Patents Assigned to ASML Netherlands B.V.
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Publication number: 20250060682Abstract: A lithographic apparatus includes an illumination system to illuminate a pattern of a patterning device and a projection system to project an image of the pattern onto a substrate. The illumination system includes a first and second enclosures, a scaling device, and a protective device. The first enclosure encloses a first environment and includes a first opening and first connection corresponding to the first opening. The second enclosure includes a second connection structure to couple to the first connection structure to prevent mixing of substances between the first environment and a second environment outside of the first and second enclosures. The sealing device is disposed between the first and second connection structures. The material of the sealing device is chemically reactive to the first environment. The protective device is disposed on the sealing device proximal to the first environment to shield the sealing device from the first environment.Type: ApplicationFiled: November 22, 2022Publication date: February 20, 2025Applicant: ASML Netherlands B.V.Inventors: Armin Bernhard RIDINGER, Muchen XU
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Publication number: 20250060738Abstract: A method for training a diagnostic model for diagnosing a production system, wherein the production system includes a plurality of sub-systems. The diagnostic model includes, for each sub-system, a corresponding first learning model arranged to receive input data, and to generate compressed data for the production system in a corresponding compressed latent space. A second learning model is arranged to receive the compressed data generated by the first learning models, and generate further compressed data for the production system in a further compressed latent space. The method includes performing training of the first and second learning models based on training data derived from sensor data characterizing the sub-systems.Type: ApplicationFiled: December 14, 2022Publication date: February 20, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Eleftherios KOULIERAKIS, Anjan Prasad GANTAPARA, Satej Subhash KHEDEKAR, Hamideh ROSTAMI
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Publication number: 20250060679Abstract: Autoencoder models may be used in the field of lithography to estimate, infer or predict a parameter of interest (e.g., metrology metrics). An autoencoder model is trained to predict a parameter by training it with measurement data (e.g., pupil images) of a substrate obtained from a measurement tool (e.g., optical metrology tool). Disclosed are methods and systems for synchronizing two or more autoencoder models for in-device metrology. Synchronizing two autoencoder models may configure the encoders of both autoencoder models to map from different signal spaces (e.g., measurement data obtained from different machines) to the same latent space, and the decoders to map from the same latent space to each autoencoder's respective signal space. Synchronizing may be performed for various purposes, including matching a measurement performance of one tool with another tool, and configuring a model to adapt to measurement process changes (e.g., changes in characteristics of the tool) over time.Type: ApplicationFiled: October 17, 2022Publication date: February 20, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Davide BARBIERI, Pascal CERFONTAINE
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Publication number: 20250060661Abstract: Disclosed is a method of measuring a focus parameter from a focus target. and associated substrate and associated patterning device. The focus target comprises at least a first sub-target and a second sub-target, each having at least a periodic main feature, wherein a respective pitch and/or dimensional parameter of at least some sub-elements of the main feature are configured such that said first sub-target and second sub-target have a respective different best focus value; and wherein each said main feature is formed with a focus dependent center-of-mass and/or pitch. The method comprises obtaining a first measurement signal from said first sub-target and a second measurement signal from said second sub-target; determining a difference signal of said first measurement signal and second measurement signal; and determining said focus parameter from said difference signal.Type: ApplicationFiled: November 28, 2022Publication date: February 20, 2025Applicant: ASML Netherlands B.V.Inventors: Hugo Augustinus Joseph CRAMER, Karel Hendrik Wouter VAN DEN BOS, Miguel GARCIA GRANDA, Maurits VAN DER SCHAAR, Wilhelmus Patrick Elisabeth Maria OP 'T ROOT
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Publication number: 20250060684Abstract: A system includes optical devices, reflective devices, a movable reflective device, and a detector. The optical devices are disposed at a first plane and around a axis of the system and receive scattered radiation from targets. The reflective devices are disposed at at least a second plane and around the axis. Each of the reflective devices receives the scattered radiation from a corresponding one of the optical devices. The movable reflective device is disposed along the axis and receives the scattered radiation from each of the reflective devices. The detector receives the scattered radiation from the movable reflective device.Type: ApplicationFiled: December 14, 2022Publication date: February 20, 2025Applicant: ASML Netherlands B.V.Inventors: Simon Reinald HUISMAN, Sebastianus Adrianus GOORDEN, Stephen ROUX
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Publication number: 20250060680Abstract: Generating an alignment signal for alignment of features in a layer of a substrate as part of a semiconductor manufacturing process is described. The present systems and methods can be faster and/or generate more information than typical methods for generating alignment signals because they utilize one or more existing structures in a patterned semiconductor wafer instead of a dedicated alignment structure. A feature (not a dedicated alignment mark) of the patterned semiconductor wafer is continuously scanned, where the scanning includes: continuously irradiating the feature with radiation; and continuously detecting reflected radiation from the feature. The scanning is performed perpendicular to the feature, along one side of the feature, or along both sides of the feature.Type: ApplicationFiled: December 14, 2022Publication date: February 20, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Aabid PATEL, Joshua ADAMS, Lisa DIXON, Igor Matheus Petronella AARTS
