Abstract: An apparatus for aligning a lens module with an image sensor to form a camera module includes a chart holder, a positioning unit and a reflective elements holder assembly. In use, the chart holder holds a test chart having a region of interest (ROI), the positioning unit holds the lens module and the image sensor, and the reflective elements holder assembly holds multiple reflective elements between the chart holder and the positioning unit. A first optical path from the ROI is directed to a first position on the image sensor. Second optical paths from the ROI are reflected by the reflective elements to respective second positions on the image sensor, the second positions being spaced from the first position. The images captured by the image sensor (arising from the aforementioned optical paths) are analysed and the positioning unit aligns the lens module with the image sensor based on such analysis.

Abstract: A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position.

Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.

Abstract: A semiconductor die is bonded using epoxy onto a substrate supported on a heating platform. After preheating the substrate with the heating platform to a temperature of between 25° C. and 60° C., an epoxy dispenser deposits an epoxy dot onto the substrate before the semiconductor die is placed onto the epoxy dot with a pick head to thereby bond the semiconductor die onto the substrate.

Abstract: After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its focal plane configured at a first distance from the second optical system. After the bond head is moved adjacent to the second optical system, the second optical system views and determines a position and orientation of the bond head when the second optical system has its focal plane configured at a second distance from the second optical system. The position and orientation of the die may then be adjusted to correct a relative offset between the die and the bonding location prior to depositing the die onto the bonding location.

Abstract: A confocal imaging apparatus for inspecting an object comprises a light source operative to project light to illuminate the object, and an imaging device for receiving light reflected from the object along a lighting path located between the object and the imaging device. A pinhole array comprising a plurality of pinholes is positioned along the lighting path such that light reflected from the object is passed through the pinhole array. A mechanism is operative to move the pinhole array along a single axis in a linear direction transverse to the light path for transmitting an image corresponding to a substantially contiguous area of the object onto the imaging device.

Abstract: An apparatus for transferring electronic components, comprising a main rotary turret comprising a plurality of turret pick heads for conveying electronic components to multiple positions adjacent to the main rotary turret; a first rotary mechanism configured for picking up electronic components from a supply of electronic components, the first rotary mechanism being in operative communication with the main rotary turret at a first transfer position; and a second rotary mechanism that is in operative communication with the main rotary turret at a second transfer position, and which is further in operative communication with the first rotary mechanism at a third transfer position.

Abstract: An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.

Abstract: An apparatus and a method for inspecting a substantially transparent semiconductor device are provided, where the method comprises the steps of holding the substantially transparent semiconductor device with a semiconductor device holder, and illuminating a surface of the semiconductor device held by the semiconductor device holder from multiple directions with an enveloping light source. Thereafter, capturing a first image of the semiconductor device with an imaging module from the light projected from the enveloping light source, the first image revealing a direction of grinding marks on the said surface of the transparent semiconductor device.

Abstract: An apparatus for determining an orientation of a die mounted on a tape includes an imaging device, a light source and a conveying mechanism. The die is at least partially translucent and includes at least one orientation feature indicative of the orientation of the die. In use, the conveying mechanism conveys the tape to position the die at an inspection position between the imaging device and the light source. The light source projects light to the imaging device and the imaging device captures an image. The projected light from the light source passing through the die is obstructed by the at least one orientation feature of the die to cause the captured image to include an image of the at least one orientation feature, whereby the orientation of the die may be determined.

Abstract: A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of the wire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.

Abstract: Disclosed is an apparatus for reconstructing a three-dimensional profile of a target surface of an object. The apparatus comprises: i) a lighting apparatus having at least two modes of illumination to illuminate the target surface, wherein a first mode of illumination produces a pattern onto the target surface and a second mode of illumination illuminates every part of the target surface; ii) an imaging device for capturing respective images of the target surface upon a sequential activation of the first and second modes of illumination of the target surface by the lighting apparatus; and iii) a processor for reconstructing the three-dimensional profile of the target surface based on the images of the target surface as captured by the imaging device. A method of reconstructing a 3D profile of a target surface of an object is also disclosed.

Abstract: A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

Abstract: A method of cutting a semiconductor material by irradiating the semiconductor material with laser energy, includes providing a laser source adapted to emit successive pulses of laser beams, each laser beam pulse having a pulse width of 100 picoseconds or less, emitting laser beam pulses from the laser source, guiding the emitted laser beam pulses to irradiate semiconductor material to be cut, and moving the semiconductor material relative to the irradiating laser beam pulses to cut the semiconductor material along a cutting line. The semiconductor material is irradiated by a plurality of laser beam pulses with a pulse repetition frequency in the range from 0.1 GHz to 5000 GHz.

Abstract: A routable electroforming substrate for assembling a semiconductor package is manufactured by providing a carrier and plating a patterned first metallic layer onto the carrier which is configured to function as a surface mount pad or input/output pad in an assembled semiconductor package. A patterned second metallic layer comprising copper is plated over the first metallic layer, and a third metallic layer, which is configured for mounting a plurality of semiconductor dice, is plated over the second metallic layer. The carrier is then removed to expose the first metallic layer.

Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Abstract: A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.

Abstract: A magnet assembly for a linear motor, the magnet assembly including one or more permanent magnets, a mounting plate having a mounting portion that is configured for arranging and mounting the one or more permanent magnets along a direction of elongation of the mounting plate, and at least one elongate member that extends at least partially through the mounting plate between a first end and second end thereof, the at least one elongate member extending at least partially through the or each magnet for fixing the or each magnet with respect to the mounting plate.

Abstract: A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Abstract: A wafer grooving apparatus (100) for forming an elongate recess (103) in a semiconductor wafer surface, the apparatus comprising: a wafer table (110) for receiving and holding a semiconductor wafer; a radiation device (120) for generating a radiation beam (121); a beam directing device (130) for directing the radiation beam to a top surface (102) of the wafer so as to create a beam spot (142) where the radiation beam ablates wafer material on the wafer surface to form a recess; a wafer table displacement drive (170) for effecting a mutual displacement between the radiation beam and the wafer surface in a radiation beam displacement direction; a recess profile measuring device (180) arranged at a predetermined distance behind the beam directing device in the radiation beam displacement direction effected by the wafer table displacement drive for measuring a depth profile of the recess that has been formed by the radiation beam.