Abstract: A method for determining a measurement setting for measuring a parameter of interest from a target structure on a substrate. The method includes: obtaining first position difference data describing a difference between a position of a first representative target structure position and a position of one or more first features relating to product structure; obtaining optical metrology data relating to optical measurements of the target structure and further relating to a plurality of different measurement settings; and determining the measurement setting from the first position difference data and the optical metrology data such that a measured feature position value obtained from an optical measurement of the target structure using the determined measurement setting is better correlated to a position of the one or more first features.

Abstract: Disclosed is a method of determining a value for a parameter of interest from a target on a substrate. The method comprises obtaining metrology data comprising single-wavelength parameter of interest values which were obtained using a respective different measurement wavelength; and determining said value for the parameter of interest from a stack sensitivity derived weighted combination of said single-wavelength parameter of interest values. Also disclosed is a method of selecting wavelengths for a measurement based on at least the derivative of the stack sensitivity with respect to wavelength.

Abstract: A height measurement sensor comprising projection and detection units. The projection unit comprises a radiation source and a projection grating comprising a projection grating spot having a plurality of grating lines, the projection grating arranged to receive radiation and output a radiation beam onto the surface to create a radiation spot. The detection unit comprises: a detection grating comprising a detection grating spot having a plurality of grating lines; a detector arranged to receive a reflected radiation beam comprising radiation from the radiation spot after passing through the detection grating spot; and a controller configured to (i) obtain a detector output signal comprising a plurality of periodic components; (ii) take a derivative of two points at different locations of the output signal, wherein the two points are separated by a period of the periodic components, and (iii) determine a focus plane of the sensor when the derivative changes sign.

Abstract: A process of characterizing a process window of a patterning process, the process including: obtaining a set of inspection locations for a pattern, the pattern defining features to be applied to a substrate with a patterning process, the set of inspection locations corresponding to a set of the features, the set of features being selected from among the features according to sensitivity of the respective features to variation in one or more process characteristics of the patterning process; patterning one or more substrates under varying process characteristics of the patterning process; and determining, for each of the variations in the process characteristics, whether at least some of the set of features yielded unacceptable patterned structures on the one or more substrates at corresponding inspection locations.

Abstract: Novel membranes for use in a lithographic apparatus are disclosed. A first membrane includes a core substrate and a metal silicate layer. The metal silicate layer is an outermost layer of the first membrane. A second membrane includes a core substrate and an yttrium silicate layer. The yttrium silicate layer may be an outermost layer of the membrane or, alternatively, the yttrium silicate layer may be disposed between the core substrate and a layer of yttrium or yttrium oxide. The first and second membranes may be provided within an EUV lithographic apparatus. For example, the membranes may form part of a pellicle. The pellicle may be suitable for use adjacent to a reticle within an EUV lithographic apparatus. The membranes may form part of a dynamic gas lock. The membranes may form part of a spectral filter.

Abstract: Selecting one or more lists of fields of view of a pattern layout for scanning electron microscope measurement and/or other inspection. A set of candidate fields of view is determined based on pattern groups of a pattern layout and a constraint on a characteristic of a given field of view. The characteristic of a given field of view includes a distance from the given field of view to another field of view and/or a size of the given field of view. The one or more lists are selected from the set of candidate fields of view according to prescribed criteria for combinations of fields of view included in the one or more lists. The prescribed criteria causes inclusion of an optimally diverse group of patterns in a predetermined number of lists of fields of view.

Abstract: A system includes an imaging system, a spatial filter, and a detector. The system is configured to receive a plurality of diffraction orders. The spatial filter is configured to block one or more undesired diffraction orders of the plurality of diffraction orders and to pass one or more desired diffraction orders of the plurality of diffraction orders. The spatial filter includes one or more obscurations having an angular dependent radius that varies azimuthally. The detector is configured to receive and measure an intensity of the one or more desired diffraction orders. The spatial filter is motorized.

Abstract: A sample inspection tool is described. The inspection tool includes a light source configured to produce effective inspection radiation below 200 nm, a sample holder, an imaging sub-system containing sub-system components that delivers light along an optical path from the light source to a sample to be held by the sample holder, and a barrier positioned between the last sub-system component in the optical path and the sample to be held by the sample holder. The barrier permits the radiation to pass therethrough while inhibiting impurities from reaching the sample to be held by the sample holder. In another embodiment, a barrier is provided for use in an inspection tool.

Abstract: Disclosed is a method for determining a focus parameter from a target on a substrate. The target comprises an isofocal first sub-target and a second non-isofocal sub-target. The method comprises obtaining a first measurement signal relating to measurement of the first sub-target, a second measurement signal relating to measurement of the second sub-target and at least one trained relationship and/or model which relates at least said second measurement signal to said focus parameter. A value for said focus parameter is determined from said first measurement signal, second measurement signal and said at least one trained relationship and/or model.

Abstract: A method for determining a parameter of interest relating to at least one structure formed on a substrate in a manufacturing process. The method includes: obtaining layout data relating to a layout of a pattern to be applied to the at least one structure, the pattern including the at least one structure; and obtaining a trained model, having been trained on metrology data and the layout data to infer a value and/or probability metric relating to a parameter of interest from at least the layout data, the metrology data relating to a plurality of measurements of the parameter of interest at a respective plurality of measurement locations on the substrate. A value and/or probability metric is determined relating to the parameter of interest at one or more locations on the substrate different from the measurement locations from at least layout data using the trained model.

