Abstract: A lens assembly is separated into a first lens module including at least one lens element and a second lens module including at least one other lens element during alignment of its lens elements. Coarse alignment is conducted by aligning an optical axis of at least one lens element within the first lens module with an optical axis of at least one lens element within the second lens module. For conducting fine alignment, an image sensor views a test chart while the first and second lens modules are positioned between the test chart and the image sensor. Image quality indices are obtained from the image sensor of the test chart at different relative alignments between the first and second lens modules, before the first lens module is fixed to the second lens module at a relative alignment therebetween where the image quality indices are optimized.

Abstract: A foreign particle removal system for removing a foreign particle from a surface of an object has a tool gripper which grips a particle removal tool. A tip of the particle removal tool has a sticky tip portion. The sticky tip portion has an apex region at a remote end of the sticky tip portion and a flank region adjoining the apex region. The tool gripper holds the particle removal tool at an oblique angle with respect to the surface so that the flank region of the sticky tip portion faces towards the surface. The tilted particle removal tool is conveyed with the tool gripper to contact the foreign particle on the surface with the flank region of the sticky tip portion and a force is exerted onto the surface to attract the foreign particle onto the flank region. The particle removal tool may then be lifted away from the surface together with the foreign particle.

Abstract: An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.

Abstract: An optical station for a laser processing device including a plurality of holders for holding respective optical elements; a rotatable magazine having a plurality of accommodation spaces for accommodating the plurality of holders; a positioning device having a holder clamp for clamping and positioning a selected one of the optical elements. a magazine actuator for rotating the magazine; linear shifting means for shifting the magazine in a direction parallel to the optical axis, wherein the magazine is shifted towards the positioning device such that the positioning device lifts the holder from its accommodation space.

Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.

Abstract: An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.

Abstract: Before fixing first and second lens modules to an image sensor to form an assembled camera module, the first lens module is held while electrical signals are provided to a first lens element comprised in the first lens module to drive the first lens element to move. An incident light is received along a first optical path and a reflective surface of the first lens element projects the incident light along a second optical path perpendicular to the first optical path such that the incident light is projected through the second lens module along the second optical path onto the image sensor. The first lens module and first lens element are moved relative to the image sensor until the reflective surface forms an inclination angle of 45 degrees with respect to the incident light, so that the incident light is projected normally onto an image plane of the image sensor.

Abstract: A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.

Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

Abstract: The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion.

Abstract: A driving system has a driving motor body operative to produce a driving force for driving an object to move in reciprocating directions. A pivotal support is located between the driving motor body and a machine base for supporting the driving motor body on the machine base. The pivotal support causes at least a portion of the driving motor body to rotate relative to the machine base in an opposite direction to a direction of the driving force produced by the driving motor body to drive the object, so as to reduce vibration transmission to the machine base.

Abstract: A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.

Abstract: A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.

Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.

Abstract: A positioning table, for example for a wire bonder has first and second arms, each of said first and second arms being independently drivable linearly along a first axis, and a stage that is engaged with both the first and second arms. The stage engages with each of the first and second arms via a respective engagement mechanism such that the stage is movable both linearly along the first axis, and rotatable about a rotary axis coincident with a center-point of the stage, the rotary axis being orthogonal to the first axis. Each engagement mechanism is configured to permit a respective distance between the center-point of the stage and an end of each of the first and second arms to vary during movement of an arm along the first axis.

Abstract: A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member.

Abstract: A method for aligning an image sensor relative to a lens module, the method comprising the steps of: receiving a test image along a first optical path with the lens module and projecting the test image along a second optical path transverse to the first optical path with the lens module; manipulating an orientation of the lens module with respect to the image sensor to project the test image along the second optical path onto the image sensor; using the test image received by the image sensor along the second optical path to determine a corrected orientation of the lens module with respect to the image sensor, so as to align the lens module with respect to the image sensor; and thereafter fixing the aligned lens module to the image sensor.

Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.

Abstract: A foreign particle removal system for removing a particle from a surface of a fragile object has a tool gripper which grips a particle removal tool. A force sensing device determines a cleaning position of the particle removal tool relative to the surface whereat a threshold force is exerted on the surface, the threshold force being a force that is exerted by the particle removal tool on the surface that would pick up the foreign particle but would not damage the object. The particle removal tool is conveyed over a location of the foreign particle and is moved towards the surface to the cleaning position whereat the threshold force is exerted on the surface. The particle removal tool is then lifted away from the surface together with the foreign particle.

Abstract: An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.