Abstract: A method and a system. The system may include (a) evaluation units, (b) an object distribution system for receiving the objects and distributing the objects between the evaluation units, and (c) at least one controller. Each evaluation unit may include (i) a chamber housing that has an inner space, (ii) a chuck, (iii) a movement system that is configured to move the chuck, and (iv) a charged particle module that is configured to irradiate the object with a charged particle beam, and to detect particles emitted from the object. In each evaluation unit a length of the inner space is smaller than twice a length of the object, and a width of the inner space is smaller than twice a width of the object.

Abstract: A system for optical imaging of defects on unpatterned wafers that includes an illumination module, relay optics, a segmented polarizer, and a detector. The illumination module is configured to produce a polarized light beam incident on a selectable area of an unpatterned wafer. The relay optics is configured to collect and guide, radiation scattered off the area, onto the polarizer. The detector is configured to sense scattered radiation passed through the polarizer. The polarizer includes at least four polarizer segments, such that (i) boundary lines, separating the polarizer segments, are curved outwards relative to a plane, perpendicular to the segmented polarizer, unless the boundary line is on the perpendicular plane, and (ii) when the area comprises a typical defect, a signal-to-noise ratio of scattered radiation, passed through the polarizer segments, is increased as compared to when utilizing a linear polarizer.

Abstract: A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.

Abstract: Disclosed herein is a method for increasing signal-to-noise (SNR) in optical imaging of defects on unpatterned wafers. The method includes: (i) irradiating a region of an unpatterned wafer with a substantially polarized, incident light beam, and (ii) employing relay optics to collect and guide, radiation scattered off the region, onto a segmented polarizer comprising at least four polarizer segments characterized by respective dimensions and polarization directions. The respective dimensions and polarization direction of each of the at least four polarizer segments are such that an overall power of background noise radiation, generated in the scattering of the incident light beam from the region and passed through all of the at least four polarizer segments, is decreased as compared to utilizing a linear polarizer.

Abstract: There is provided a system comprising a processor configured to obtain a set of images of a semiconductor specimen, (1) for an image of the set of images, select at least one algorithmic module MS out of a plurality of algorithmic modules, (2) feed the image to MS to obtain data DMS representative of one or more defects in the image, (3) obtain a supervised feedback regarding rightness of data DMS, (4) repeat (1) to (3) for a next image until a completion criterion is met, wherein an algorithmic module selected at (1) is different for at least two different images of the set of images, generate, based on the supervised feedback, a score for each of a plurality of the algorithmic modules, and use scores to identify one or more algorithmic modules Mbest as the most adapted for providing data representative of one or more defects in the set of images.

Abstract: A system, method and computer readable medium for classifying defects, the method comprising: receiving classified first defects, and potential defects, each first and potential defect having values for attributes; processing the first and potential defects to select a subset of the attributes that differentiates the first defects from the potential defects; obtaining first and second functions based on the first defects and potential defects, respectively; obtaining a first threshold for the first function, and a second threshold for a combination of the first and second functions; applying the first function and the second function to each potential defect to obtain first and second scores, respectively; and determining a combined score of the first and second scores; and indicating as a defect of a potentially new type a potential defect when the first score is lower than the first threshold or the combined score exceeds the second threshold.

Abstract: A system, method and computer software product, the system capable of classifying defects and comprising: an hardware-based GUI component; and a processing and memory circuitry configured to: a. upon obtaining data informative of a plurality of defects and attribute values thereof, using the attribute values to create initial classification of the plurality of defects into a plurality of classes; b. for a given class, presenting to a user, by the hardware-based GUI component, an image of a defect initially classified to the given class with a low likelihood, wherein the image is presented along with images of one or more defects initially classified to the given class with the highest likelihood; and c. subject to confirming by the user, using the hardware-based GUI component, that the at least one defect is to be classified to the given class, indicating the at least one defect as belonging to the given class.

Abstract: A method, a non-transitory computer readable medium and a system for determining three dimensional (3D) information of structural elements of a substrate.

Abstract: A method and system for detecting defects in a specimen, the method comprising: obtaining an image comprising a plurality of pixels of a specimen part; processing the image according to a detection recipe to derive information related to potential defects in the specimen, the information comprising a first data set informative of first locations identified, in accordance with the detection recipe as locations of potential defects, and a second data set informative of second locations not identified as locations of potential defects; receiving data specifying targeted locations of interest within the part of the specimen; when the first data set is not informative of each targeted location, generating a third data set by adding to the first data set information related to the missing targeted location from the second data set, the information bearing an indication that it corresponds to a targeted location; and outputting the third data set.

Abstract: Systems and methods for optical inspection of a sample are provided. Radiation scattered from the sample includes a first portion having a first polarization state and a second portion having a second polarization state that is a mirror image of the first polarization state. The first polarization state of the first portion of the scattered radiation is transposed using a polarizing mirroring device so that the scattered radiation output from the polarizing mirroring device has substantially the second polarization state.

Abstract: A method, and a high voltage (HV) system that may include a noise reduction unit (MNRU) and a bias setting unit (BSU). The HV system may receive a HV supply signal, over a high voltage supply line from a HV supply unit. The HV supply unit, the MNRU, the BSU and a HV charged particle system may share a ground. At least the MNRU may detect noise in the HV supply signal and send, though the ground, a noise compensation signal. The BSU may receive an indication about a requested value of a bias voltage, and apply the bias voltage to a noise compensated HV signal to provide a biased and noise compensated HV signal to the HV charged particle system.