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Patent number: 12228862Abstract: A process of selecting a measurement location, the process including: obtaining pattern data describing a pattern to be applied to substrates in a patterning process; obtaining a process characteristic measured during or following processing of a substrate, the process characteristic characterizing the processing of the substrate; determining a simulated result of the patterning process based on the pattern data and the process characteristic; and selecting a measurement location for the substrate based on the simulated result.Type: GrantFiled: June 9, 2023Date of Patent: February 18, 2025Assignee: ASML NETHERLANDS B.V.Inventors: Hans Van Der Laan, Wim Tjibbo Tel, Marinus Jochemsen, Stefan Hunsche
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Patent number: 12230470Abstract: A detector may be provided with a sensing element or an array of sensing elements, each of the sensing elements may have a corresponding gain element. A substrate may be provided having a sensing element and a gain element integrated together. The gain element may include a section in which, along a direction perpendicular to an incidence direction of an electron beam, a region of first conductivity is provided adjacent to a region of second conductivity, and a region of third conductivity may be provided adjacent to the region of second conductivity. The sensing element may include a section in which, along the incidence direction, a region of fourth conductivity is provided adjacent to an intrinsic region of the substrate, and the region of second conductivity may be provided adjacent to the intrinsic region.Type: GrantFiled: February 25, 2020Date of Patent: February 18, 2025Assignee: ASML Netherlands B.V.Inventors: Yongxin Wang, Rui-Ling Lai
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Patent number: 12230013Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.Type: GrantFiled: August 3, 2023Date of Patent: February 18, 2025Assignee: ASML Netherlands B.V.Inventors: Wentian Zhou, Liangjiang Yu, Teng Wang, Lingling Pu, Wei Fang
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Patent number: 12232244Abstract: A target apparatus (300) for an extreme ultraviolet (EUV) light source includes a target generator, a sensor module (130), and a target generator controller (325). The target generator includes a reservoir (115) configured to contain target material (114) that produces EUV light in a plasma state and a nozzle structure (117) in fluid communication with the reservoir. The target generator defines an opening (119) in the nozzle structure through which the target material received from the reservoir is released. The sensor module is configured to: detect an aspect relating to target material released from the opening as the target material travels along a trajectory toward a target space (112), and produce a one-dimensional signal from the detected aspect. The target generator controller is in communication with the sensor module and the target generator, and is configured to modify characteristics of the target material based on an analysis of the one-dimensional signal.Type: GrantFiled: February 7, 2020Date of Patent: February 18, 2025Assignee: ASML Netherlands B.V.Inventor: Theodorus Wilhelmus Driessen
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Patent number: 12230469Abstract: Disclosed among other aspects is a charged particle inspection system including a phaseplate configured and arranged to modify the local phase of charged particles in a beam to reduce the effects of lens aberrations. The phaseplate is made up of an array of apertures with the voltage and/or a degree of obscuration of the apertures being controlled individually or in groups.Type: GrantFiled: December 30, 2021Date of Patent: February 18, 2025Assignee: ASML Netherlands B.V.Inventors: Albertus Victor Gerardus Mangnus, Maikel Robert Goosen
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Publication number: 20250053702Abstract: A defect prediction method for a device manufacturing process involving processing a pattern onto a substrate, the method comprising: identifying a processing window limiting pattern (PWLP) from the pattern; determining a processing parameter under which the PWLP is processed; and determining or predicting, using the processing parameter, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the PWLP with the device manufacturing process.Type: ApplicationFiled: October 28, 2024Publication date: February 13, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Stefan Hunsche, Venugopal Vellanki
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Publication number: 20250053102Abstract: A method of reducing cyclic error effects in a lithographic process having a projection phase and an idle phase, the method including controlling in a first control loop a first position of a first module, the first module being a position controlled mirror of a projection system, the first control loop having a first bandwidth and including a first position measurement system having a first cyclic error, wherein controlling the first position includes continuously moving the first module at least during the projection phase, such that a first main frequency of the first cyclic error will be above the first bandwidth of the first control loop.Type: ApplicationFiled: December 6, 2022Publication date: February 13, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Hans BUTLER, Robertus Johannes Marinus DE JONGH
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Patent number: 12222050Abstract: A target material supply apparatus includes: first and second fluid flow components (1122, 1126) that define an axial flow path when joined together, in which the axial flow path is between a source of target material fluid and a nozzle supply apparatus; and a coupling apparatus configured to seal the joint between the first and second fluid flow components. The coupling apparatus includes a gasket (1105) having an annular shape defining an inner opening that is a part of the axial flow path when seated and sealed. When the gasket is seated between the first and second fluid flow components to thereby seal the joint formed by attaching the first and second fluid flow components, pressure applied to the gasket from target material fluid traversing the gasket inner opening along the axial flow path improves the hermetic function of the seal at the joint. Optionally, a functional insert like e.g. a flow restrictor (1160) can be seated in the gasket.Type: GrantFiled: July 13, 2021Date of Patent: February 11, 2025Assignee: ASML Netherlands B.V.Inventors: Benjamin Andrew Sams, Dietmar Uwe Herbert Trees, Vikas Giridhar Telkar, Alexander Igorevich Ershov, Theodorus Wilhelmus Driessen, Serkan Kincal
