons that are scattered from the structural elements to provide detected forward scattered electrons; and generating the three dimensional information regarding structural elements based at least on the detected forward scattered electrons.

Abstract: Implementations of the disclosure provide methods for generating an in-die reference for die-to-die defect detection techniques. The inspection methods using in-die reference comprise finding similar blocks of a lithographic mask, the similar blocks are defined by similar CAD information. A comparison distance is selected based on (i) areas of the similar blocks and (ii) spatial relationships between the similar blocks. The similar blocks are aggregated, based on the comparison distance, to provide multiple aggregated areas; and comparable regions of the lithographic mask are defined based on the multiple aggregate blocks. Images of at least some of the comparable regions of the lithographic mask are acquired using an inspection module. The acquired images are compared.

Abstract: There may be provided detection circuit that may include (i) a photodiode that may be configured to convert radiation to a photodiode electrical signal; (ii) a photodiode bias circuit that may be configured to bias the photodiode, wherein the photodiode bias circuit may include a photodiode bias voltage supply and a photodiode bias capacitor; and (iii) a differential transimpedance amplifier that may be configured to amplify the photodiode electrical signal to provide a differential voltage. The differential transimpedance amplifier may include an amplification circuit and an additional circuit, wherein the amplification circuit may include a positive input port, a negative input port, a positive output port, a negative output port and a common mode input port. The photodiode bias voltage supply may be a floating voltage supply.

Abstract: A method, a non-transitory computer readable medium and a system for reducing a temperature difference between a sample and a chuck of an electron beam tool. The method may include determining a target temperature of samples located at the load port of the electron beam tool; setting a temperature of the samples, located at the load port, to the target temperature; moving the sample from the load port to the chuck, the chuck is located within a vacuum chamber, the sample belongs to the samples; and positioning the sample on the chuck, wherein when positioned on the chuck, a temperature of the sample substantially equals a temperature of the chuck.

Abstract: An objective lens arrangement that may include a magnetic lens and an electrostatic lens. The magnetic lens may include one or more coils, an upper polepiece and a lower polepiece. The electrostatic lens may include an upper electrode, an internal lower electrode and an external lower electrode. A majority of the internal lower electrode may be surrounded by a majority of the external lower electrode. The upper electrode, the internal lower electrode, and the external lower electrode are arranged in a coaxial relationship along an optical axis of the objective lens arrangement. An area of a bottom aperture of the external lower electrode may not exceed an area of a bottom aperture of the internal lower electrode.

Abstract: Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method.

Abstract: There is provided a system and method of generating a training set for training a Deep Neural Network usable for examination of a specimen. The method includes: for each given training image in a group: i) generating a first batch of training patches, including cropping the given training image into a first plurality of original patches; and augmenting at least part of the first plurality of original patches in order to simulate variations caused by a physical process of the specimen; and ii) generating a second batch of training patches, including: shifting the plurality of first positions on the given training image to obtain a second plurality of original patches, and repeating the augmenting to the second plurality of original patches to generate a second plurality of augmented patches; and including at least the first second batches of training patches corresponding to each given training image in the training set.

Abstract: A method and a detection circuit. The detection circuit may include (a) a photodiode that is configured to convert radiation to a photodiode current; (b) a photodiode bias circuit that is configured to bias the photodiode; (c) a dynamic resistance circuit that has a first terminal and a second terminal; (d) a transimpedance amplifier that is configured to amplify an output current of the dynamic resistance circuit to provide an output voltage, wherein the second terminal is coupled to a negative input port of the amplification circuit; and (e) a conductor that is coupled between the first terminal and an anode of the photodiode.

Abstract: A method of evaluating a region of a sample that includes two or more sub-regions adjacent to each other that have different milling rates. The method can include: scanning a focused ion beam over the region during a single scan frame such that the ion beam is scanned over a first sub-region of the region having a first milling rate at a first scan rate and then scanned over a second sub-region of the region having a second milling rate at a second scan rate, where the second milling rate is faster than the first milling rate and second scan rate is faster than the first scan rate; and repeating the scanning process a plurality of times to etch the region to a desired depth.

Abstract: There are provided system and method of examining a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising ground truth data specific for the given application; and obtaining examination-related data specific for the given application and characterizing at least one of the processed one or more FP images. The examination-related application can be, for example, classifying at least one defect presented by at least one FP image, segmenting the at least one FP image, detecting defects in the specimen presented by the at least one FP image, registering between at least two FP images, regression application enabling reconstructing the at least one FP image in correspondence with different examination modality, etc.

Abstract: There is provided a system and method of generating a training set usable for examination of a semiconductor specimen. The method comprises: obtaining a simulation model capable of simulating effect of a physical process on fabrication process (FP) images depending on the values of parameters of the physical process; applying the simulation model to an image to be augmented for the training set and thereby generating one or more augmented images corresponding to one or more different values of the parameters of the physical process; and including the generated one or more augmented images into the training set. The training set can be usable for examination of the specimen using a trained Deep Neural Network, automated defect review, automated defect classification, automated navigation during the examination, automated segmentation of FP images, automated metrology based on FP images and other examination processes that include machine learning.