Abstract: The present invention provides a fluid purging system (100) for an optical element (30), comprising a ring and a fluid supply system (40). The ring being formed of a body entirely surrounding the optical element, the ring defining a space (5) radially inwards thereof and adjacent to the optical element. The ring is formed by at least one first wall portion (10) and at least one second wall portion (20A; 20B), wherein an average height of the first wall portion is greater than an average height of the second wall portion. The fluid supply system is positioned radially outwards of the ring and configured to supply fluid to pass over the at least one second wall portion to the space.

Abstract: A droplet generator nozzle (800, 820/830) includes a metal body (802, 822), a metal fitting (812, 823/833) arranged adjacent to the metal body, and a capillary (804, 824/834) comprising a first end and a second end. The first end of the capillary is disposed within the metal fitting, and the capillary is configured to eject initial droplets of a material from the second end of the capillary. The droplet generator nozzle further includes an electromechanical element (808 828/838) disposed within the metal body and coupled to the first end of the capillary and a fastener element (810) configured to clamp around a portion of the metal body and around the metal fitting. The electromechanical element is configured to apply a change that affects droplet generation from the capillary. The second end of the capillary protrudes out from an opening in the fastener element of the droplet generator nozzle. Droplet generator nozzle 830 of FIG. 8C represents the embodiment shown in FIG.

Abstract: A substrate holder for use in a lithographic apparatus and configured to support a substrate, the substrate holder having a main body having a main body surface, a plurality of main burls projecting from the main body surface, wherein each main burl has a distal end surface configured to support the substrate, a first seal member projecting from the main body surface and having an upper surface, the first seal member surrounding the plurality of main burls and configured to restrict the passage of liquid between the substrate and the main body surface radially inward past the first seal member, and a plurality of minor burls projecting from the upper surface of the first seal member, wherein each minor burl has a distal end surface configured to support the substrate.

Abstract: A lithographic apparatus is disclosed that includes a substrate table configured to support a substrate on a substrate supporting area and a heater and/or temperature sensor on a surface adjacent the substrate supporting area.

Abstract: Scanner aberration impact modeling in a semiconductor manufacturing process, which may facilitate co-optimization of multiple scanners. Scanner aberration impact modeling may include executing a calibrated model and controlling a scanner based on output from the model. The model is configured to receive patterning system aberration data. The model is calibrated with patterning system aberration calibration data and corresponding patterning process impact calibration data. New patterning process impact data may be determined, based on the model, for the received patterning system aberration data. The model includes a hyperdimensional function configured to correlate the received patterning system aberration data with the new patterning process impact data.

Abstract: Disclosed is a metrology method and associated devices. The method comprises obtaining a first image, said first image being subject to one or more non-isoplanatic aberrations of an optical system used to capture said image; and non-iteratively correcting said first image for the effect of said one or more non-isoplanatic aberrations by performing one or both of: a field non-isoplanatic correction operation in field space for said first image, said field space corresponding to a field plane of the optical system; and a pupil non-isoplanatic correction operation in pupil space for said first image, said pupil space corresponding to a pupil plane of the optical system. Said one or more non-isoplanatic aberrations comprise a class of non-isoplanatic aberrations describable as a convolution combined with an object distortion and/or a pupil distortion.

Abstract: A system for cleaning contamination particles from a clamp of a lithography apparatus. The system includes a body configured to be inserted into the lithography apparatus, engaged by a tool handler of the lithography apparatus, and positioned by the tool handler for clamping by the clamp. Cleaning features are patterned on a clamp facing surface of the body. Locations and dimensions of the cleaning features on the clamp facing surface approximate locations and dimensions of the contamination particles on the clamp, such that relative movement between the cleaning features and the clamp cleans the contamination particles from the clamp. For example, the locations of the cleaning features on the clamp facing surface can correspond to object contact areas (e.g., burls) on the clamp where the contamination particles are located. The dimensions of the cleaning features comprise a specific pitch, a line width, and a thickness.

Abstract: A pressure control valve has: a passageway having a flow opening; an member displaceable relative to the opening for obstructing the opening by differing amounts; a piezo actuator; and a linkage mechanism adapted to amplify a dimensional change in the piezo actuator and to use the amplified dimensional change to displace the member relative to the opening, wherein the linkage mechanism comprises a frame attached to a wall and fixed at a first end in relation to the passageway, a portion of the frame moveable in a first direction while being substantially restrained in a second direction orthogonal to the first direction, the piezo actuator extending between the wall and the movable portion such that an expansion of the piezo actuator results in movement of the movable portion in the first direction by an amount greater than the expansion of the piezo actuator, the moveable portion connected to the member.

Abstract: A method for configuring an apparatus for providing structures to a layer on a substrate, the method including: obtaining first data including substrate specific data as measured and/or modeled before the providing of the structures to the layer on the substrate; and determining a configuration of the apparatus for at least two different control regimes based on the first data and the use of a common merit function including parameters associated with the at least two control regimes.

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.