Patents Assigned to ASML Netherlands B.V.
  • Patent number: 11099490
    Abstract: An inspection substrate for inspecting a component of an apparatus for processing production substrates, the inspection substrate having: a body having dimensions similar to the production substrates so that the inspection substrate is compatible with the apparatus; a sensor configured to generate inspection information relating to a parameter of the component of the apparatus, the sensor embedded in the body; a control detector embedded in the body and configured to detect a control signal transmitted by the apparatus for processing production substrates; and a controller embedded in the body and configured to control the sensor in response to detection of the control signal.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: August 24, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Jeroen Arnoldus Leonardus Johannes Raaymakers, Peter Johannes Antonius Raedts, Miao Yu
  • Patent number: 11099319
    Abstract: An optical fiber, an apparatus for receiving input radiation and broadening a frequency range, a radiation source, a metrology arrangement and a lithographic apparatus are provided. The optical fiber comprises a hollow core, a cladding portion and a support portion. The cladding portion surrounds the hollow core and comprises a plurality of anti-resonance elements for guiding radiation through the hollow core. The support portion surrounds and supports the cladding portion and comprises an inner support portion, an outer support portion and a deformable connecting portion that connects the inner support portion to the outer support portion.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: August 24, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Patrick Sebastian Uebel, Sebastian Thomas Bauerschmidt, Peter Maximilian Götz
  • Patent number: 11101099
    Abstract: The invention relates to an exposure apparatus and a method for projecting a charged particle beam onto a target. The exposure apparatus comprises a charged particle optical arrangement comprising a charged particle source for generating a charged particle beam and a charged particle blocking element and/or a current limiting element for blocking at least a part of a charged particle beam from a charged particle source. The charged particle blocking element and the current limiting element comprise a substantially flat substrate provided with an absorbing layer comprising Boron, Carbon or Beryllium. The substrate further preferably comprises one or more apertures for transmitting charged particles. The absorbing layer is arranged spaced apart from the at least one aperture.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: August 24, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Alexander Hendrik Vincent Van Veen, Derk Ferdinand Walvoort
  • Publication number: 20210255547
    Abstract: A method of determining a sampling control scheme and/or a processing control scheme for substrates processed by a device. The method uses a fingerprint model and an evolution model to generate the control scheme. The fingerprint model is based on fingerprint data for a processing parameter of at least one substrate processed by a device, and the evolution model represents variation of the fingerprint data over time. The fingerprint model and the evolution model are analyzed and a sampling and/or processing control scheme is generated using the analysis. The sampling control scheme provides an indication for where and when to take measurements on substrates processed by the device. The processing control scheme provides an indication for how to control the processing of the substrate. Also, there is provided a method of determining which of multiple devices contributed to a fingerprint of a processing parameter.
    Type: Application
    Filed: May 20, 2019
    Publication date: August 19, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jeroen Van Dongen, Wim Tjibbo TEL, Sarathi ROY, Yichen ZHANG, Andrea CAVALLI, Bart Laurens SJENITZER, Simon Philip Spencer HASTINGS
  • Publication number: 20210255552
    Abstract: Methods of determining information about a patterning process. In a method, measurement data from a metrology process applied to each of a plurality of metrology targets on a substrate is obtained. The measurement data for each metrology target includes at least a first contribution and a second contribution. The first contribution is from a parameter of interest of a patterning process used to form the metrology target. The second contribution is from an error in the metrology process. The method further includes using the obtained measurement data from all of the plurality of metrology targets to obtain information about an error in the metrology process, and using the obtained information about the error in the metrology process to extract a value of the parameter of interest for each metrology target.