Abstract: A method of evaluating a region of a sample that includes a first sub-region and a second sub-region, adjacent to the first sub-region, the region comprising a plurality of sets of vertically-stacked double-layers extending through both the first and second sub-regions with a geometry or orientation of the vertically-stacked double layers in the first sub-region being different than a geometry or orientation of the vertically-stacked double layers in the second region resulting in the first sub-region having a first milling rate and the second sub-region having a second milling rate different than the first milling rate, the method including: milling the region of a sample by scanning a focused ion beam over the region a plurality of iterations in which, for each iteration, the focused ion beam is scanned over the first sub-region and the second sub-region generating secondary electrons and secondary ions from each of the first and second sub-regions; detecting, during the milling, at least one of the generat

Abstract: Disclosed herein is a computerized system including scanning equipment configured to obtain multi-perspective scan data of a slice on a sample. The scanning equipment includes: (i) a light source configured to generate a light beam; (ii) an acousto-optic deflector (AOD) configured to focus the light beam such as to generate a beam train scanned along consecutive lines on the slice, in groups of n?2 successively scanned lines, along each of which the beam train forms at least one illumination spot, respectively; and (iii) one or more detectors configured to sense light returned from the slice. The n?2 lines are scanned different perspectives, respectively. The consecutive lines may be longitudinally displaced relative to one another, such as to overlap in 100·(n?1)/n % of widths thereof, so that the slice may be fully scanned in each of the perspectives.

Abstract: A method for detecting a rare stochastic defect, the method may include searching for a rare stochastic defect in a dense pattern of a substrate, wherein the rare stochastic defect is (a) of nanometric scale, (b) appears in a functional pattern of the substrate with a defect density that is below 10?9, and (c) appears in the dense pattern with a defect density that is above 10?7; wherein the dense pattern is a dense representation of the functional pattern that differs from the functional pattern by at least one out of (a) a distance between features of the dense pattern, and (b) a width of the features of the dense pattern; and estimating the occurrence of the rare stochastic defect within the functional pattern based on an outcome of the searching.

Abstract: A charged particle beam source that may include an emitter that has a tip for emitting charged particles; a socket; electrodes; a filament that is connected to the electrodes and to the emitter; electrodes for providing electrical signals to the filament; a support element that is connected to the emitter; and a support structure that comprises one or more interfaces for contacting only a part of the support element while supporting the support element.

Abstract: A method, a non-transitory computer readable medium and a three-dimensional evaluation system for providing three dimensional information regarding structural elements of a specimen. The method can include illuminating the structural elements with electron beams of different incidence angles, where the electron beams pass through the structural elements and the structural elements are of nanometric dimensions; detecting forward scattered electrons that are scattered from the structural elements to provide detected forward scattered electrons; and generating the three dimensional information regarding structural elements based at least on the detected forward scattered electrons.

Abstract: A detection circuit that may include (i) a photosensor that is configured to convert light to current; wherein the photosensor has an output node and is configured to operate as a current source, (ii) an adder, and (iii) multiple amplification branches that are coupled in parallel between the adder and the output node of the photosensor. The multiple amplification branches do not share a feedback circuit, wherein all amplification branches of the multiple amplification branches comprise an amplifier of a same type, wherein the type is selected out of a transimpedance amplifier and a current amplifier.

Abstract: A method and a system. The system may include (a) evaluation units, (b) an object distribution system for receiving the objects and distributing the objects between the evaluation units, and (c) at least one controller. Each evaluation unit may include (i) a chamber housing that has an inner space, (ii) a chuck, (iii) a movement system that is configured to move the chuck, and (iv) a charged particle module that is configured to irradiate the object with a charged particle beam, and to detect particles emitted from the object. In each evaluation unit a length of the inner space is smaller than twice a length of the object, and a width of the inner space is smaller than twice a width of the object.

Abstract: A system for optical imaging of defects on unpatterned wafers that includes an illumination module, relay optics, a segmented polarizer, and a detector. The illumination module is configured to produce a polarized light beam incident on a selectable area of an unpatterned wafer. The relay optics is configured to collect and guide, radiation scattered off the area, onto the polarizer. The detector is configured to sense scattered radiation passed through the polarizer. The polarizer includes at least four polarizer segments, such that (i) boundary lines, separating the polarizer segments, are curved outwards relative to a plane, perpendicular to the segmented polarizer, unless the boundary line is on the perpendicular plane, and (ii) when the area comprises a typical defect, a signal-to-noise ratio of scattered radiation, passed through the polarizer segments, is increased as compared to when utilizing a linear polarizer.

Abstract: A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.