Abstract: A system and method for uniformity correction having light leak and shadow compensation is provided. The system includes multiple correction elements and an optical compensation plate. Adjacent correction elements are separated by a gap. The optical compensation plate includes a pattern having multiple gap compensation segments. The pattern has an attenuation which is different than the attenuation of the remaining portions of the optical compensation plate. The location of each compensation segment on the compensation plate corresponds to the location of the corresponding gap between adjacent correction elements in the illumination slot. The width of each compensation segment is dependent upon the angle of the light incident on the correction system. The pattern can be located on the top surface or on the bottom surface of the compensation plate. In addition, the compensation plate can be located above or below the plurality of correction elements.

Abstract: A system and method for patterning a beam of radiation based on a pupil field distribution. In an embodiment, the distribution of the field in an area of the pupil plane affecting an image and an illumination mode are selected so as to render an image with desired characteristics. Additionally and/or alternatively, an illumination mode is selected so as to render an image with desired characteristics. The distribution of the field in an area of the pupil plane affecting an image is then realized using the spatial light modulator The system and method include using an illumination system, a pattern generator, and a projector. The illumination system supplies a beam of radiation. The pattern generator patterns the beam of radiation based on a data set corresponding to a field distribution in a pupil plane. The projector projects the patterned beam onto a target portion of an object.

Abstract: A method and apparatus for correcting overlay errors in a lithography system. During lithographic exposure, features being exposed on the wafer need to overlay existing features on the wafer. Overlay is a critical performance parameter of lithography tools. The wafer is locally heated during exposure. Thermal expansion causes stress between the wafer and the wafer table, which will cause the wafer to slip if it exceeds the local frictional force. To increase the amount of expansion allowed before slipping occurs, the wafer chuck is uniformly expanded after the wafer has been loaded. This creates an initial stress between the wafer and the wafer table. As the wafer expands due to heating during exposure, the expansion first acts to relieve the initial stress before causing an opposite stress from thermal expansion. The wafer may be also be heated prior to attachment to the wafer chuck, creating the initial stress as the wafer cools.

Abstract: An alignment target with geometry designs provides a desired alignment offset for processes (both symmetric and asymmetric) on a wafer substrate. The alignment target includes one or more sub-targets, where each sub-target is defined as having a left portion and a right portion having a different geometric pattern, and where the left portion has a geometry density and the right portion has a geometry density.

Abstract: A system and method for use of a lithography apparatus having a substrate and an absorbing film formed on the substrate. A thickness of the absorbing film is spatially modulated across at least a part of the substrate to reduce a non-uniform intensity of a radiation beam transmitted through the substrate.

Abstract: A method is disclosed for one embodiment. An amount of photoresist is deposited upon a substrate, the amount of photoresist more than necessary to coat the substrate. The substrate is spun within a bowl such that an excess amount of photoresist is propelled off of the substrate to an interior surface of the bowl. A portion of the excess amount of photoresist is recovered and treated such that the recovered portion of the excess amount of photoresist is rendered usable.

Abstract: A system and method are used to form illumination light beams having desirable divergence and directivity. The illumination light beams are shaped using a pupil defining element and a field defining element. Then, divergence or numerical apertures of the light generated by these elements is modified using an optical element that either re-images the light onto planes conjugate to one or both of the pupil defining element and a field defining element or transforms a numerical aperture of light produced by one or both of the pupil defining element and a field defining element.

Abstract: An immersion lithography apparatus is provided that includes an energy source, a projection optical system, a stage, a showerhead including an immersion liquid supply device and an immersion liquid discharge device that produces a flow of liquid within an exposure zone, and a cleaning device that cleans a portion of the projection optical system having been contacted with the immersion liquid by means of a cleaning gas. In an embodiment, the cleaning device includes an ozone generation unit produces a flow of ozone into the exposure zone. In embodiments, the apparatus includes a stage that includes a dose sensor and/or an ultra-violet light source. A method for insitu cleaning of a final lens element within an immersion lithography system having an immersion fluid showerhead that provides immersion fluid to an exposure zone of the immersion lithography system is also provided.

Abstract: A system and method for uniformity correction is provided. The system includes a plurality of winged correction elements inserted into the illumination field in a defined configuration. Adjacent winged correction elements are overlapped to minimize induced uniformity ripple. Each winged correction element has a first protrusion on a longitudinal edge of the correction element and a second protrusion on the opposite longitudinal edge. The slope of a sloped edge of the first protrusion and the slope of a sloped edge of the second protrusion are tied to the slope of a gradient in the non-uniformity profile of the illumination field. In addition, the angles defined by the flat tip of the correction element and the sloped edge of the first and second protrusions are tied to the angle of a gradient of the illumination field.

Abstract: A spatial light modulator (SLM) includes an integrated circuit actuator that can be fabricated using photolithography or other similar techniques. The actuator includes actuator elements, which can be made from piezoelectric materials. An electrode array is coupled to opposite walls of each of the actuator elements is an electrode array. Each array of electrodes can have one or more electrode sections. The array of reflective devices forms the SLM.

Abstract: A system and method are used to pattern light using an illumination system, an array of individually controllable components, and a projection system. The illumination system supplies a beam of radiation. The array of individually controllable elements patterns the beam. The array of individually controllable elements comprises mirrors having first and second steps on opposite edges. The projection system projects the patterned beam onto a target portion of an object. In various examples, the object can be a display, a semiconductor substrate or wafer, a flat panel display glass substrate, or the like, as is discussed in more detail below.

