Patents Assigned to AyDeeKay LLC
  • Patent number: 11239845
    Abstract: An integrated circuit is described. This integrated circuit may include an input connector, coupled to a signal line, that conveys an input signal corresponding to encoded data, where the encoded data is encoded using a BMC, and the input signal may have different rise times and fall times. Moreover, the integrated circuit may include a recovery circuit, coupled to the input connector, that outputs the data based at least in part on a first threshold and a second threshold, where the output data may include data values with equal half-bit periods and variable frequency. Note that the recovery circuit may implement a state machine corresponding to the data.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: February 1, 2022
    Assignee: AyDeeKay LLC
    Inventor: Jim Wilshire
  • Publication number: 20210326289
    Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
    Type: Application
    Filed: May 8, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee
  • Publication number: 20210326277
    Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
    Type: Application
    Filed: May 8, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee
  • Publication number: 20210326073
    Abstract: A system that includes a first die with a central processing unit (CPU) and a second die electrically coupled to the first die by die-to-die interconnects is described. During operation, the first die: provides, to the second die, a set of predefined wake-up events; provides, to the second die, a message that transitions power-management control of the first die to the second die; and transitions the first die from a first operating mode to a second operating mode that has lower power consumption than that of the first operating mode. Then, the second die: determines an occurrence of a predefined wake-up event based at least in part on the set of predefined wake-up events; and provides, to the first die, information that initiates a transition of the first die from the second operating mode to the first operating mode.
    Type: Application
    Filed: May 8, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee
  • Publication number: 20210326489
    Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
    Type: Application
    Filed: May 8, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee
  • Publication number: 20210326288
    Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
    Type: Application
    Filed: May 8, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee
  • Publication number: 20210326287
    Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee
  • Publication number: 20210326283
    Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
    Type: Application
    Filed: May 8, 2021
    Publication date: October 21, 2021
    Applicant: AyDeeKay LLC dba Indie Semiconductor
    Inventor: Scott David Kee