Abstract: A method, non-transitory computer readable medium and a computerized system for testing a code using real time analysis. The method can include (i) executing a group of test cases while performing real time analysis to find a set of overlapping code segments (OCSs), input values that are fed, during the executing of the group, to each one of the set of OCSs, and output values that are outputted from each one of the OCSs during the execution of the group, (ii) generating, for at least some of the OCSs, at least one OCS test for testing each of the at least some OCSs, wherein the generating is based, at least in part, on the input values and the output values, (iii) determining an evaluation process of the code that includes executing one or more OCS tests for testing one or more OCSs, (iv) evaluating the code by executing the evaluation process.

Abstract: Samples at a semiconductor wafer that have been reviewed by a review tool may be identified. Furthermore, a candidate sample at the semiconductor wafer that has not been reviewed by the review tool may be identified. A location of the candidate sample at the semiconductor wafer may and a number of the samples that have been reviewed that are at locations proximate to the location of the candidate sample may be determined. The candidate sample may be selected for review by the review tool based on the number of the plurality of samples that are at locations proximate to the location of the candidate sample.

Abstract: A device and method for detecting radiation comprising: a radiation-sensitive surface composed of an array of electrically inter-isolated radiation-sensitive elements (e.g. avalanche photodiode (APD), PIN diode, or scintillation sensor), each radiation-sensitive element is adapted to generate an electric current in response to absorbing radiation; an array of conversion circuits, each conversion circuit electrically coupled to a respective radiation-sensitive element and configured to generate an output signal indicative of the current generated by the radiation-sensitive element coupled thereto; and one or more summation arrangements, each summation arrangement coupled to a respective group of the conversion circuits, and configured to produce a summation result indicative of the radiation absorbed by respective group of the conversion circuits. The radiation-sensitive surface may be shaped as a dome-shape surface.

Abstract: A method for overlay monitoring including: obtaining a secondary electron image and a backscattered electron image of as area of the substrate in which an array of first structural elements are positioned at a surface of the substrate and a second array of second structural elements are positioned below the first array; determining locations of the first structural elements within the secondary electron image; defining regions of interest in the backscattered electron image, based on the locations of the first structural elements; processing pixels of the backscattered electron image that are located within the regions of interest to provide a backscattered electron representation of a second structural element; and calculating an overlay error based on location information regarding the second structural element within the backscattered electron representation of the second structural element and on location information regarding of at least one first structural element in the secondary electron image.

Abstract: An evaluation system that may include an imager; and a processing circuit. The imager may be configured to obtain an electron image of a hole that is formed by an etch process, the hole exposes at least one layer of a one or more sets of layers, each set of layers comprises layers that differ from each other by their electron yield and belong to an intermediate product. The processing circuit may be configured to evaluate, based on the electron image, whether the hole ended at a target layer of the intermediate product. The intermediate product is manufactured by one or more manufacturing stages of a manufacturing process of a three dimensional NAND memory unit. The hole may exhibit a high aspect ratio, and has a width of a nanometric scale.

Abstract: A method that includes performing multiple test iterations to provide multiple test results; and processing the multiple test results to provide estimates of a conductivity of each of the multiple bottoms segments. The multiple test iterations includes repeating, for each bottom segment of the multiple bottom segments, the steps of: (a) illuminating the bottom segment by a charging electron beam; wherein electrons emitted from the bottom segment due to the illuminating are prevented from exiting the hole; (b) irradiating, by a probing electron beam, an area of an upper surface of the dielectric medium; (c) collecting electrons emitted from the area of the upper surface as a result of the irradiation of the area by the probing electron beam to provide collected electrons; and (d) determining an energy of at least one of the collected electrons to provide a test result.

Abstract: A cleanliness monitor, an evaluation system and a method. The cleanliness monitor may include: a first vacuum chamber, a second vacuum chamber, a molecule collector, a release unit, a mass spectrometer, a manipulator that may be configured to move the molecule collector from the first position to the second position, and an analyzer. The mass spectrometer may have a line of sight to an inner space of the second vacuum chamber. The mass spectrometer may be configured to monitor the inner space of the second vacuum chamber and to generate detection signals that are indicative of a content of the inner space of the second vacuum chamber. A first subset of the detection signals may be indicative of a presence of the at least subset of released organic molecules. The analyzer may be configured to determine, based on the detection signals, the cleanliness of at least one out of (a) the first vacuum chamber, and (b) a tested vacuum chamber. The tested vacuum chamber is fluidly coupled to the first vacuum chamber.

Abstract: An evaluation system that may include an imager; and a processing circuit. The imager may be configured to obtain an electron image of a hole that is formed by an etch process, the hole exposes at least one layer of a one or more sets of layers, each set of layers comprises layers that differ from each other by their electron yield and belong to an intermediate product. The processing circuit may be configured to evaluate, based on the electron image, whether the hole ended at a target layer of the intermediate product. The intermediate product is manufactured by one or more manufacturing stages of a manufacturing process of a three dimensional NAND memory unit. The hole may exhibit a high aspect ratio, and has a width of a nanometric scale.

Abstract: A supply unit for driving an electrode of a charged particle beam column, the supply unit includes a first amplifier and a second amplifier that are configured to receive an input signal, an output of the first amplifier is coupled, via the first resistor, to a signal line of the coaxial cable, an output of the second amplifier is coupled, via the second resistor, to a main shield of the coaxial cable, one port of the first amplifier and one port of the second amplifier are coupled to a power supply return port. The signal line is configured to provide a first driving signal to an that is coupled between the signal line and the power supply return port.