Abstract: A synthetic process comprising the following steps: providing a reaction mixture comprising: an ethylenically unsaturated anhydride monomer, at least one ethylenically unsaturated non-anhydride monomer, a free radical initiator, and an alkyl substituted THF solvent having the general structure of formula 1: 1

Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: 1

Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, C1-4 alkyl or C1-4 alkoxy; R3 is a hydroxyl functionalized C1-C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [—R4O—]p; R5 is a C1-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-C14 aryl, or substituted or unsubstituted C7-C15 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

Abstract: A highly reliable and safe, modular automatic refill (bulk delivery) system for ultra-high purity pyrophoric metalorganic chemicals employing: a manifold that insures contamination-free operation; a liquid-level detection system with fail-safe redundancy; and an evacuation system which leaves the system's manifold and transfer lines relatively free of chemical fire hazards; leaves them free of oxygen contamination; and leaves the composition of the system's carrier gas unaffected, between refills.

Abstract: A composition for selective etching of oxides over a metal. The composition contains water, hydroxylammonium salt, carboxylic acid, a fluorine containing compound, and optionally, a base. The pH of the composition is about 2 to 6.

Abstract: The invention relates to a novel CMP slurry composition used for polishing metals, the composition comprising: (a) a dispersion solution comprising an abrasive; and (b) an oxidizer. The slurry composition has a large particle count of less than about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.

Abstract: Polymers comprising monomeric units of acid sensitive (acid labile) monomers and from about 2 to about 20% by weight of monomeric units of &bgr;-oxo ester containing monomers, wherein the &bgr;-oxo ester containing monomers are free of lactams or lactones, are useful as binder resins in radiation sensitive photoresist compositions for producing a resist image on a substrate.

Abstract: The invention relates to a novel CMP slurry composition used for polishing metals, the composition comprising: (a) a dispersion solution comprising an abrasive; and (b) an oxidizer. The slurry composition has a large particle count of less than about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.

Abstract: An improved binder resist for use in radiation sensitve photoresist compositions comprises a polymer having monomeric units of (a) carboxylic anhydride units, (b) alkenyl silane units and (c) units containing an acid labile group, and wherein the polymer contains from about 1 to about 3 mol % of free acid wherein the free acid is provided either by the presence in the polymer of a futher monomeric unit having free acids groups or by hydrolysis of sufficient of the carboxylic anhydride monomeric unit.

Abstract: A highly reliable and safe, modular automatic refill (bulk delivery) system for ultra-high purity pyrophoric metalorganic chemicals employing: a manifold that insures contamination-free operation; a liquid-level detection system with fail-safe redundancy; and an evacuation system which leaves the system's manifold and transfer lines relatively free of chemical fire hazards; leaves them free of oxygen contamination; and leaves the composition of the system's carrier gas unaffected, between refills.

Abstract: The present invention is a radiation sensitive composition that includes a polymer resin, a photoacid generator, a solvent, and a heterocyclic additive selected from: 1-phenyl-2-pyrrolidinone and compound of the formulas (I), (II), (III), and (IV): where R1 is —H, —NH2—, —OH, —N(CH3)2, —NH—CO—CH3, or where R2 is —CH3 or benzoyl; where R3 is —H, or C1-C4 alkyl; W, X, Y, and Z are each independently selected from —CH2—,  —CH(CH3)—, —C(CH3)2—, —NH—, or —N(CH3)—, with the proviso that at least one of W, X, Y, or Z is  and at least one of W, X, Y, or Z is —NH— or —N(CH3)—; where A is —CH═ or R4 is —H, —CH3, or —CH2—CH(CH3)2; R5 is —H, —CH3, or —CH2—CH(OH)—CH2(OH); R6 is &

Abstract: A photosensitive resist composition comprising:

Abstract: Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.

Abstract: A photoacid compound having the following general structure:

Abstract: The present invention provides a method of detecting trace anions in solutions at a parts per billion (ppb) concentration level or less using existing anion detection technology, by employing a novel sample preparation method conducted prior to injection into a detection unit. The method includes the steps of: adding a precipitant to at least a portion of the solution; evaporating the solution, whereby a trace anion-rich solution is formed; and detecting the level of the trace anions in the trace anion-rich solution to at least a ppb concentration level. As such, any existing detection unit designed for measuring anions, known to those skilled in the art, can be used without modification. This results in a cost and time effective method of detecting trace anions in solution at a ppb concentration level. The invention also provides a system for effectuating the novel method of the present invention.

Abstract: The present invention is directed to a thermally curable polymer composition comprising a hydroxyl-containing polymer and a polyfunctional epoxide as a crosslinking agent. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. In addition, the present invention also relates to a photolithographic coated substrate comprising: a substrate, the thermally cured undercoat composition on the substrate, and a radiation-sensitive resist topcoat on the thermally cured undercoat composition. Furthermore, the present invention further relates to a process for using the photolithographic coated substrate for the production of relief structures.

Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: 1

Abstract: Wet etch processes utilize compatible deep UV photoresist compositions having binder resins that are either:

Abstract: In accordance with the invention, there is provided a chemical-mechanical polishing slurry for polishing a substrate. The slurry is comprised primarily of abrasive particles and an oxidizing agent, wherein the slurry exhibits a stability having a shelf life of at least 30 days.

Abstract: This invention relates to a CMP slurry system for use in semiconductor manufacturing. The slurry system comprises two parts. The first part is a generic dispersion that only contains an abrasive and, optionally, a surfactant and a stabilizing agent. The generic dispersion can be used for polishing metals as well as interlayer dielectrics (ILD). The second part is a novel activator solution comprising at least two components selected from the group consisting of: an oxidizer, acids, amines, chelating agents, fluorine-containing compounds, corrosion inhibitors, buffering agents, surfactants, biological agents and mixtures thereof.