Abstract: A system and method are provided for securely manufacturing a device at a foundry. For example, an integrated circuit chip may be securely fabricated at an untrusted foundry by later verifying authenticity of the integrated circuit chip based on a valid usage of an original source code file associated with a semiconductor manufacturing process of the integrated circuit chip. The integrated circuit chip may be authenticated by matching a first set of unique daughter codes generated during fabrication with a second set of unique daughter codes generated independently by some entity other than the foundry. In this way, a trusted electronics integrator may compare the first and second unique daughter codes to nondestructively determine whether the integrated circuit chip is a trusted device or a tampered device.

Abstract: A coherence remover is provided. In an embodiment the coherence remover includes a first mirror and a second mirror coupled to the first mirror. The coherence remover is configured to receive an input beam. Each of the first and second mirrors is configured to reflect a respective portion of the input beam to produce respective one or more intermediate beams. The intermediate beams collectively form an output beam that has a reduced coherence compared to the input beam.

Abstract: A system and method are used for controlling fluctuations in one or more of a beam pointing error, a beam positioning error, a beam size error or a beam divergence error of a beam of light in a lithography system. An optical apparatus may comprise a first beam control module having a first optics in an optical axis for optically isolating a laser pulse from a light source associated with an illuminator to provide the beam of light. These beam related errors may be selectively stabilized by either homogenizing selectively the spatial field and/or angular information of a given illumination profile for the beam of light and symmetrizing other one of the spatial field or angular information which is not being homogenized based on a first arrangement of the first optics or homogenizing and symmetrizing both of the spatial field and angular information based on a second arrangement of the first optics.

Abstract: Systems and methods for measuring stray light in a lithographic apparatus are described using Radiometric Kirk Test (also known as Scanning SAMOS Test). The Radiometric Kirk Test of the present invention involves a test pattern having an isolated dark area within a much larger bright field. The radiometric Kirk test includes at least two continuous or stepped scans of an aperture of a detector in an image plane of a lithographic system. During a dark area measurement, the aperture of the detector is positioned such that at least at one point the aperture of the detector is centered within an image of the dark area. During a bright area measurement, the aperture of the detector is positioned within the image of the bright field. The integrated detector signal is correspondingly computed for the dark area measurement and the bright area measurement.

Abstract: An embodiment of a symmetry forming device for an alignment system can include an interferometer, a compensator, and an analyzer. The interferometer can be configured to receive a light beam, where the light beam can be produced from a light source or from combining beams from a plurality of light sources. Further, the interferometer can be configured to split the light beam into two beams, rotate one beam 180 degrees with respect to the other beam about an axis of rotation, and recombine the two beams to form a recombined beam. The compensator can be configured to adjust a path length of either the combined or the recombined beam in first and second polarization directions to form an adjusted light beam. The analyzer can be configured to pass a polarization direction or an amplitude and phase profile of either the recombined or adjusted light beam, where the recombined or adjusted light beam is directed onto a substrate.

Abstract: An off-axis catadioptric projection optical systems for use in lithography tools for processing modulated light used to form an image on a substrate is provided. In one embodiment the optical system includes an off-axis mirror segment, a fold mirror, a relay, an aperture stop and a refractive lens group. Modulated light is transmitted through the system to form an image on a substrate. In a second embodiment the projection system includes an off-axis mirror segment, an aperture stop and a refractive lens group. In a third embodiment the projection system includes an off-axis mirror segment, a negative refractive lens group, a concave mirror, a relay, an aperture stop, and a refractive lens group. A method to produce a device using a lithographic apparatus including a projection system with an off-axis mirror segment as the first element in a projection optics system is also provided.

Abstract: A laser beam may be used to provide a virtual reference axis of travel for the in-axis direction of motion of lenses in a zoom assembly to be positioned during a zoom operation. The virtual reference axis is projected along the optical axis, parallel to existing mechanical lens slides. The virtual reference axis passes through an aperture on each of the lens assemblies, and is sampled by a set of optics and detectors on each of the lens assemblies. The optics and detectors are arranged such that any change in the position of a lens cell within a lens assembly relative to the virtual reference axis is sensed and corrected using a feedback signal to a positioning motor. Since the same virtual reference axis is used for each lens in the zoom assembly, each lens can be independently corrected for off-axis position errors to very high precision.

Abstract: Disclosed concepts include a method of, and program product for, optimizing an illumination profile of a pattern to be formed in a surface of a substrate relative to a given mask. Steps include mathematically representing resolvable feature(s) from the given mask, generating an interference map representation from the previous step, modifying the interference map representation to maximize intensity corresponding to the resolvable features, and determining assist feature size(s) such that intensity side lobes do not print.

Abstract: In a gas gauge, effects due to changes in the local environment are reduced by causing a measurement nozzle and a reference nozzle to react as if they were co-located, or located at approximately the same position. This is achieved by venting the reference nozzle in very close proximity to the measurement nozzle. A reference chamber surrounding the reference plate and reference nozzle is vented at approximately the same location as the measurement nozzle. In an embodiment for use in a vacuum environment, the measurement nozzle is surrounded with an annular ring. The measurement annular ring is connected to an annular ring around the reference nozzle, which acts to co-locate the reference nozzle and the measurement nozzle. To avoid choked flow, another annular ring or rings may be placed around the measurement annular ring.