Patents Assigned to ATI
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Patent number: 8004617Abstract: A device for rapidly instituting an active mode of a digital-television enabled system, the system including a first, volatile memory configured to load and store software instructions, includes: an input configured to receive first digital audio and video information; a first output configured to convey second audio and information toward a display regarding the first audio and video information; at least one second output configured to convey commands to, and receive information from, the first memory; and a processor configured to perform functions in accordance with software instructions stored in first and second memories and to cause the first memory to load software instructions for provision to the processor such that first instructions for processing at least one of the first audio information and the first video information are loaded and stored by the first memory with a higher priority than second instructions for performing other functionality.Type: GrantFiled: August 30, 2006Date of Patent: August 23, 2011Assignee: ATI Technologies ULCInventors: Ilya Klebanov, Kwok P. Hui
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Patent number: 8005570Abstract: A robotic tool changer having a master unit and a tool unit adapted to be coupled together. Movably mounted in the master unit of the robotic tool changer is a piston that is movable between locked and unlocked positions. The piston includes a contact area having an unlocking surface, a failsafe surface and a locking surface. Also provided is a series of rolling members contained within a retention area that are actuated by the piston to lock the master unit to the tool unit. For example, the piston engages the rolling members and urges them into a locked relationship with a bearing race that forms a part of the tool unit. To prevent the inadvertent or accidental movement of the piston from the locked position to the unlocked position, the piston is provided with a retarding surface generally disposed between the locking surface and the unlocking surface on the piston for retarding the movement of the piston as the piston moves from the locked position to the unlocked position.Type: GrantFiled: March 14, 2006Date of Patent: August 23, 2011Assignee: ATI Industrial AutomationInventors: Michael L. Gloden, Leonard Aaron Odham, Mark D. Bordeaux
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Publication number: 20110195269Abstract: Processes and methods related to producing, processing, and hot working alloy ingots are disclosed. An alloy ingot is formed including an inner ingot core and an outer layer metallurgically bonded to the inner ingot core. The processes and methods are characterized by a reduction in the incidence of surface cracking of the alloy ingot during hot working.Type: ApplicationFiled: February 5, 2010Publication date: August 11, 2011Applicant: ATI Properties, Inc.Inventor: Ramesh S. Minisandram
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Publication number: 20110195270Abstract: Processes and methods related to processing and hot working alloy ingots are disclosed. A metallic material layer is deposited onto at least a region of a surface of an alloy ingot before hot working the alloy ingot. The processes and methods are characterized by a reduction in the incidence of surface cracking of the alloy ingot during hot working.Type: ApplicationFiled: February 5, 2010Publication date: August 11, 2011Applicant: ATI Properties, Inc.Inventors: Urban J. De Souza, Robin M. Forbes Jones, Richard L. Kennedy, Christopher M. O'Brien
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Patent number: 7996591Abstract: A computing device that allows for a flexible allocation of bandwidth among peripheral devices using a peripheral bus is disclosed. The computing device includes a peripheral bus and at least two slots. The computing device may be used with a single peripheral card or multiple peripheral cards. In a multi-card configuration the invention allows the bandwidth on the peripheral bus to be shared by all the cards. In a single-card configuration, the computing device allows available bandwidth on the peripheral bus to be used by a single card. The device is particularly useful with PCI express compliant expansion cards, such as graphics adapters.Type: GrantFiled: April 21, 2009Date of Patent: August 9, 2011Assignee: ATI Technologies ULCInventors: Yaoqiang (George) Xie, Roumen Saltchev
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Patent number: 7996863Abstract: A method and apparatus for display of a digital video signal includes a demodulator capable of receiving a major channel of the digital video signal. The major channel of the digital video signal includes one or more minor channels, wherein the minor channels are specific and separate channels of broadcast information. The method and apparatus for display of a digital video signal further includes decoders coupled to the demodulator, wherein the decoders receive the minor channels disposed within the major channel. The decoders thereupon generate minor channel video signals, wherein the minor channel video signal includes the video information for each associated channel. The method and apparatus further includes receiving the incoming video signals and format the video signals for simultaneous display of active video from multiple channels. A display configurator provides the minor channel video signals to an output display, to actively display the minor channels.Type: GrantFiled: May 13, 2004Date of Patent: August 9, 2011Assignee: ATI Technologies ULCInventor: Matthew Wiltheiler
