Abstract: A highly reliable and safe, modular automatic refill (bulk delivery) system for ultra-high purity pyrophoric metalorganic chemicals employing: a manifold that insures contamination-free operation; a liquid-level detection system with fail-safe redundancy; and an evacuation system which leaves the system's manifold and transfer lines relatively free of chemical fire hazards; leaves them free of oxygen contamination; and leaves the composition of the system's carrier gas unaffected, between refills.

Abstract: A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary ammonium hydroxides; (d) at least one organic carboxylic acid; and (e) optionally, a polyhydric compound. The pH of the composition is preferably between about 2 to about 6.

Abstract: The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Abstract: A non-corrosive photoresist stripping and cleaning composition, comprising: (a) about 5% to about 50% of a solvent; (b) about 10% to about 90% of an alkanolamine; (c) about 0.1 to 10% of a carboxylic acid; and (d) about 1.0% to 40% of water.

Abstract: A composition for selective etching of oxides over a metal. The composition contains water, hydroxylammonium salt, carboxylic acid, a fluorine containing compound, and optionally, a base. The pH of the composition is about 2 to 6.

Abstract: Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.

Abstract: A highly reliable and safe, modular automatic refill (bulk delivery) system for ultra-high purity pyrophoric metalorganic chemicals employing: a manifold that insures contamination-free operation; a liquid-level detection system with fail-safe redundancy; and an evacuation system which leaves the system's manifold and transfer lines relatively free of chemical fire hazards; leaves them free of oxygen contamination; and leaves the composition of the system's carrier gas unaffected, between refills.

Abstract: The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Abstract: The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Abstract: A resist composition containing a polymer of t-butyl cinnamate, a photacid generator, and a solvent. Optionally, the resist composition may include a basic compound. The polymer of t-butyl cinnamate has the monomeric units: wherein a=0.3 to 0.9, b=0.1 to 0.7, and c=0 to 0.3; R1=H, methyl, or CH2OR4; R4=H or C1-C4 alkyl group; R2=H, methyl, CH2OR4, CH2CN, or CH2X; X=Cl, I, Br, F, or CH2COOR5; R5=C1-C4 alkyl group; and R3=isobomyl, cyclohexyl methyl, cyclohexyl ethyl, benzyl, or phenethyl.

Abstract: The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Abstract: A non-corrosive photoresist stripping and cleaning composition, comprising:

Abstract: A process for device fabrication and resist materials that are used in the process are disclosed. The resist material contains acid labile groups either pendant to the polymer or to a dissolution inhibitor that is combined with the polymer. The acid labile groups significantly decrease the solubility of the polymer in a solution of aqueous base. The resist material also contains a photoacid generator and a radical scavenger. The radical scavenger reduces the amount of aromatic compounds outgassed from the resist during the lithographic process. A film of the resist material is formed on a substrate and exposed to delineating radiation. The radiation induces a chemical change in the resist material rendering the exposed resist material substantially more soluble in aqueous base solution than the unexposed portion of the resist material. The image introduced into the resist material is developed using conventional techniques, and the resulting pattern is then transferred into the underlying substrate.

Abstract: A non-corrosive photoresist stripping and cleaning composition, comprising: (a) about 5% to about 50% of a solvent; (b) about 10% to about 90% of an alkanolamine; (c) about 0.1 to 10 % of a carboxylic acid; and (d) about 1.0% to 40% of water.

Abstract: This invention relates to a process for generating a organically soluble partially cross-linked acid labile polymer according to the present invention comprises the steps of providing a polymer with one or more monomer units, wherein at least one of the monomer units contain one or more pendant COOH or hydroxyl groups; and reacting said polymer with a polyvinyl ether in the presence of a acid catalyst to form links between at least two polymer chains. The resulting polymer can be used as a component in a photoresist formulation.

Abstract: A method for the removing of plasma etch residues on a substrate comprising the steps of: (i) contacting the substrate with a cleaning composition, and (ii) contacting the substrate with ozonated water. The preferred cleaning composition has a pH from 2 to 6 and comprises: (A) water; (B) at least one selected hydroxylammonium compound; and (C) at least one basic compound; and optionally (D) a chelating stabilizer; and optionally (E) a surfactant.

Abstract: A positive photosensitive resin composition comprising (a) a silane diol such as diarylsilane diol or dialkylsilane diol, (b) one or more polybenzoxazole precursors having the structure: wherein Ar1 is a tetravalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Ar2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; (c) a photosensitive agent, and (d) a solvent. The composition optionally includes an adhesion promoter, leveling agent, or mixtures thereof.

Abstract: The present invention is directed to a process of removing trace acidic impurities from an impure solution of photoacid generating compounds in a solvent, comprising contacting an impure solution of at least one photoacid generating compound containing trace amounts of acidic impurities with an amine-containing ion exchange resin for a sufficient amount of time to remove substantially all of the acidic impurities from the impure solution, thereby producing a pure solution of at least one photoacid generating compounds substantially free of trace acidic impurities. The invention is also directed to a solution of at least one photoacid generating compound substantially free of trace acidic impurities made by the above process.

Abstract: Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound; (ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.

Abstract: A positive photosensitive resin composition. The composition comprising: (a) a capped polybenzoxazole precursor polymer having the structure; wherein Ar1 is a tetravalent aromatic group, aliphatic group, heterocylic group, or mixtures thereof; Ar2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Z is one of the following groups: x is 10 to 1000; y is 0 to 900; and b is 0.10 to 350; (b) a photosensitive agent; and (c) a solvent.