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Patent number: 12222656Abstract: A method for determining process window limiting patterns based on aberration sensitivity associated with a patterning apparatus. The method includes obtaining (i) a first set of kernels and a second set of kernels associated with an aberration wavefront of the patterning apparatus and (ii) a design layout to be printed on a substrate via the patterning apparatus; and determining, via a process simulation using the design layout, the first set of kernels, and the second set of kernels, an aberration sensitivity map associated with the aberration wavefront, the aberration sensitivity map indicating how sensitive one or more portions of the design layout are to an individual aberrations and an interaction between different aberrations; determining, based on the aberration sensitivity map, the process window limiting pattern associated with the design layout having relatively high sensitivity compared to other portions of the design layout.Type: GrantFiled: August 21, 2020Date of Patent: February 11, 2025Assignee: ASML NETHERLANDS B.V.Inventors: Jingjing Liu, Duan-Fu Stephen Hsu, Xingyue Peng
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Publication number: 20250044710Abstract: A method of image template matching for multiple process layers of, for example, semiconductor substrate with an adaptive weight map is described. An image template is provided with a weight map, which is adaptively updated based during template matching based on the position of the image template on the image. A method of template matching a grouped pattern or artifacts in a composed template is described, wherein the pattern comprises deemphasized areas weighted less than the image templates. A method of generating an image template based on a synthetic image is described. The synthetic image can be generated based on process and image modeling. A method of selecting a grouped pattern or artifacts and generating a composed template is described. A method of per layer image template matching is described.Type: ApplicationFiled: December 13, 2022Publication date: February 6, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Jiyou FU, Jing SU, Chenxi LIN, Jiao LIANG, Guangqing CHEN, Yi ZOU
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Publication number: 20250044707Abstract: A method of performing a lithographic performance qualification test. The method includes: obtaining one or more exposure layouts, each relating to exposure of multiple exposure fields on a substrate; performing a dummy exposure on a substrate including photoresist for each of the one or more exposure layouts, the dummy exposure using no exposure illumination or exposure illumination having an exposure energy below an exposure threshold of the photoresist; monitoring one or more exposure parameters of each dummy exposure to obtain exposure parameter data; and evaluating lithographic performance of each dummy exposure and/its corresponding exposure layout from the exposure parameter data respective to that dummy exposure.Type: ApplicationFiled: December 15, 2022Publication date: February 6, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Alina Nicoleta TARAU, Robert Bastiaan Clark DE KORTE
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Publication number: 20250046570Abstract: The embodiments of the present disclosure provide a charged particle optical device for projecting charged particle beams towards a sample position, arranged in a grid. The device comprises: a beam limiting aperture array and strip arrays. In the beam limiting aperture array is defined a plurality of apertures so as to generate the grid of beams. The strip arrays are positioned along beam paths. The strip arrays extend across the path of the plurality of beams to operate on the charged particles that pass along the path between strips of the respective strip array to collimate the path of the beams. The orientation of the strips in the array of two different arrays along the beam path are different. The beam limiting aperture array, the strip arrays or both are configured to mitigate a characteristic of the grid that is induced by passage of the beams through the strip arrays.Type: ApplicationFiled: October 18, 2024Publication date: February 6, 2025Applicant: ASML NETHERLANDS B.V.Inventor: Petrus Wilhelmus SMORENBURG
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Publication number: 20250044715Abstract: A projection unit for a level sensor, the projection unit including: a first light pipe having a first inlet configured to receive radiation from a source and a first outlet; and a second light pipe having a second inlet configured to receive the radiation from the first light pipe and a second outlet. The unit may include a lens device configured to receive radiation from the second outlet and to output radiation having a predetermined distribution of intensity and irradiance.Type: ApplicationFiled: December 5, 2022Publication date: February 6, 2025Applicant: ASML NETHERLANDS B.V.Inventors: Ahmet Burak CUNBUL, Ferry ZIJP, Teunis Willem TUKKER, Peter Fernand William Jozef DENDAS, Abraham Franciscus Hubertus VAN GESSEL
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Publication number: 20250044709Abstract: Systems, methods, and media for determining a processing parameter associated with a lithography process. In some embodiments, image data of features on a substrate may be obtained, and the image data may be analyzed in Fourier space. Based on the analysis, an amplitude and a phase may be determined, and an overlay of the features may be determined based on the amplitude and the phase.Type: ApplicationFiled: November 22, 2022Publication date: February 6, 2025Applicant: ASML NETHERLANDS B.V.Inventor: Willem Louis VAN MIERLO