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Patent number: 7994044Abstract: Methods and apparatus to inhibit cracks and delaminations in a semiconductor chip solder bump are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first dielectric layer over a first conductor structure of a semiconductor chip and forming a first opening in the first dielectric layer to expose at least a portion of the conductor structure. The first opening defines an interior wall that includes plural protrusions. A solder structure is coupled to the first conductor structure such that a portion of the solder structure is positioned in the first opening.Type: GrantFiled: September 3, 2009Date of Patent: August 9, 2011Assignee: ATI Technologies ULCInventors: Roden R. Topacio, Neil McLellan
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Publication number: 20110186190Abstract: A thermal mechanical treatment method includes hot working a precipitation hardening martensitic stainless steel, quenching the stainless steel, and aging the stainless steel. According to certain embodiments, the thermal mechanical treatment does not include solution heat treating the stainless steel prior to aging or cryogenically cooling the stainless steel. An article includes a precipitation hardening martensitic stainless steel having a process history that includes hot working the stainless steel, quenching the stainless steel, and aging the stainless steel. According to certain embodiments, the process history does not include solution heat treating the stainless steel prior to aging or cryogenically cooling the stainless steel.Type: ApplicationFiled: March 15, 2011Publication date: August 4, 2011Applicant: ATI Properties, Inc.Inventors: Wei-Di Cao, Erin T. McDevitt
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Publication number: 20110180188Abstract: Certain embodiments of a method for increasing the strength and toughness of a titanium alloy include plastically deforming a titanium alloy at a temperature in an alpha-beta phase field of the titanium alloy to an equivalent plastic deformation of at least a 25% reduction in area. After plastically deforming the titanium alloy in the alpha-beta phase field, the titanium alloy is not heated to or above the beta transus temperature of the titanium alloy. After plastic deformation, the titanium alloy is heat treated at a heat treatment temperature less than or equal to the beta transus temperature minus 20° F. (11.1° C.).Type: ApplicationFiled: January 22, 2010Publication date: July 28, 2011Applicant: ATI Properties, Inc.Inventor: David J. Bryan
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Patent number: 7985304Abstract: A nickel-base alloy having favorable toughness and thermal fatigue resistance comprises, in weight percentages based on total alloy weight: 9 to 20 chromium; 25 to 35 iron; 1 to 3 molybdenum; 3.0 to 5.5 niobium; 0.2 to 2.0 aluminum; 0.3 to 3.0 titanium; less than 0.10 carbon; no more than 0.01 boron; nickel; and incidental impurities. Also disclosed are die casting dies, other tooling, and other articles of manufacture made from or comprising the nickel-base alloy.Type: GrantFiled: April 19, 2007Date of Patent: July 26, 2011Assignee: ATI Properties, Inc.Inventors: Wei-Di Cao, Richard L. Kennedy, Michael M. Antony, John W. Smythe
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Patent number: 7985621Abstract: A method of packaging a plurality of semiconductor chips comprises: providing a substrate panel having a first coefficient of thermal expansion (CTE); providing a carrier having a second CTE that is less than the first CTE; heating the substrate panel and the carrier to first and second elevated temperatures respectively; mounting the substrate panel at about the first elevated temperature to the carrier, the carrier being at said second elevated temperature, to provide a connection between the carrier and the substrate panel; and cooling the carrier and the substrate panel from the first and second elevated temperatures thereby putting the substrate panel into tension in at least one direction. A stiffener panel may be affixed to the substrate panel and heated to an elevated temperature and while the substrate panel is heated to an elevated temperature. A plurality of dies may be mounted and electrically connected to the substrate panel.Type: GrantFiled: August 31, 2006Date of Patent: July 26, 2011Assignee: ATI Technologies ULCInventors: Vincent K. Chan, Neil McLellan, Roden Topacio
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Patent number: 7986580Abstract: A circuit includes a memory interface control circuit and a self-refresh adjustable impedance driver circuit having at least one adjustable impedance circuit. The memory interface control circuit selectively provides an impedance control signal based on memory self-refresh information. The self-refresh adjustable impedance driver circuit adjusts an impedance value of the adjustable impedance circuit in response to the impedance control signal. In addition, the self-refresh adjustable impedance driver circuit provides a memory interface signal based on the memory self-refresh information.Type: GrantFiled: December 19, 2008Date of Patent: July 26, 2011Assignee: ATI Technologies ULCInventors: James Fry, George Guthrie
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Patent number: 7981521Abstract: Maraging steel compositions, methods of forming the same, and articles formed therefrom comprising, by weight, 15.0 to 20.0% Ni, 2.0 to 6.0% Mo, 3.0 to 8.0% Ti, up to 0.5% Al, the balance Fe and residual impurities. The composition may be a first layer of a composite plate, and may have a second layer deposited on the first layer, the second layer having a composition comprising, by weight, 15.0 to 20.0% Ni, 2.0 to 6.0% Mo, 1.0 to 3.0 Ti, up to 0.5% Al, the balance Fe and residual impurities. The first layer may have a hardness value ranging from 58 to 64 RC, and the second layer may have a hardness value ranging from 48 to 54 RC. The first layer may be formed employing powdered metallurgical techniques. Articles formed from the compositions include armored plate.Type: GrantFiled: August 29, 2006Date of Patent: July 19, 2011Assignee: ATI Properties, Inc.Inventors: Ronald E. Bailey, Thomas R. Parayil, Timothy M. Hackett, Tong C. Lee
