Abstract: Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer. The method comprises generating beamlet control data for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices, wherein the beamlet control data is generated based on a feature data set defining features selectable for individualizing the electronic devices, wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different selection of the features from the feature data set for different subsets of the electronic devices.

Abstract: Disclosed is a method of measuring a parameter of a lithographic process, and associated inspection apparatus. The method comprises measuring at least two target structures on a substrate using a plurality of different illumination conditions, the target structures having deliberate overlay biases; to obtain for each target structure an asymmetry measurement representing an overall asymmetry that includes contributions due to (i) the deliberate overlay biases, (ii) an overlay error during forming of the target structure and (iii) any feature asymmetry. A regression analysis is performed on the asymmetry measurement data by fitting a linear regression model to a planar representation of asymmetry measurements for one target structure against asymmetry measurements for another target structure, the linear regression model not necessarily being fitted through an origin of the planar representation. The overlay error can then be determined from a gradient described by the linear regression model.

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Abstract: A method for improving a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic apparatus, the method including: obtaining a first source of the lithographic apparatus; classifying the first source into a class among a plurality of possible classes, based on one or more numerical characteristics of the first source, using a machine learning model, by a computer; determining whether the class is among one or more predetermined classes; only when the class is among the one or more predetermined classes, adjusting one or more source design variables to obtain a second source.

Abstract: Measurement data is obtained for calibration fields that have been exposed by a lithographic apparatus using different field layouts and exposure sequences. The measurement data is classified in subsets by scan direction, step direction, field size and other variables. The measurement data is indexed by a time value that varies through each exposure sequence. Time values within different exposure sequences can be related using a normalized time value based on the beginning and end of each exposure sequence. An inter-field performance model is calculated for each subset. An intra-field component of a performance model is calculated with time as a third dimension. The time-indexed performance model is used to determine intra-field corrections for a variety of product exposures having product layouts and product exposure sequences different to the calibration fields, based on time and other a variables of the product layout and product exposure sequence.

Abstract: A lithographic apparatus includes a substrate table, a post-exposure handling module, a substrate handling robot and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure handling module is configured to handle the substrate post-exposure. The substrate handling robot is configured to transfer the substrate from the substrate table along a substrate unloading path into the post-exposure handling module. The drying station is configured to actively remove liquid from a surface of the substrate. The drying station is located in the substrate unloading path. The drying station is located in the post-exposure handling module. The post-exposure handling module may be a substrate handler.

Abstract: Disclosed is a method of measuring a target, an associated substrate, a metrology apparatus and a lithographic apparatus. In one arrangement the target comprises a layered structure. The layered structure has a first target structure in a first layer and a second target structure in a second layer. The method comprises illuminating the target with measurement radiation. Scattered radiation formed by interference between plural predetermined diffraction orders is detected. The predetermined diffraction orders are generated by diffraction of the measurement radiation from the first target structure and are subsequently diffracted from the second target structure. A characteristic of the lithographic process is calculated using the detected scattered radiation formed by the interference between the predetermined diffraction orders.

Abstract: A lithographic apparatus includes a base frame, an illumination system configured to condition a radiation beam and supported by the base frame, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, a positioning device configured to position the substrate table, the positioning device being supported by the base frame, a sensor configured to sense a vibration caused by a torque exerted on the base frame, and an actuator configured to exert a force on the illumination system or the base frame, in response to the sensed vibration, in order to at least partly dampen the vibration.

Abstract: A method of forming at least one lithography feature, the method including: providing at least one lithography recess on a substrate, the or each lithography recess having at least one side-wall and a base, with the at least one side-wall having a width between portions thereof; providing a self-assemblable block copolymer having first and second blocks in the or each lithography recess; causing the self-assemblable block copolymer to self-assemble into an ordered layer within the or each lithography recess, the ordered layer including at least a first domain of first blocks and a second domain of second blocks; causing the self-assemblable block copolymer to cross-link in a directional manner; and selectively removing the first domain to form lithography features of the second domain within the or each lithography recess.

Abstract: A method for calculating electromagnetic scattering properties of a finite periodic structure having a direction of periodicity is disclosed. The method numerically calculates electromagnetic scattering properties using spatial discretization in the direction of periodicity and numerically calculates electromagnetic scattering properties using spectral discretization in a direction orthogonal to the direction of periodicity.