    Type: Application
    Filed: April 27, 2021
    Publication date: August 19, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Joannes Jitse VENSELAAR, Anagnostis TSIATMAS, Samee Ur REHMAN, Paul Christiaan HINNEN, Jean-Pierre Agnes Henricus Marie VAESSEN, Nicolas Mauricio WEISS, Gonzalo Roberto SANGUINETTI, Thomai ZACHAROPOULOU, Martijn Maria ZAAL
  • Publication number: 20210255548
    Abstract: A defect prediction method for a device manufacturing process involving processing one or more patterns onto a substrate, the method including: determining values of one or more processing parameters under which the one or more patterns are processed; and determining or predicting, using the values of the one or more processing parameters, an existence, a probability of existence, a characteristic, and/or a combination selected from the foregoing, of a defect resulting from production of the one or more patterns with the device manufacturing process.
    Type: Application
    Filed: May 6, 2021
    Publication date: August 19, 2021
    Applicant: ASML Netherlands B.V.
    Inventors: Venugopal VELLANKI, Vivek Kumar JAIN, Stefan HUNSCHE
  • Publication number: 20210255553
    Abstract: A method of measuring overlay uses a plurality of asymmetry measurements from locations (LOI) on a pair of sub-targets (1032, 1034) formed on a substrate (W). For each sub-target, the plurality of asymmetry measurements are fitted to at least one expected relationship (1502, 1504) between asymmetry and overlay, based on a known bias variation deigned into the sub-targets. Continuous bias variation in one example is provided by varying the pitch of top and bottom gratings (P1/P2). Bias variations between the sub-targets of the pair are equal and opposite (P2/P1). Overlay (OV) is calculated based on a relative shifht (xs) between the fitted relationships for the two sub-targets. The step of fitting asymmetry measurements to at least one expected relationship includes wholly or partially discounting measurements (1506, 1508, 1510) that deviate from the expected relationship and/or fall outside a particular segment of the fitted relationship.
    Type: Application
    Filed: May 3, 2021
    Publication date: August 19, 2021
    Applicant: ASML Netherlands B.V.
    Inventors: Zili ZHOU, Nitesh PANDEY, Olger Victor ZWIER, Patrick WARNAAR, Maurits VAN DER SCHAAR, Elliott Gerard MC NAMARA, Arie Jeffrey DEN BOEF, Paul Christiaan HINNEN, Murat BOZKURT, Joost Jeroen OTTENS, Kaustuve BHATTACHARYYA, Michael KUBIS
  • Patent number: 11094426
    Abstract: The invention relates to charged particle beam generator comprising a charged particle source for generating a charged particle beam, a collimator system comprising a collimator structure with a plurality of collimator electrodes for collimating the charged particle beam, a beam source vacuum chamber comprising the charged particle source, and a generator vacuum chamber comprising the collimator structure and the beam source vacuum chamber within a vacuum, wherein the collimator system is positioned outside the beam source vacuum chamber. Each of the beam source vacuum chamber and the generator vacuum chamber may be provided with a vacuum pump.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: August 17, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Alexander Hendrik Vincent Van Veen, Willem Henk Urbanus, Marco Jan-Jaco Wieland
  • Patent number: 11096266
    Abstract: A method includes providing a target material that comprises a component that emits extreme ultraviolet (EUV) light when converted to plasma; directing a first beam of radiation toward the target material to deliver energy to the target material to modify a geometric distribution of the target material to form a modified target; directing a second beam of radiation toward the modified target, the second beam of radiation converting at least part of the modified target to plasma that emits EUV light; measuring one or more characteristics associated with one or more of the target material and the modified target relative to the first beam of radiation; and controlling an amount of radiant exposure delivered to the target material from the first beam of radiation based on the one or more measured characteristics to within a predetermined range of energies.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: August 17, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Daniel Jason Riggs, Robert Jay Rafac
  • Patent number: 11094502
    Abstract: An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns. The actuator system may include a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: August 17, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Bernardo Kastrup, Johannes Catharinus Hubertus Mulkens, Marinus Aart Van Den Brink, Jozef Petrus Henricus Benschop, Erwin Paul Smakman, Tamara Druzhinina, Coen Adrianus Verschuren
  • Patent number: 11092902