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Patent number: 7981561Abstract: Various embodiments relate to interconnects for solid oxide fuel cells (“SOFCs”) comprising ferritic stainless steel and having at least one via that when subjected to an oxidizing atmosphere at an elevated temperature develops a scale comprising a manganese-chromate spinel on at least a portion of a surface thereof, and at least one gas flow channel that when subjected to an oxidizing atmosphere at an elevated temperature develops an aluminum-rich oxide scale on at least a portion of a surface thereof. Other embodiments relate to interconnects comprising a ferritic stainless steel and having a fuel side comprising metallic material that resists oxidation during operation of the SOFCs, and optionally include a nickel-base superalloy on the oxidant side thereof. Still other embodiments relate to ferritic stainless steels adapted for use as interconnects comprising ?0.1 weight percent aluminum and/or silicon, and >1 up to 2 weight percent manganese. Methods of making interconnects are also disclosed.Type: GrantFiled: June 28, 2005Date of Patent: July 19, 2011Assignee: ATI Properties, Inc.Inventors: James M. Rakowski, Charles P. Stinner
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Patent number: 7978194Abstract: A method and apparatus for hierarchical Z buffering stenciling includes comparing an input tile Z value range with a hierarchical Z value range and a stencil code. The method and apparatus also updates the hierarchical Z value range and stencil code in response the comparison and determines whether to render a plurality of pixels within the input tile based on the comparison of the input tile Z value range with the hierarchical Z value range and stencil code. In determining whether to render the tile, a stencil test and a hierarchical Z value test is performed. If one of the test fails, the tile is killed as it is determined that the pixels are not visible in the graphical output. If the stencil test passes and the hierarchical Z test passes, the pixels within the tile are rendered, as it is determined that the pixels may be visible.Type: GrantFiled: March 2, 2004Date of Patent: July 12, 2011Assignee: ATI Technologies ULCInventors: Larry D. Seiler, Stephen L. Morein
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Publication number: 20110164065Abstract: A method includes displaying, on a single large surface display, a first moveable and second fixed portion of a visual test object. The first portion is displayed on the display to be configured and the second portion is displayed on at least one neighboring display, and are shown in a relative orientation adjacent to a common border formed by a first bezel of the display to be configured and a second bezel of the at least one neighboring display, and any space in between. The method obtains bezel compensation configuration information in response to input aligning the first portion with the second portion. A user may provide input by moving the first portion to align it with the second portion so that a third portion of the visual test object appears hidden by the common border. The object therefore appears aligned “behind” the bezel.Type: ApplicationFiled: January 6, 2010Publication date: July 7, 2011Applicant: ATI TECHNOLOGIES ULCInventors: Elena Mate, Lawrence Kwak
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Patent number: 7971694Abstract: A shaft system for an automatic transmission includes a stator support shaft having an internal axial bore for receiving an input shaft, a forward engagement portion for engaging a stator of a torque converter of the automatic transmission and an integral stator support flange extending radially outward for engaging a stator support of the automatic transmission and transferring to the stator support substantially all of a torque load imposed on the stator support shaft by the stator. The stator support flange includes at least one oil flow bore positioned therein to supply oil between different components of the transmission.Type: GrantFiled: April 21, 2008Date of Patent: July 5, 2011Assignee: ATI Performance Products, Inc.Inventor: James C. Beattie
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Patent number: 7973408Abstract: Various semiconductor chip passivation structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a polymeric passivation layer to a side of a semiconductor chip. The side of the semiconductor chip includes plural conductor pads. Plural openings are formed in the polymeric passivation layer to expose the plural conductor pads. Plural conductor structures are formed on the plural conductor pads.Type: GrantFiled: August 24, 2010Date of Patent: July 5, 2011Assignee: ATI Technologies ULCInventor: Roden R. Topacio
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Patent number: 7974096Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.Type: GrantFiled: August 17, 2006Date of Patent: July 5, 2011Assignee: ATI Technologies ULCInventor: Gamal Refai-Ahmed
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Publication number: 20110157302Abstract: A three-dimensional processing circuit includes a multi-stream 3D image sender that produces packet based multi-stream information that includes a first stream that has first eye view information, such as left eye frame information and a second stream that includes corresponding second eye view information, such as right eye frame information, for display on a single display, wherein each stream comprises a same object viewed from differing view perspectives. In one example, the multi-stream information is communicated as packetized data over a single cable, for example wherein a packet includes both the left eye and right eye information. In addition, the encoder provides as part of the multi-stream information, control information indicating that the first and second streams are for a single display. In one example, the multi-streams are communicated concurrently so that the single display can display stereoscopic left and right eye frame information.Type: ApplicationFiled: January 28, 2010Publication date: June 30, 2011Applicant: ATI Technologies ULCInventor: David Glen