Abstract: A method including: determining recipe consistencies between one substrate measurement recipe of a plurality of substrate measurement recipes and each other substrate measurement recipe of the plurality of substrate measurement recipes; calculating a function of the recipe consistencies; eliminating the one substrate measurement recipe from the plurality of substrate measurement recipes if the function meets a criterion; and reiterating the determining, calculating and eliminating until a termination condition is met. Also disclosed herein is a substrate measurement apparatus, including a storage configured to store a plurality of substrate measurement recipes, and a processor configured to select one or more substrate measurement recipes from the plurality of substrate measurement recipes based on recipe consistencies among the plurality of substrate measurement recipes.

Abstract: A difficulty of contamination interfering with a grid plate positional measurement system is addressed. In one embodiment contamination is prevented from coming into contact with the grating or the sensor. In an embodiment, surface acoustic waves are used to detach contamination from a surface of the grating or sensor.

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

Abstract: A method including: obtaining a measurement of a metrology target on a substrate processed using a patterning process, the measurement having been obtained using measurement radiation; and deriving a parameter of interest of the patterning process from the measurement, wherein the parameter of interest is corrected by a stack difference parameter, the stack difference parameter representing an un-designed difference in physical configuration between adjacent periodic structures of the target or between the metrology target and another adjacent target on the substrate.

Abstract: A wavefront of a light beam that exits an acousto-optic material is estimated; a control signal for an acousto-optic system that includes the acousto-optic material is generated, the control signal being based on the estimated wavefront of the light beam; and the control signal is applied to the acousto-optic system to generate a frequency-chirped acoustic wave that propagates in the acousto-optic material, the frequency-chirped acoustic wave forming a transient diffractive element in the acousto-optic material, an interaction between the transient diffractive element and the light beam adjusting the wavefront of the light beam to compensate for a distortion of the wavefront of the light beam, the distortion of the wavefront being at least partially caused by a physical effect in the acousto-optic material.

Abstract: A method of aligning a pair of complementary diffraction patterns having a first complementary diffraction pattern and a second complementary diffraction pattern, the pair of complementary diffraction patterns obtained from performance of a metrology process on a structure formed by a lithographic process. The method includes performing at least a fine alignment stage to align the pair of complementary diffraction patterns. The alignment stage includes: interpolating measured values of the first complementary diffraction pattern over at least a portion of a detector area; and minimizing a residual between measured values in the second complementary diffraction pattern and corresponding interpolated values from the interpolation of the first complementary diffraction pattern, by one or both of translation and rotation of the second complementary diffraction pattern.

Abstract: A measurement method comprising using multiple radiation poles to illuminate a diffraction grating on a mask at a mask side of a projection system of a lithographic apparatus, coupling at least two different resulting diffraction orders per illumination pole through the projection system, using the projection system to project the diffraction orders onto a grating on a wafer such that a pair of combination diffraction orders is formed by diffraction of the diffraction orders, coupling the combination diffraction orders back through the projection system to detectors configured to measure the intensity of the combination diffraction orders, and using the measured intensity of the combination diffraction orders to measure the position of the wafer grating.

Abstract: A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured to preferentially absorb radiation having the given wavelength; wherein the absorbing and reflective regions are arranged to form a patterned radiation beam reflected from the marker when illuminated with radiation, and wherein the reflective regions comprise a roughened reflective surface, the roughened reflective surface being configured to diffuse radiation reflected from the reflective regions, and wherein the roughened reflective surface has a root mean squared roughness of about an eighth of the given wavelength or more.

Abstract: A control system configured to control a parameter of a dynamic system, wherein the parameter depends on an output signal. The control system comprises a set-point generator and a feedforward, wherein the set-point generator is arranged to provide a set-point signal to the feedforward. The feedforward is arranged to provide the output signal based on the set-point signal, wherein the feedforward is arranged to perform a non-linear operation on the set-point signal. The non-linear operation is based on a non-linear functional relationship between the output signal and the parameter.

Abstract: An illumination system (IL) for a lithographic apparatus comprising a polarization adjustment apparatus (15) arranged to receive linearly polarized radiation, the polarization adjustment apparatus comprising regions which are configured to rotate the polarization orientation by different amounts, a directing apparatus (6) operable to direct the radiation through one or more regions of the polarization adjustment apparatus, a controller (CN) configured to control the directing apparatus so as to control which of the one or more regions of the polarization adjustment apparatus radiation is directed through, wherein the controller is configured to limit which of the regions radiation is directed through to one or more regions which rotate the orientation of the linear polarization by substantially the same amount, and a diffuser configured to receive radiation output from the polarization adjustment apparatus and increase a range of angles at which the radiation propagates while substantially conserving the pola