Abstract: To achieve efficient stripping of organic coatings from sensitive substrate without affecting the substrate surface, a novel non-aqueous stripping composition and method are provided. The stripping composition comprises: A. at least one high-boiling solvent selected from the group, consisting of alcohols having general chemical formula R—OH, wherein R is a C4-C30 hydrocarbon group, wherein the high-boiling solvent has a boiling point of at least 100° C.; B—at least one high-boiling co-solvent selected from the group, consisting of high-boiling glycols, glycol ethers and amine compounds, wherein the high-boiling co-solvent has a boiling point of at least 100° C.; and C—at least one pH-active agent either selected from the group, consisting of acid compounds or selected from the group, consisting of hydroxide compounds.

Abstract: The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

Abstract: A substrate holder for vertical galvanic metal deposition on a substrate, comprising a first substrate holder part and a second substrate holder part, wherein both said parts comprise an inner metal comprising part and an outer non-metallic part in which the substrate holder further comprises a hanging element in each substrate holder part, a first sealing element in each substrate holder part, a second sealing element between the inner metal comprising part and the outer non-metallic part of the substrate holder, a fastening system for detachably fastening both substrate holder parts to each other, a first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and a second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.

Abstract: This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.

Abstract: To achieve tin deposits being largely free of pressure induced whiskers, a method of depositing a tin layer on a metal substrate is devised, wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous alloy underlayer on at least one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous alloy underlayer by depositing said tin layer comprising using a pulse plating method.

Abstract: The present invention is to provide a chrome-plated part having a corrosion resistance in normal and specific circumstances and not requiring additional treatments after chrome plating, and to provide a manufacturing method of such a chrome-plated part. The chrome-plated part 1 includes: a substrate 2; a bright nickel plating layer 5b formed over the substrate 2; a noble potential nickel plating layer 5a formed on the bright nickel plating layer 5b. An electric potential difference between the bright nickel plating layer 5b and the noble potential nickel plating layer 5a is within a range from 40 mV to 150 mV. The chrome-plated part 1 further includes: a trivalent chrome plating layer 6 formed on the noble potential nickel plating layer 5a and having at least any one of a microporous structure and a microcrack structure.

Abstract: The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.

Abstract: The present invention relates to a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

Abstract: A water-based composition for post-treatment of metal surfaces, preferably a silver or silver alloy surface, including: an alkanethiol an anionic, cationic, non-ionic, amphoteric or zwitterionic surfactant with a HLB value of 12 to 18, a compound of the general formula I: wherein R1 is —H, —CH3, —C2H5, —(C2H4O)p—H, —(C2H4O)p—CH3, —(C2H4O)p—CH(CH3)2, —(C2H4)p—C(CH3)3, wherein p is 1 to 20, R2 is H, or CH3 n is an integer in the range of 0 to 3, m is an integer in the range of 0 to 2.

Abstract: The present invention is to provide a chrome-plated part having a corrosion resistance in normal and specific circumstances and not requiring additional treatments after chrome plating, and to provide a manufacturing method of such a chrome plated part. The chrome-plated part 1 includes: a substrate 2; a bright nickel plating layer 5b formed over the substrate 2; a noble potential nickel plating layer 5a formed on the bright nickel plating layer 5b. An electric potential difference between the bright nickel plating layer 5b and the noble potential nickel plating layer 5a is within a range from 40 mV to 150 mV. The chrome-plated part 1 further includes: a trivalent chrome plating layer 6 formed on the noble potential nickel plating layer 5a and having at least any one of a microporous structure and a microcrack structure.

Abstract: This invention concerns a substrate holder reception apparatus (1) for clamping a substrate holder (11) in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder (11) and releasing the substrate holder (11), comprising at least one substrate holder connection device (21) for mechanical aligning and electrically contacting of the substrate holder (11), wherein the substrate holder connection device (21) comprises a separate substrate holder alignment device (211) for aligning the substrate holder (11) with the substrate holder connection device (21) in an alignment direction, and a separate substrate holder contact device (212) for electrically contacting the substrate holder (11). Further, the invention concerns an electrochemical treatment apparatus (5) comprising the substrate holder reception apparatus (1).

Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

Abstract: A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein: n is an integer from 1 to 100; R1 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; R2 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; and each R1 and R2 in a —(CHR1—CHR2—O)— moiety is selected independently of each R1 and R2 in another —(CHR1—CHR2—O)— moiety.

Abstract: The present invention concerns a method for increasing the adhesion between a chromium surface and a lacquer wherein said chromium surface is contacted with an aqueous solution comprising at least one phosphorous compound according to formulae R1—P(O)(OR2)(OR3) 1 and R1—O—P(O)(OR2)(OR3) 2 wherein R1 is a C1 to C12 alkyl group, linear, branched or cyclic comprising at least one polar residue and R2 and R3 are independently selected from the group consisting of hydrogen, lithium, sodium, potassium, ammonium and C1 to C4 alkyl while passing an external electrical current through said substrate and at least one anode wherein said substrate serves as the cathode.

Abstract: The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes.

Abstract: The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.

Abstract: An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

Abstract: A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 ?m.

Abstract: The present invention concerns a method for increasing the adhesion between a chromium surface and a lacquer wherein said chromium surface is contacted with an aqueous solution comprising at least one phosphorous compound according to formulae R1—P(O)(OR2R3) 1 and R1—O—P(O)(OR2R3) 2 wherein R1 is a C1 to C12 alkyl group, linear, branched or cyclic comprising at least one polar residue and R2 and R3 are independently selected from the group consisting of hydrogen, lithium, sodium, potassium, ammonium and C1 to C4 alkyl while passing an external electrical current through said substrate and at least one anode wherein said substrate serves as the cathode.

Abstract: The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.