    Abstract: Disclosed is a method and associated inspection apparatus for detecting variations on a surface of a substrate. The method comprises providing patterned inspection radiation to a surface of a substrate. The inspection radiation is patterned such that an amplitude of a corresponding enhanced field is modulated in a manner corresponding to the patterned inspection radiation. The scattered radiation resultant from interaction between the enhanced field and the substrate surface is received and variations on the surface of the substrate are detected based on the interaction between the enhanced field and the substrate surface. Also disclosed is a method of detecting any changes to at least one characteristic of received radiation, the said changes being induced by the generation of a surface plasmon at said surface of the optical element.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 17, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Johannes Franciscus Martinus D'Achard Van Enschut, Tamara Druzhinina, Nitish Kumar, Sarathi Roy, Yang-Shan Huang, Arie Jeffrey Den Boef, Han-Kwang Nienhuys, Pieter-Jan Van Zwol, Sander Bas Roobol
  • Patent number: 11092900
    Abstract: A substrate has first and second target structures formed thereon by a lithographic process. Each target structure has two-dimensional periodic structure formed in a single material layer on a substrate using first and second lithographic steps, wherein, in the first target structure, features defined in the second lithographic step are displaced relative to features defined in the first lithographic step by a first bias amount that is close to one half of a spatial period of the features formed in the first lithographic step, and, in the second target structure, features defined in the second lithographic step are displaced relative to features defined in the first lithographic step by a second bias amount close to one half of said spatial period and different to the first bias amount.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: August 17, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Maurits Van Der Schaar, Youping Zhang, Hendrik Jan Hidde Smilde, Anagnostis Tsiatmas, Adriaan Johan Van Leest, Alok Verma, Thomas Theeuwes, Hugo Augustinus Joseph Cramer, Paul Christiaan Hinnen
  • Patent number: 11092903
    Abstract: An exposure apparatus arranged to project a radiation beam onto a target portion of a substrate, the exposure apparatus having: a first substrate holder configured to hold the substrate; a second substrate holder configured to hold the substrate; a sensor holder configured to hold a sensor and/or detector; a first measurement device having a first alignment system having an alignment sensor configured to measure positions of a substrate alignment mark on the substrate; a second measurement device having a second alignment system having a further alignment sensor configured to measure positions of the substrate alignment mark on the substrate; a first scale arranged on a lower surface of the first substrate holder; and a first encoder head arranged to cooperate with the first scale, the first encoder head located beneath the first alignment system and held by a stationary support.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 17, 2021
    Assignee: ASML Netherlands B.V.
    Inventor: Junichi Kanehara
  • Publication number: 20210249224
    Abstract: An electron beam apparatus including: an electron beam source configured to generate an electron beam; a beam conversion unit including an aperture array configured to generate a plurality of beamlets from the electron beam, and a deflector unit configured to deflect one or more groups of the plurality of beamlets; and a projection system configured to project the plurality of beamlets onto an object, wherein the deflector unit is configured to deflect the one or more groups of the plurality of beamlets to impinge on the object at different angles of incidence, each beamlet in a group having substantially the same angle of incidence on the object.
    Type: Application
    Filed: May 24, 2019
    Publication date: August 12, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Erwin Paul SMAKMAN, Albertus Victor Gerardus MANGNUS, Maikel Robert GOOSEN
  • Publication number: 20210247698
    Abstract: A method for tuning a target apparatus of a patterning process. The method includes obtaining a reference performance, and measurement data of a substrate subjected to the patterning process at the target apparatus, the measurement data indicative of a performance of the target apparatus; determining a cause of a performance mismatch based on a difference between the reference performance and the performance of the target apparatus, wherein the cause includes an optical characteristic; and responsive to the cause, adjusting an optical parameter associated with an adjustable optical characteristic to reduce the performance mismatch in the optical characteristic.
