Abstract: An analog-to-digital converter (ADC) is described. This ADC includes a conversion circuit with multiple bit-conversion circuits. During operation, the ADC may receive an input signal. Then, the conversion circuit may asynchronously perform successive-approximation-register (SAR) analog-to-digital conversion of the input signal using the bit-conversion circuits, where the bit-conversion circuits to provide a quantized representation of the input signal. For example, the bit-conversion circuits may asynchronously and sequentially perform the SAR analog-to-digital conversion to determine different bits in the quantized representation of the input signal. Moreover, the ADC may selectively perform self-calibration of a global delay of the bit-conversions circuits. Note that the timing self-calibration may be iterative and subject to a constraint that a maximum conversion time is less than a target conversion time.

Abstract: An integrated circuit may include a full-scale reference generation circuit that corrects for variation in the gain or full scale of a set of interleaved analog-to-digital converters (ADCs). Notably, the full-scale reference generation circuit may provide a given full-scale or reference setting for a given interleaved ADC, where the given full-scale setting corresponds to a predefined or fixed component and a variable component (which may specify a given full-scale correction for a given full scale). For example, the full-scale reference generation circuit may include a full-scale reference generator replica circuit that outputs a fixed current corresponding to the fixed component. Furthermore, the full-scale reference generation circuit may include a full-scale reference generator circuit that outputs a first voltage corresponding to the given full-scale setting based at least in part on the fixed current and a variable current that, at least in part, specifies the given full-scale correction.

Abstract: An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.

Abstract: Analog-to-digital converters (ADCs) with a high sampling rate and larger spurious-free dynamic range (SFDR) in the spectral domain are used in many applications, including, but not limited to, range finders, meteorology, spectroscopy, and/or coherent medical imaging. Circuit techniques for time-interleaving a set of low-sampling-rate sub-ADCs into a higher sampling-rate ADC with a larger SFDR than existing approaches are described. In one embodiment, the circuit techniques add a small number of additional units or sub-ADCs. This change in architecture enables a dynamic-selection procedure to time-interleave the set of sub-ADCs in such a way that mismatch-related non-idealities of the constituent sub-ADCs are spread in the frequency domain into a noise-like spectral shape in order to prevent the creation of spurious tones, which would otherwise deleteriously impact the SFDR.

Abstract: An integrated circuit is described. This integrated circuit may include an input connector, coupled to a signal line, that conveys an input signal corresponding to encoded data, where the encoded data is encoded using a BMC, and the input signal may have different rise times and fall times. Moreover, the integrated circuit may include a recovery circuit, coupled to the input connector, that outputs the data based at least in part on a first threshold and a second threshold, where the output data may include data values with equal half-bit periods and variable frequency. Note that the recovery circuit may implement a state machine corresponding to the data.

Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.

Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.

Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.

Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.

Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.

Abstract: A system that includes a first die with a central processing unit (CPU) and a second die electrically coupled to the first die by die-to-die interconnects is described. During operation, the first die: provides, to the second die, a set of predefined wake-up events; provides, to the second die, a message that transitions power-management control of the first die to the second die; and transitions the first die from a first operating mode to a second operating mode that has lower power consumption than that of the first operating mode. Then, the second die: determines an occurrence of a predefined wake-up event based at least in part on the set of predefined wake-up events; and provides, to the first die, information that initiates a transition of the first die from the second operating mode to the first operating mode.

Abstract: Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.