Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an opening in a ground plane, thereby electrically connecting the ground plane and the pad.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with and integral with the bumped terminal and extends laterally beyond the bumped terminal and the metal filler, and the metal filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

Abstract: A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar, providing a second semiconductor chip assembly that includes a second chip, a second conductive trace and a second encapsulant, wherein the second encapsulant includes a second aperture, and then positioning the first and second assemblies such that the first assembly overlaps the second assembly and the first metal pillar extends into the second aperture.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with the bumped terminal and extends laterally beyond the bumped terminal and the metal pillar, and the metal pillar contacts and extends vertically beyond the bumped terminal.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line and the bumped terminal, then forming an encapsulant, and then etching the metal base to form a metal pillar that contacts the bumped terminal.

Abstract: A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically attaching a semiconductor chip to the routing line and the pillar wherein the chip includes a conductive pad, the routing line extends laterally from the pillar towards the chip and the chip and the pillar extend vertically beyond the routing line in the same direction, forming an encapsulant wherein the chip and the pillar are embedded in the encapsulant, and forming a connection joint that electrically connects the routing line and the pad.

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, electrically connecting a conductive trace that includes a pillar and a routing line to the pad, then inserting the pillar into an opening in a ground plane, and then forming a solder joint that electrically connects the pillar and the ground plane, wherein the ground plane is electrically connected to the pad.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The contact terminal includes a body and a flange that contact the metal pillar and are spaced from the routing line.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a metal filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the metal filler.

Abstract: A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first metal pillar. The second semiconductor chip assembly includes a second chip, a second conductive trace and a second encapsulant, and the second encapsulant includes a second aperture. The first metal pillar extends into the second aperture.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base that includes a metal plate and a metal layer, providing a routing line that contacts the metal layer and an etch mask that contacts the metal plate, providing a semiconductor chip that includes a conductive pad, mechanically attaching the chip to the routing line, electrically connecting the routing line to the pad, and etching the metal base using a first wet chemical that is selective of the metal plate and then a second wet chemical etch that is selective of the metal layer and the etch mask to form a pillar from an unetched portion of the metal base that contacts the routing line.

Abstract: A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically connecting a metal particle to the routing line, wherein the routing line extends laterally beyond the metal particle towards the chip and the chip and the metal particle extend vertically beyond the routing line in the same direction, forming an encapsulant after attaching the chip and the metal particle to the routing line wherein the chip and the metal particle are embedded in the encapsulant, and forming a connection joint that electrically connects the routing line and the pad.

Abstract: A semiconductor package device includes an insulative housing, a semiconductor chip, and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the bottom surface includes a peripheral portion and a central portion within the peripheral portion, the peripheral portion protrudes downwardly from the central portion, the chip includes a conductive pad, and the lead protrudes laterally from and extends through the peripheral side surface and is electrically connected to the pad.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally beyond the metal particle towards the chip, and the chip and the metal particle are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.

Abstract: A semiconductor package device includes an insulative housing, a semiconductor chip and a conductive trace, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the chip includes a conductive pad, the conductive trace includes a routing line, a terminal and a lead, the terminal protrudes downwardly from and extends through the bottom surface and is electrically connected to the pad, the lead protrudes laterally from and extends through the side surface and is electrically connected to the pad, the terminal and the lead are spaced and separated from one another outside the insulative housing, and the terminal and the lead are electrically connected to one another by the routing line inside the insulative housing and outside the chip.

Abstract: A method of making a semiconductor package device includes providing a conductive trace that includes a terminal and a lead, wherein the terminal and the lead are electrically connected to one another, attaching the conductive trace to a semiconductor chip using an insulative adhesive, wherein the chip includes a conductive pad, forming a first insulative housing portion that contacts the chip and the lead without contacting the terminal, wherein the lead protrudes laterally from and extends through the first insulative housing portion, forming a connection joint that contacts and electrically connects the conductive trace and the pad, and forming a second insulative housing portion that contacts the adhesive, the terminal and the first insulative housing portion after forming the first insulative housing portion, wherein the terminal protrudes downwardly from and extends through the second insulative housing portion, and the first and second insulative housing portions form an insulative housing that surroun

Abstract: A method of making a semiconductor package device includes providing an insulative housing, a semiconductor chip, a terminal and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the chip includes a conductive pad, the terminal protrudes downwardly from and extends through the bottom surface, the lead protrudes laterally from and extends through the side surface, the terminal and the lead are spaced and separated from one another outside the insulative housing, and the terminal is electrically connected to the lead and the pad inside the insulative housing and outside the chip, singulating the lead from a lead frame, and trimming the lead without trimming the terminal.

Abstract: A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a metal base, an insulative base, a routing line and an interconnect, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the interconnect extends through a via in the insulative base and electrically connects the metal base and the routing line, forming an opening that extends through the insulative base and exposes the pad, forming a connection joint that electrically connects the routing line and the pad, and etching the metal base such that an unetched portion of the metal base forms a pillar that overlaps and is aligned with the via and contacts the interconnect, wherein a conductive trace includes the routing line, the interconnect and the pillar.

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a conductive trace, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the conductive trace includes a contact terminal that extends through the insulative base, and the pad is exposed through an opening that extends through the metal base and the insulative base and is spaced from the contact terminal, then forming a connection joint that contacts and electrically connects the conductive trace and the pad, and then removing a portion of the metal base that contacts the contact terminal. Preferably, the opening extends through an insulative adhesive that attaches the chip to the conductive trace.