    Type: Application
    Filed: June 11, 2019
    Publication date: August 12, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Bart SMEETS, Anita BOUMA, Johannes Jacobus Matheus BASELMANS, Birgitt Noelle Cornelia Liduine HEPP, Paulus Hubertus Petrus KOLLER, Carsten Andreas KÖHLER
  • Publication number: 20210247700
    Abstract: A method for determining a correction for control of at least one manufacturing apparatus used in a manufacturing process for providing structures to a region on a substrate, the region including a plurality of sub-regions. The method includes obtaining measurement data relating to a process parameter of the manufacturing process for the region; and determining a correction for the manufacturing apparatus based on the measurement data. The correction is configured to maintain the process parameter within a specified range across a boundary between two of the sub-regions and/or to better correct the process parameter across the boundary between two of the sub-regions with respect to within the remainder of the region.
    Type: Application
    Filed: May 1, 2019
    Publication date: August 12, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Wolter SIEMONS, Daan Maurits SLOTBOOM, Erik Peter DE KORT
  • Patent number: 11086230
    Abstract: A method for optimization to increase lithographic apparatus throughput for a patterning process is described. The method includes providing a baseline dose for an EUV illumination and an initial pupil configuration, associated with a lithographic apparatus. The baseline dose and the initial pupil configuration are configured for use with a dose anchor mask pattern and a corresponding dose anchor target pattern for setting an illumination dose for corresponding device patterns of interest. The method includes biasing the dose anchor mask pattern relative to the dose anchor target pattern; determining an acceptable lower dose for the biased dose anchor mask pattern and the initial pupil configuration; unbiasing the dose anchor mask pattern relative to the dose anchor target pattern; and determining a changed pupil configuration and a mask bias for the device patterns of interest based on the acceptable lower dose and the unbiased dose anchor mask pattern.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: August 10, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Duan-Fu Stephen Hsu, Jingjing Liu
  • Patent number: 11086240
    Abstract: Disclosed is a metrology sensor system, such as a position sensor. The system comprises an optical collection system configured to collect diffracted or scattered radiation from a metrology mark on a substrate, said collected radiation comprising at least one parameter-sensitive signal and noise signal which is not parameter-sensitive, a processing system operable to process the collected radiation; and a module housing. An optical guide is provided for guiding the at least one parameter-sensitive signal, separated from the noise signal, from the processing system to a detection system outside of the housing. A detector detects the separated at least one parameter-sensitive signal. An obscuration for blocking zeroth order radiation and/or a demagnifying optical system may be provided between the optical guide and the detector.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: August 10, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Sebastianus Adrianus Goorden, Nitesh Pandey, Duygu Akbulut, Alessandro Polo, Simon Reinaid Huisman
  • Patent number: 11087065
    Abstract: A method for controlling a processing apparatus used in a semiconductor manufacturing process to form a structure on a substrate, the method including: obtaining a relationship between a geometric parameter of the structure and a performance characteristic of a device including the structure; and determining a process setting for the processing apparatus associated with a location on the substrate, wherein the process setting is at least partially based on an expected value of the geometric parameter of the structure when using the processing setting, a desired performance characteristic of the device and an expected physical yield margin or defect yield margin associated with the location on the substrate.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: August 10, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Sunit Sondhi Mahajan, Abraham Slachter, Brennan Peterson, Koen Wilhelmus Cornelis Adrianus Van Der Straten, Antonio Corradi, Pieter Joseph Marie Wöltgens
  • Patent number: 11086234
    Abstract: A substrate holder, a method of manufacturing of the substrate holder and a lithographic apparatus having the substrate holder. In one arrangement, a substrate holder is for use in a lithographic apparatus. The substrate holder is configured to support a lower surface of a substrate. The substrate holder has a main body, a plurality of burls and a coating. The main body has a substrate-facing face. The plurality of burls protrudes from the substrate-facing face. Each burl has a distal end configured to engage with the substrate. The distal ends are configured for supporting the substrate. The coating is on the substrate-facing face between the burls. Between the burls the substrate-facing face has an arrangement of areas. Adjacent areas are separated by a step-change in distance below the support plane. Each step-change is greater than a thickness of the coating.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: August 10, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Thomas Poiesz, Satish Achanta, Jeroen Bouwknegt, Abraham Alexander Soethoudt