Abstract: The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising steps (A) to (C), wherein step (B) comprises a contacting with a pre-treatment composition comprising one or more than one fluorine-free surface-active compound, and step (C) comprises a contacting with an etching composition comprising one or more than one manganese species, wherein after step (B) and prior to step (C) no rinsing is applied, and the etching composition is substantially free of, preferably does not comprise, fluorine-containing surface-active compounds.

Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

Abstract: A method for depositing a zinc-nickel alloy on a substrate, including: (a) providing the substrate, (b) providing an aqueous zinc-nickel deposition bath as catholyte in a compartment, wherein the compartment includes an anode and anolyte, the anolyte being separated from catholyte by a membrane, and the catholyte includes nickel ions, complexing agent, zinc ions, (c) depositing zinc-nickel alloy onto the substrate, wherein after step (c) nickel ions have lower concentration than before step (c), (d) rinsing the zinc-nickel coated substrate in water, obtaining a rinsed zinc-nickel coated substrate and rinse water including a portion of the complexing agent and nickel ions, wherein (i) a portion of rinse water and/or a portion of catholyte is treated in a first treatment compartment to separate water from the complexing agent and the nickel ions, (ii) returning the separated complexing agent to the catholyte, and (iii) adding nickel ion to the catholyte.

Abstract: The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising the steps (A) to (C), wherein step (C) is an etching step including a contacting with an etching composition. The etching composition comprises permanganate ions and phosphoric acid, each in specifically defined concentration ranges.

Abstract: The invention relates to an aqueous alkaline cleaner solution for glass filler removal comprising: (a) at least one non-ionic surfactant selected from the group consisting of saturated branched or unbranched C5 to C12 carboxylic acid or salt thereof, wherein the concentration of the (a) at least one surfactant is from 0.9 to 1.7 g/L; (b) at least one surfactant selected from the group consisting of saturated branched or unbranched C5 to C12 alkyl having a negatively charged group selected from sulfate, sulfite, sulfonate, phosphate, phosphite and carbonate, and saturated C3-C8 alkyl amino carboxylate; (c) at least one compound having at least one hydroxyl group and at least one C—O—C group selected from the group consisting of alkoxylated C5-C12 alkanol and glycosidic C5-C12 alkanol; and (d) alkali metal hydroxide, wherein the concentration of the (d) alkali metal hydroxide is from 65 to 200 g/L; and a method for use.

Abstract: The present invention refers to a method for depositing a chromium-comprising passivation layer on a zinc-comprising coating, wherein the zinc-comprising coating additionally comprises Fe, Sn, Mn, or mixtures thereof. The method utilizes a passivation composition comprising 0.001 mg/L to 200 mg/L, based on the total volume of the passivation composition, of at least one corrosion-inhibiting agent selected from the group consisting of unsubstituted azole compounds, substituted azole compounds, unsubstituted aliphatic organic acids with at least one mercapto-group, substituted aliphatic organic acids with at least one mercapto-group, salts, and mixtures thereof.

Abstract: The present invention refers to an electroplating composition for plating a chromium coating on a substrate, the composition comprising: (i) a source of hexavalent chromium; (ii) one or more than one betaine comprising a quaternary nitrogen and/or salts thereof; and (iii) one or more than one poly-organosiloxane.

Abstract: The present invention relates to a very specific electroplating bath for depositing a black chromium layer, and a respective method for electroplating such a layer. The electroplating bath comprises two specific groups of compounds defined as (D) and (E), present in a particularly defined molar ratio ranging from 0.9 to 2.65, based on (E):(D). The black chromium layer is excellently suited for decorative purposes.

Abstract: The present invention relates to a black plated substrate comprising a base-substrate and deposited thereon a layer stack, wherein the layer stack comprises a black chromium plating layer comprising on its surface a conversion layer having a depth of 30 nm or more, characterized in that the conversion layer does not comprise metallic chromium or comprises metallic chromium only up to 2 at.-%, based on the element chromium and the total number of chromium atoms in the conversion layer.

Abstract: The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising steps (A) to (C), wherein step (B) comprises a contacting with a pre-treatment composition comprising one or more than one fluorine-free surface active compound, and step (C) comprises a contacting with an etching composition comprising chromic acid, wherein after step (B) and prior to step (C) no rinsing is applied, and the etching composition is substantially free of fluorine-containing surface active compounds.

Abstract: The present invention relates to an aqueous passivation solution having a pH in the range from 5.4 to 7.2, the solution including trivalent chromium ions, and formate anions and/or oxalate anions as complexing agents for said trivalent chromium ions, in which the trivalent chromium ions with respect to all formate anions together with all oxalate anions form a molar ratio in the range from 1:15 to 1:400.

Abstract: The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.

Abstract: The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

Abstract: The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) wherein each X is independently an alkanediyl group; R1, R2, R3 and each R4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10. The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.

Abstract: Cleaning solution for cleaning and/or wetting metal surfaces, comprising at least one acid, a first surfactant, which is an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ?25° C., a second surfactant, which is selected from the group consisting of i) an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of ?30° C., ii) an alkyl-polyethyleneglycol-ether having a cloud point of ?45° C. wherein the cloud points are determined according to European Standard EN 1890:2006, item 8.2 of German Version, with the modification that 10 wt % H2SO4 is used as solvent and that the concentration of the surfactant is 1000 mg/L.

Abstract: A method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of (i) providing a substrate comprising the surface, (ii) providing an aqueous passivation solution comprising trivalent chromium ions, and one or more than one species of carboxylic acid residue anions, (iii) contacting the substrate with the passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto the surface, wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.

Abstract: The present invention refers to a substrate holder loading device to be used in a clean room and a clean room treatment device containing such substrate holder loading device. Furthermore, the present invention refers to a method of loading a substrate holder with a first substrate, more preferably with a first and a second substrate.

Abstract: Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating in which the electroplating bath includes at least one compound having the general formula (1) and/or a salt thereof wherein R1?C1-C18 hydrocarbon moiety comprising a SO3? group, a carboxylic group, or an aromatic and/or a heteroaromatic group; R2?NR3R4 moiety, or OR5 moiety, or cyclic NR6 moiety, wherein R3, R4, R5=hydrogen, or C1-C18 aliphatic hydrocarbon moiety, or C1-C18 hydrocarbon moiety comprising an aromatic and/or a heteroaromatic group, wherein R3, R4 and R5 are identical or different; R6?C3-C8 hydrocarbon moiety, or C3-C8 hydrocarbon moiety wherein at least one carbon atom is substituted by a heteroatom; n=1-3; and wherein the electroplating bath further comprises at least one acetylenic compound and chloral hydrate.

Abstract: An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): in which Z1 and Z2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z1 and Z2 is not hydrogen; and in which R1, R2, R3 and R4 are: i. R1, R2, R3 and R4 are hydrogen; or ii. R1 with R2 form together an aromatic ring, R3 and R4 are hydrogen; or iii. R3 with R4 form together an aromatic ring, R1 and R2 are hydrogen; or iv. both R1 with R2 and R3 with R4 form together an aromatic ring, respectively.